Method of forming an electro-optical device with lateral current injection regions

Patent metadata

Field	Value
Publication number	US-11070029-B2
Application number	US-201916396317-A
Country	US
Kind code	B2
Filing date	Apr 26, 2019
Priority date	Nov 1, 2017
Publication date	Jul 20, 2021
Grant date	Jul 20, 2021

Abstract

Embodiments are directed to the fabrication of an electro-optical device. The device comprises the forming of an active region with a stack of III-V semiconductor gain materials stacked along a stacking direction z. The active region may be formed as a slab having several lateral surface portions, each extending parallel to the stacking direction z. The device further comprises selectively re-growing two paired elements, which include: a pair of doped layers of III-V semiconductor materials (an n-doped layer and a p-doped layer); and a pair of lateral waveguide cores. The two paired elements may be laterally arranged, two-by-two, on opposite sides of the slab. The elements distinctly adjoin respective ones of the lateral surface portions of the slab, so as for these elements to be separated from each other by the slab. The disclosure may be further directed to related silicon photonics devices.

First claim

What is claimed is:

1. A method of fabrication of an electro-optical device, the method comprising: forming an active region of the electro-optical device, said region comprising a stack of III-V semiconductor gain materials stacked along a stacking direction z, the active region formed as a slab having several lateral surface portions, each extending parallel to said stacking direction z; and selectively re-growing two paired elements, including: a pair of doped layers of III-V semiconductor materials, comprising an n-doped layer and a p-doped layer, wherein each of the n-doped layer and the p-doped layer includes a recess, wherein the recess of each of the p-doped layer and the n-doped layer is on a top surface portion thereof, and wherein the recess extends laterally along the slab and parallel to its length, so as for the active region and the contiguous pair of doped layers to have a rib waveguide configuration; and a pair of lateral waveguide cores, so as for the two paired elements to be laterally arranged on opposite sides of the slab, with said elements distinctly adjoining respective ones of the lateral surface portions of the slab, so as to be separated from each other by the slab, wherein: the slab has two pairs of opposite, lateral surface portions, each extending parallel to said stacking direction z, wherein the slab is a form factor, whereby a length of the slab is larger than a width thereof, wherein said width, said length, and said stacking direction z are perpendicular, the p-doped layer and the n-doped layer are arranged on respective sides of the slab, contiguously with the opposite, lateral surface portions of one of said two pairs of surface portions, wherein a maximum length of each of the p-doped layer and the n-doped layer is less than a length of said opposite, lateral surface portions of said one of said two pairs, and the lateral waveguide cores are laterally butt-jointed to the opposite, lateral surface portions of the other one of said two pairs of surface portions.

2. The method of claim 1 , wherein:
each of the p-doped layer and the n-doped layer are tapered, so as to laterally flare towards the slab, at a level of contact therewith.

3. The method of claim 1 , further comprising:
generating, along the recess, a metal contact patterned on a top surface portion of each of the p-doped layer and the n-doped layer.

4. The method of claim 1 , further comprising:
incorporating structured silicon waveguide cores having portions extending underneath said lateral waveguide cores, wherein the electro-optical device is configured as a hybrid lateral current injection device, whereby optical radiation out-coupled from the active region via the lateral waveguide cores couples into the structured silicon waveguide cores, in operation.

5. The method of claim 4 , wherein:
the lateral waveguide cores are tapered, so as to thin down outwardly, and said portions of the structured silicon waveguide cores are reversely tapered.

6. The method of claim 5 , wherein:
the lateral waveguide cores exhibit, each, a three-stage taper.

7. The method of claim 4 , wherein the electro-optical device is a lateral current injection laser device.

8. The method of claim 7 , wherein the laser device is a single mode laser device.

9. The method of claim 7 , wherein:
the structured silicon waveguide cores comprise Bragg mirrors configured so as to provide a radiation feedback for the laser.

10. The method of claim 1 , wherein:
said stack of III-V semiconductor gain materials is selected from the group consisting of: In 1-x-y Al x Ga y As; In 1-x Ga x As y P 1-y ; and In 1-x Ga x As y N 1-y , with 0≤x≤1 and 0≤y≤1−x; and
each of the p-doped layer and the n-doped layer is selected from the group consisting of: InP, InAs or GaAs.

Assignees

• IBM

Inventors

• Caer Charles
• Czornomaz Lukas
• Abel Stefan
• Offrein Bert Jan

Classifications

• H01S5/026 Primary

  Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers (stabilisation of output H01S5/06) · CPC title

• H01S5/0261

  Non-optical elements, e.g. laser driver components, heaters (H01S5/0265 takes precedence) · CPC title

• H01S5/125

  Distributed Bragg reflector [DBR] lasers · CPC title

• H01S5/227

  Buried mesa structure {; Striped active layer} · CPC title

• G02B2006/12097

  Ridge, rib or the like · CPC title