Computational metrology

Patent metadata

Field	Value
Publication number	US-11067902-B2
Application number	US-201816635584-A
Country	US
Kind code	B2
Filing date	Jul 11, 2018
Priority date	Aug 7, 2017
Publication date	Jul 20, 2021
Grant date	Jul 20, 2021

Abstract

A method includes obtaining, for each particular feature of a plurality of features of a device pattern of a substrate being created using a patterning process, a modelled or simulated relation of a parameter of the patterning process between a measurement target for the substrate and the particular feature; and based on the relation and measured values of the parameter from the metrology target, generating a distribution of the parameter across at least part of the substrate for each of the features, the distribution for use in design, control or modification of the patterning process.

First claim

What is claimed is:

1. A method, comprising:
obtaining, for each geometric or pattern layout feature of a plurality of geometric or pattern layout features of a pattern for forming a functional device in or on a substrate using a patterning process, a modelled or simulated relation of a parameter of the patterning process between a metrology target for the substrate and the feature;
based on the relation and measured values of the parameter from the metrology target, generating, by a hardware computer, a distribution of the parameter across at least part of the substrate for each feature of the plurality of features; and
analyzing the distributions in combination with actual or expected behavior of at least part of the patterning process to identify one or more features of the plurality of features as a critical feature.

2. The method of claim 1 , wherein the generating the distribution is further based on measured values of the parameter from the features themselves.

3. The method of claim 2 , wherein the relation is determined using the measured values of the parameters from the features themselves.

4. The method of claim 2 , wherein the measured values of the parameter from the features themselves and/or the measured values of the parameter from the metrology target are based on measurements performed by at least two different types of metrology tools.

5. The method of claim 4 , wherein each type of metrology tool is configured to measure a different parameter of the patterning process.

6. The method of claim 4 , wherein each type of metrology tool is configured to measure the parameter of the patterning process at a different spatial scale.

7. The method of claim 4 , wherein at least one type of metrology tool is an e-beam tool.

8. The method of claim 4 , wherein at least one type of metrology tool is a tool based on scatterometry.

9. The method of claim 1 , further comprising generating one or more weights to weight a distribution of one of the features differently than the distribution of another one of the features.

10. The method of claim 1 , wherein the distributions have a greater density of parameter information than the measured values of the parameter from the metrology target.

11. The method of claim 1 , wherein at least one of the distributions is associated with one or more fields or dies on the substrate.

12. The method of claim 1 , further comprising generating a correction to at least part of the patterning process based on the distributions of the parameter.

13. The method of claim 1 , wherein the parameter of the patterning process comprises overlay and/or edge placement error.

14. The method of claim 1 , wherein the parameter of the patterning process comprises focus, the metrology target comprises a focus target, and the relation is obtained by combining measured or simulated aberration sensitivity of focus for the metrology target and the features with measured or modeled aberration of the patterning process, to determine a map of difference in focus between the metrology target and the features.

15. A computer program product comprising a non-transitory computer readable medium having instructions therein, the instructions, upon execution by a computer system, configured to cause the computer system to at least:
obtain, for each geometric or pattern layout feature of a plurality of geometric or pattern layout features of a pattern for forming a functional device in or on € 4 a substrate using a patterning process, a modelled or simulated relation of a parameter of the patterning process between a metrology target for the substrate and the feature;
based on the relation and measured values of the parameter from the metrology target, generate a distribution of the parameter across at least part of the substrate for each feature of the plurality of features; and
analyze the distributions in combination with actual or expected behavior of at least part of the patterning process to identify one or more features of the plurality of features as a critical feature.

16. The computer program product of claim 15 , wherein the instructions configured to generate the distribution are further configured to generate the distribution based on measured values of the parameter from the features themselves.

17. The computer program product of claim 16 , wherein the relation is determined using the measured values of the parameters from the features themselves.

18. The computer program product of claim 15 , wherein the instructions are further configured to cause the computer system to generate one or more weights to weight a distribution of one of the features differently than the distribution of another one of the features.

19. The computer program product of claim 15 , wherein the distributions have a greater density of parameter information than the measured values of the parameter from the metrology target.

20. The computer program product of claim 15 , wherein the instructions are further configured to cause the computer system to generate a correction to at least part of the patterning process based on the distributions of the parameter.

Assignees

• Asml Netherlands Bv

Inventors

• Warnaar Patrick
• Tinnemans Patricius Aloysius Jacobus
• Grzela Grzegorz
• Mos Everhardus Cornelis
• Tel Wim Tjibbo
• Jochemsen Marinus
• Segers Bart Peter Bert
• Staals Frank

Classifications

• G03F7/70508

  Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus · CPC title

• G03F7/70655

  Non-optical, e.g. atomic force microscope [AFM] or critical dimension scanning electron microscope [CD-SEM] · CPC title

• G03F7/706843

  Metrology apparatus · CPC title

• G03F7/706

  Aberration measurement · CPC title

• G03F7/70683

  Mark designs · CPC title