Coated film removing apparatus

Patent metadata

Field	Value
Publication number	US-11062899-B2
Application number	US-201815876283-A
Country	US
Kind code	B2
Filing date	Jan 22, 2018
Priority date	Jan 26, 2017
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

There is provided a coated film removing apparatus for removing, with a removal liquid, a peripheral portion of a coated film formed by supplying a coating liquid to a surface of a circular substrate, including: a rotary holding part configured to hold the substrate and rotate together with the substrate; a removal liquid nozzle configured to discharge the removal liquid on a peripheral portion of the surface of the substrate held by the rotary holding part so that the removal liquid is oriented toward a downstream side in a rotational direction of the substrate; and a control part configured to output a control signal so as to rotate the substrate at a rotation speed of 2,300 rpm or more when discharging the removal liquid.

First claim

What is claimed is:

1. A coated film removing apparatus for removing, with a removal liquid, a peripheral portion of a coated film formed by supplying a coating liquid to a surface of a circular substrate, comprising:
a spin chuck configured to hold the substrate and rotate together with the substrate;
a removal liquid nozzle including a discharge port and configured to discharge the removal liquid on a peripheral portion of the surface of the substrate held by the spin chuck toward a predetermined direction from the discharge port so that the removal liquid discharged from the discharge port is oriented toward a downstream side in a rotational direction of the substrate; and
a controller configured to output a control signal for executing:
a first step of discharging the removal liquid from the removal liquid nozzle on the peripheral portion while moving a supply position of the removal liquid from a peripheral edge position of the surface of the substrate to a cutting position, which is between a center of the substrate and the peripheral edge position, in a state in which the substrate is rotated at a first rotation speed of 2,300 rpm or more by the spin chuck; and
a second step of allowing the supply position to move away from the cutting position toward a peripheral edge of the substrate within 1 second after the supply position reaches the cutting position.

2. The apparatus of claim 1 , wherein the controller is configured to output the control signal for executing:
a step of, after the second step, setting the supply position to a position between the cutting position and the peripheral edge position or to the peripheral edge position, and discharging the removal liquid from the removal liquid nozzle while rotating the substrate at a second rotation speed lower than the first rotation speed.

3. The apparatus of claim 2 , wherein the second rotation speed is set to 500 to 2,000 rpm.

4. The apparatus of claim 1 , wherein the controller is configured to output the control signal for repeating the first step and the second step a multiple number of times.

5. The apparatus of claim 1 , wherein the removal liquid nozzle is further configured such that the removal liquid is discharged toward the predetermined direction from the discharge port to the supply position of the removal liquid on the peripheral portion of the surface of the substrate, and an angle formed by the predetermined direction and a tangent line of the substrate at the supply position when viewed in a plan view is 0 degrees or more and less than 5 degrees.

6. The apparatus of claim 1 , wherein an angle formed by a straight line connecting the removal liquid nozzle and the supply position of the removal liquid on the surface of the substrate and the surface of the substrate when viewed in a vertical plane is set to 20 degrees or less.

7. The apparatus of claim 1 , wherein a diameter of the discharge port is set to 0.15 to 0.25 mm.

8. The apparatus of claim 1 , wherein a discharge flow rate of the removal liquid when the supply position of the removal liquid on the surface of the substrate moves from the peripheral portion to the cutting position is set to 55 ml/min or more.

Assignees

• Tokyo Electron Ltd

Inventors

• Hasimoto Takafumi
• Tadokoro Masahide
• Nagakane Taku
• Takayanagi Koji

Classifications

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/54 Primary

  Cleaning of wafer edges · CPC title

• H10P50/28

  of insulating materials · CPC title