Receptacle assembly and thermal-transfer assembly

Patent metadata

Field	Value
Publication number	US-11058033-B2
Application number	US-201916581796-A
Country	US
Kind code	B2
Filing date	Sep 25, 2019
Priority date	Jan 23, 2018
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

Receptacle assembly includes a receptacle cage and a thermal-transfer module that is coupled to a thermal side of the receptacle cage. The thermal-transfer module has a base portion and a plurality of heat-transfer fins coupled to the base portion. The thermal-transfer module is configured to absorb thermal energy from a pluggable transceiver in the receptacle cage and transfer the thermal energy through the base portion and to the heat-transfer fins. The receptacle assembly also includes a retention clip configured to hold the thermal-transfer module to the receptacle cage. The retention clip includes a resilient beam that extends across the thermal-transfer module. The resilient beam directly engages at least some of the heat-transfer fins and applies a resilient force against the heat-transfer fins.

First claim

What is claimed is:

1. A receptacle assembly comprising:
a receptacle cage having a front end and a receiving cavity that opens to the front end, the receiving cavity being sized and shaped to receive a pluggable transceiver;
a thermal-transfer module being coupled to a side of the receptacle cage, the thermal-transfer module having a base portion and a plurality of heat-transfer fins coupled to the base portion; and
a retention clip configured to directly engage and hold the thermal-transfer module to the receptacle cage; and
wherein the thermal-transfer module is configured to absorb thermal energy from the pluggable transceiver and transfer the thermal energy through the base portion and to the heat-transfer fins, wherein the heat-transfer fins of said plurality have a thickness that is at most 0.40 mm;
wherein the receptacle cage includes an opening that permits the base portion of the thermal-transfer module to directly engage the pluggable transceiver, the base portion being configured to be displaced by the pluggable transceiver as the pluggable transceiver is inserted into the receptacle cavity, the heat-transfer fins moving with the base portion when the base portion is displaced.

2. The receptacle assembly of claim 1 , wherein each of the heat-transfer fins of said plurality includes at least one elongated indentation along at least a section of the corresponding heat-transfer fin, the elongated indentations extending lengthwise away from the base portion and being configured to resist deformation of the corresponding heat-transfer fins of a force that is directed toward the base portion.

3. The receptacle assembly of claim 1 , wherein the heat-transfer fins include an upright section that extends away from the receptacle cage and a folded section that extends transverse to the upright section.

4. The receptacle assembly of claim 3 , wherein, for at least a series of the heat-transfer fins, the folded section for each of the heat-transfer fins in the series interlocks with one or more of the other heat-transfer fins in the series.

5. The receptacle assembly of claim 4 , wherein the folded section for each of the heat-transfer fins in the series interlocks with an adjacent heat-transfer fin in the series.

6. The receptacle assembly of claim 4 , wherein the folded section of each of the heat-transfer fins in the series includes a key extension that extends transverse to the upright section and a key projection that extends away from the base portion, the key extensions and the key projections interlocking with one another.

7. The receptacle assembly of claim 3 , wherein the plurality of heat-transfer fins include a series of the heat-transfer fins, the folded section for at least one of the heat-transfer fins in the series having an outer edge that abuts one of the other heat-transfer fins in the series and an inner edge that abuts another of the heat-transfer fins in the series.

8. The receptacle assembly of claim 1 , wherein the heat-transfer fins are stamped-and-formed heat-transfer fins.

9. The receptacle assembly of claim 1 , wherein the heat-transfer fins are skived heat-transfer slices.

10. The receptacle assembly of claim 1 , wherein the heat-transfer fins have a thickness that is at most 0.30 mm.

11. The receptacle assembly of claim 1 , wherein the heat-transfer fins have corresponding fin heights that extend from the base portion to corresponding distal surfaces, the distal surfaces being shaped to form depressed segments and elevated segments, the fin height along the elevated segment being greater than the fin height along the depressed segment.

12. The receptacle assembly of claim 11 , wherein the depressed segments collectively form a valley of the thermal-transfer module.

13. A thermal-transfer assembly comprising:
a thermal-transfer module configured to be coupled to a device, the thermal-transfer module having a base portion and a plurality of heat-transfer fins coupled to the base portion; and
a retention clip configured to directly engage and hold the thermal-transfer module to the device; and
wherein the thermal-transfer module is configured to absorb thermal energy from the device and transfer the thermal energy through the base portion and to the heat-transfer fins, wherein the heat-transfer fins of said plurality have a thickness that is at most 0.40 mm;
wherein the base portion has an engagement surface that is configured to directly engage the device, wherein each of the heat-transfer fins includes at least one elongated indentation along at least a section of the corresponding heat-transfer fin, the elongated indentations extending lengthwise away from the base portion and being configured to resist deformation of the corresponding heat-transfer fins from a force that is directed toward the base portion.

14. The thermal-transfer assembly of claim 13 , wherein the heat-transfer fins include an upright section that extends away from the receptacle cage and a folded section that extends transverse to the upright section.

15. The thermal-transfer assembly of claim 14 , wherein, for at least a series of the heat-transfer fins, the folded section for each of the heat-transfer fins in the series interlocks with one or more of the other heat-transfer fins in the series.

16. The thermal-transfer assembly of claim 13 , wherein the heat-transfer fins are stamped-and-formed heat-transfer fins.

17. The thermal-transfer assembly of claim 13 , wherein the heat-transfer fins are skived heat-transfer slices.

18. The thermal-transfer assembly of claim 13 , wherein the heat-transfer fins have a thickness that is at most 0.30 mm.

19. A thermal-transfer assembly comprising:
a thermal-transfer module configured to be coupled to a device, the thermal-transfer module having a base portion and a plurality of heat-transfer fins coupled to the base portion; and
a retention clip configured to directly engage and hold the thermal-transfer module to the device; and
wherein the thermal-transfer module is configured to absorb thermal energy from the device and transfer the thermal energy through the base portion and to the heat-transfer fins, wherein the heat-transfer fins of said plurality have a thickness that is at most 0.40 mm;
wherein the heat-transfer fins have corresponding fin heights that extend from the base portion to corresponding distal surfaces, the distal surfaces, for at least a series of the heat-transfer fins of said plurality, being shaped to form depressed segments and elevated segments, the fin height along the elevated segment being greater than the fin height along the depressed segment; and
wherein, for at least the series of the heat-transfer fins, each of the depressed segments includes a folded section that extends toward and interlocks with one or more of the other heat-transfer fins in the series, the folded sections of the depressed segments collectively forming a valley of the thermal-transfer module.

20. The thermal-transfer assembly of claim 19 , wherein the heat-transfer fins of said plurality have an average thickness of at most 0.30 mm.

Assignees

• Te Connectivity Corp
• Tyco Electronics Shanghai Co Ltd

Inventors

• Han Hongqiang
• Jin Jiwang
• Liu Wenyu
• Shankar Nikhil
• Sharf Alex Michael
• Wang Chenxi

Classifications

• G02B6/4269 Primary

  with heat sinks or radiation fins · CPC title

• H01R13/502 Primary

  composed of different pieces (H01R13/514 takes precedence) · CPC title

• H04B10/40

  Transceivers · CPC title

• F28F2275/085

  with snap connection · CPC title

• H05K7/20154

  Heat dissipaters coupled to components · CPC title