Connector system with thermal surface

Patent metadata

Field	Value
Publication number	US-9882297-B2
Application number	US-201414392106-A
Country	US
Kind code	B2
Filing date	Apr 24, 2014
Priority date	Apr 24, 2013
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

A module can be configured to mate with a receptacle. The module includes a body with a thermal surface that is coupled to thermally active circuitry supported by the body. The receptacle is configured to allow air to flow over the thermal surface so as to dissipate thermal energy from the circuitry.

First claim

I claim:

1. A plug connector, comprising:
a body having a mating face at a mating end, the body being elongated and extending in a first direction that is parallel with an insertion direction, the body having a thermal surface on a first side, the thermal surface having grooves that extend along the first side toward the mating end;
a paddle card positioned in the body and extending from the thermal surface to a position adjacent the mating face; and
circuitry positioned in the body, the circuitry configured to emit at least 1 watt of thermal energy, the circuitry thermally connected to the thermal surface, wherein the thermal surface includes at least 50% more surface area than a corresponding flat surface;
wherein the grooves are formed by fins.

2. The connector of claim 1 , wherein the body has a height that is a first distance and the thermal surface extends above the first side a second distance that is at least half the first distance.

3. The plug connector of claim 1 , wherein the paddle card is a first paddle card, the body further supporting a second paddle card.

4. A receptacle connector, comprising:
a housing with a card slot in a front face, the card slot having a first side and a second side, the housing supporting a plurality of terminals, wherein some of the terminals are positioned on the first side and others of the terminals are positioned on the second side; and
a cage defining a port, the cage having a front edge and a rear wall, the cage positioned around the housing so that the housing is adjacent the rear wall, the port extending from the front edge to the housing, the port having a port inlet at the front edge having a first inner perimeter and a module inlet with a second inner perimeter adjacent the housing, the port transitioning from the first inner perimeter to the second inner perimeter at a location between the front edge and the front face, the second inner perimeter being smaller than the first inner perimeter.

5. The receptacle connector of claim 4 , wherein the port further includes an electromagnetic interference (EMI) gasket positioned in the module inlet, the EMI gasket configured, in operation, to engage a perimeter of an inserted plug connector so as to help reduce EMI.

6. The receptacle connector of claim 4 , wherein the port includes a vent wall that extends between the first inner perimeter and the second inner perimeter, the vent wall being configured so as to allow air that flows in through the inlet to flow out through the vent wall.

7. The receptacle connector of claim 6 , wherein the vent wall includes a plurality of apertures.

8. A connector system, comprising;
a housing with a card slot in a front face, the card slot having a first side and a second side, the housing supporting a plurality of terminals, wherein some of the terminals are positioned on the first side and others of the terminals are positioned on the second side; and
a cage defining a port, the cage having a front edge and a rear wall, the cage positioned around the housing so that the housing is adjacent the rear wall, the port extending from the front edge to the housing, the port having a port inlet at the front edge having a first inner perimeter and a module inlet with a second inner perimeter adjacent the housing, the port transitioning from the first inner perimeter to the second inner perimeter at a location between the front edge and the front face, the second inner perimeter being smaller than the first inner perimeter, the cage including a vent wall with apertures; and
a module including a body having a mating face, the body having a thermal surface on a first side, the module having a paddle card positioned in the body and extending from the thermal surface to a position adjacent the mating face and circuitry positioned in the body, the circuitry configured to emit at least 1 watt of thermal energy, the circuitry thermally connected to the thermal surface, wherein the thermal surface is aligned between the front edge and the vent wall.

9. A method of cooling a module, comprising:
providing a receptacle in an enclosure, the receptacle defining a port with a port inlet;
positioning a module in the port, the module including a thermal surface; and
creating an air pressure differential between an exterior and an interior of the enclosure,
wherein air flowing between the exterior and the interior due to the pressure differential is directed through the port and along the thermal surface, the air flowing through the port conducting thermal energy directly away from the thermal surface, wherein the thermal surface has grooves that extend along the first side in a direction parallel to that of entering the port via the port inlet;
wherein the grooves are formed by fins.

10. The method of claim 9 , wherein the thermal surface has a uniform profile that extends across a top surface of the module.

11. The method of claim 9 , wherein the thermal surface has a surface area that is at least 1.5 times more than a flat surface.

12. The method of claim 9 , wherein the thermal surface includes fins which form the grooves.

13. The method of claim 12 , wherein the receptacle includes a vent wall with a plurality of apertures and the air flowing between the exterior and the interior passes through the plurality of apertures.

14. The method of claim 9 , wherein the enclosure is a cage and the air flowing through the cage travels between the port inlet and a plurality of apertures in the cage.

15. The method of claim 14 , wherein the created air pressure differential allows air to pass along the fins while traveling between the port inlet and the plurality of apertures.

Assignees

• Molex Inc
• Regnier Kent E
• Molex Llc

Inventors

• Regnier Kent E

Classifications

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• H01R13/6583

  with separate conductive resilient members between mating shield members · CPC title

• H01R12/724

  containing contact members forming a right angle · CPC title

• H01R13/6691

  with built-in signalling means (H01R13/717 takes precedence) · CPC title