Receptacle assembly and thermal-transfer assembly

US10477729B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10477729-B2
Application numberUS-201815959973-A
CountryUS
Kind codeB2
Filing dateApr 23, 2018
Priority dateJan 23, 2018
Publication dateNov 12, 2019
Grant dateNov 12, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Receptacle assembly includes a receptacle cage and a thermal-transfer module that is coupled to a thermal side of the receptacle cage. The thermal-transfer module has a base portion and a plurality of heat-transfer fins coupled to the base portion. The thermal-transfer module is configured to absorb thermal energy from a pluggable transceiver in the receptacle cage and transfer the thermal energy through the base portion and to the heat-transfer fins. The receptacle assembly also includes a retention clip configured to hold the thermal-transfer module to the receptacle cage. The retention clip includes a resilient beam that extends across the thermal-transfer module. The resilient beam directly engages at least some of the heat-transfer fins and applies a resilient force against the heat-transfer fins.

First claim

Opening claim text (preview).

What is claimed is: 1. A receptacle assembly comprising: a receptacle cage having a front end and a receiving cavity that opens to the front end, the receiving cavity being sized and shaped to receive a pluggable transceiver; a thermal-transfer module being coupled to a side of the receptacle cage, the thermal-transfer module having a base portion and a plurality of heat-transfer fins coupled to the base portion, the thermal-transfer module configured to absorb thermal energy from the pluggable transceiver and transfer the thermal energy through the base portion and to the heat-transfer fins, the heat-transfer fins having corresponding fin heights that extend between the base portion and a corresponding distal surface; and a retention clip configured to hold the thermal-transfer module to the receptacle cage, the retention clip including a resilient beam that extends across the thermal-transfer module, the resilient beam directly engaging at least some of the heat-transfer fins and applying a resilient force against the heat-transfer fins in a direction from the distal surfaces to the receptacle cage. 2. The receptacle assembly of claim 1 , wherein each of the heat-transfer fins have respective thicknesses that are of said plurality has a thickness that is at most 0.40 mm. 3. The receptacle assembly of claim 1 , wherein the distal surfaces of the heat-transfer fins are shaped to form depressed segments and elevated segments, the fin height along the elevated segment being greater than the fin height along the depressed segment, the depressed segments collectively forming a valley of the thermal-transfer module, the resilient beam extending through the valley. 4. The receptacle assembly of claim 1 , wherein the resilient beam directly engages the distal surfaces and applies the resilient force to the distal surfaces. 5. The receptacle assembly of claim 1 , wherein the heat-transfer fins include an upright section that extends away from the receptacle cage and a folded section that extends transverse to the upright section, the folded section including at least a portion of the distal surface, wherein the resilient force is applied to the folded sections of the heat-transfer fins. 6. The receptacle assembly of claim 5 , wherein the folded section of at least one heat-transfer fins interlocks with one or more of the nearby heat-transfer fins, the nearby heat-transfer fins being at most three positions away from the heat-transfer fin with the folded section. 7. The receptacle assembly of claim 6 , wherein, for at least a series of the heat-transfer fins, the folded section for each of the heat-transfer fins in the series interlocks with one or more of the nearby heat-transfer fins in the series, the folded sections being aligned with one another, the resilient beam extending over the folded sections. 8. The receptacle assembly of claim 1 , wherein the heat-transfer fins include ribs that extend from the base portion toward the distal surfaces, the ribs resisting deformation of the heat-transfer fins caused by the resilient force. 9. A thermal-transfer assembly comprising: a thermal-transfer module configured to be coupled to a device, the thermal-transfer module having a base portion and a plurality of heat-transfer fins coupled to the base portion, the thermal-transfer module configured to absorb thermal energy from the device and transfer the thermal energy from the device, through the base portion, and to the heat-transfer fins, the heat-transfer fins having corresponding heights that extend from the base portion to corresponding distal surfaces; and a retention clip configured to hold the thermal-transfer module to the device, the retention clip including a resilient beam that extends across the thermal-transfer module, the resilient beam directly engaging at least some of the heat-transfer fins and applying a resilient force against the heat-transfer fins in a direction from the distal surfaces to the device. 10. The thermal-transfer assembly of claim 9 , wherein the heat-transfer fins have a thickness that is at most 0.40 mm. 11. The thermal-transfer assembly of claim 9 , wherein the distal surfaces of the heat-transfer fins form depressed segments and elevated segments, the fin height along the elevated segment being greater than the fin height along the depressed segment, the depressed segments of the plurality of heat-transfer fins collectively forming a valley of the thermal-transfer module, the resilient beam extending through the valley. 12. The thermal-transfer assembly of claim 9 , wherein the resilient beam is configured to directly engage the distal surfaces and apply the resilient force to the distal surfaces. 13. The thermal-transfer assembly of claim 9 , wherein the heat-transfer fins include an upright section that extends away from the device and a folded section that extends transverse to the upright section, the folded section including at least a portion of the distal surface, wherein the resilient force is applied to the folded sections of the heat-transfer fins. 14. The thermal-transfer assembly of claim 9 , wherein the heat-transfer fins include ribs that extend from the base portion toward the distal surfaces, the ribs resisting deformation of the heat-transfer fins caused by the resilient force. 15. The thermal-transfer assembly of claim 9 , further comprising a thermal-transfer bridge, the thermal-transfer bridge conducting thermal energy to or from the thermal-transfer module. 16. A receptacle assembly comprising: a receptacle cage having a front end and a receiving cavity that opens to the front end, the receiving cavity being sized and shaped to receive a pluggable transceiver; a thermal-transfer module being coupled to a side of the receptacle cage, the thermal-transfer module having a base portion and a plurality of heat-transfer fins coupled to the base portion, the thermal-transfer module configured to absorb thermal energy from the pluggable transceiver and transfer the thermal energy from the receiving cavity, through the base portion, and to the heat-transfer fins, the heat-transfer fins having corresponding heights that extend from the base portion to corresponding distal surfaces, wherein at least some of the heat-transfer fins include an upright section that extends away from the receptacle cage and a folded section that extends transverse to the upright section; and a retention clip configured to hold the thermal-transfer module to the receptacle cage, the retention clip including a resilient beam that extends across the thermal-transfer module, the resilient beam applying a resilient force against the thermal-transfer module to the receptacle cage. 17. The receptacle assembly of claim 16 , wherein the folded section of at least one heat-transfer fin interlocks with one or more of the nearby heat-transfer fins. 18. The receptacle assembly of claim 17 , wherein, for at least a series of the heat-transfer fins, the folded section for each of the heat-transfer fins in the series interlocks with the one or more nearby beat-transfer fins in the series, the folded sections being aligned with one another, the resilient beam extending over the folded sections. 19. The receptacle assembly of claim 16 , wherein the heat-transfer fins include ribs that extend from the base portion toward the distal surfaces, the ribs resisting deformation of the heat-transfer fins. 20. The receptacle assembly of claim 16 , wherein each of the heat-transfer fins of said plurality has a thickness that is at most 0.40

Assignees

Inventors

Classifications

  • G02B6/4269Primary

    with heat sinks or radiation fins · CPC title

  • Transceivers · CPC title

  • characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

  • H01R13/502Primary

    composed of different pieces (H01R13/514 takes precedence) · CPC title

  • comprising clamping or extracting means (H05K7/10 takes precedence) · CPC title

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Frequently asked questions

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What does patent US10477729B2 cover?
Receptacle assembly includes a receptacle cage and a thermal-transfer module that is coupled to a thermal side of the receptacle cage. The thermal-transfer module has a base portion and a plurality of heat-transfer fins coupled to the base portion. The thermal-transfer module is configured to absorb thermal energy from a pluggable transceiver in the receptacle cage and transfer the thermal ener…
Who is the assignee on this patent?
Te Connectivity Corp, Tyco Electronics Shanghai Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02B6/4269. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).