Facet mirror for use in a projection exposure apparatus for microlithography
US-2016313646-A1 · Oct 27, 2016 · US
US11054745B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11054745-B2 |
| Application number | US-201916664478-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 25, 2019 |
| Priority date | Apr 26, 2017 |
| Publication date | Jul 6, 2021 |
| Grant date | Jul 6, 2021 |
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A catoptric system having a reference axis and including a reflective pattern-source (carrying a substantially one-dimensional pattern) and a combination of only three optical components disposed sequentially to transfer EUV radiation incident the first optical component onto the pattern-source. The combination is disposed in a fixed spatial and optical relationship with respect to the pattern-source, and represents an illumination unit (IU) of a 1D EUV exposure tool that additionally includes a projection optic sub-system configured to form an optical image of the pattern-source on an image plane with the use of only two beams of radiation. These only two beams of radiation originate at the pattern-source from the EUV radiation transferred onto the pattern-source.
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What is claimed is: 1. A catoptric system for use with a reflective pattern-source carrying a substantially one-dimensional pattern thereon, the system comprising: illumination mirrors disposed between an EUV radiation source and the reflective pattern-source, the illumination mirrors situated to direct EUV radiation from the EUV radiation source to the reflective pattern-source; and projection mirrors disposed between the reflective pattern-source and a workpiece, the projection mirrors situated to direct diffracted beams caused by irradiating the reflective pattern-source with the EUV radiation to the workpiece, wherein a last mirror closest to the reflection pattern-source among the illumination mirrors has a first dimension along a period direction of the substantially one-dimensional pattern and a second dimension along a direction that is perpendicular to the period direction, wherein the second dimension is greater than the first dimension. 2. The catoptric system of claim 1 , wherein the last mirror is disposed between the reflective pattern-source and the workpiece. 3. The catoptric system of claim 2 , wherein the last mirror is disposed between optical paths of the diffracted beams. 4. The catoptric system of claim 3 , wherein the projection mirrors define a projection optical axis, and wherein the last mirror is disposed on the projection optical axis. 5. The catoptric system of claim 1 , wherein the last mirror has convex sides. 6. The catoptric system of claim 1 , wherein the last mirror has a leaf shape. 7. The catoptric system of claim 1 , wherein radiation from the last mirror is incident perpendicularly to the reflective pattern-source. 8. The catoptric system of claim 1 , wherein the last mirror includes a mirror array. 9. The catoptric system of claim 8 , wherein the projection mirrors constitute projection optics, and wherein an entrance pupil of the projection optics corresponds to the last mirror. 10. The catoptric system of claim 1 , wherein the projection mirrors are situated to form a fringe pattern. 11. A lithographic exposure tool, comprising: the catoptric system of claim 10 ; and workpiece stage configured to retain the workpiece and move the workpiece along a scanning direction. 12. The lithographic exposure tool of claim 11 , wherein the scanning direction is perpendicular to the period direction of the fringe pattern. 13. The lithographic exposure tool of claim 12 , wherein the fringe pattern is spatially fixed with respect to the projection mirrors. 14. The lithographic exposure tool of claim 13 , wherein the workpiece is configured to be movable with respect to the spatially fixed fringe pattern. 15. The lithographic exposure tool of claim 11 , wherein the fringe pattern is formed at a location that is optically conjugate point to the reflective pattern-source. 16. The lithographic exposure tool of claim 11 , wherein the reflective pattern-source is configured to remain spatially fixed while the workpiece stage moves. 17. A method for forming a fringe pattern onto a workpiece, the method comprising: generating EUV radiation; directing the EUV radiation to a reflective pattern-source defining a one-dimensional pattern via illumination mirrors; directing diffracted beams from the reflective pattern-source to the workpiece in response to the EUV radiation directed to the reflective pattern-source; and forming the fringe pattern with the diffracted beams, wherein a last mirror closest to the reflective pattern-source among the illumination mirrors has a first dimension along a period direction of the one-dimensional pattern and a second dimension along a direction perpendicular to the period direction, wherein the first dimension is less than the second dimension. 18. A microdevice manufacturing method, comprising: preparing a workpiece; forming a fringe pattern on a surface of the workpiece using the method of claim 17 ; and processing the workpiece.
off-axis or unobscured systems in which not all of the mirrors share a common axis of rotational symmetry, e.g. at least one of the mirrors is warped, tilted or decentered with respect to the other elements · CPC title
characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used · CPC title
specially adapted for the UV · CPC title
characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light · CPC title
using three curved mirrors (G02B17/0668, G02B17/0694 take precedence) · CPC title
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