Integrated circuit package apparatus deployed with antenna and method for manufacturing integrated circuit package apparatus

Patent metadata

Field	Value
Publication number	US-11049823-B2
Application number	US-201816185869-A
Country	US
Kind code	B2
Filing date	Nov 9, 2018
Priority date	May 13, 2016
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

An integrated circuit package apparatus deployed with an antenna and a method for manufacturing an integrated circuit package apparatus, where the integrated circuit package apparatus includes a package substrate, an antenna, a chip, and a connection circuit. The package substrate includes at least one ground plane, the antenna is deployed on an external surface of one side of the package substrate and is located on one side of the at least one ground plane, the chip and the connection circuit are deployed on the other side of the at least one ground plane, where the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and the antenna is coupled to the chip using the connection circuit and a first metal through hole in a thickness direction of the package substrate.

First claim

What is claimed is:

1. An integrated circuit package apparatus, comprising:
an antenna;
a package substrate comprising at least one ground plane, wherein the package substrate comprises a plurality of conductive layers and a plurality of insulation layers that are alternately bonded together, wherein at least one conductive layer of the plurality of conductive layers is grounded to form the at least one ground plane, wherein the antenna is deployed on an external surface of a first side of the package substrate, and wherein the antenna is located on one side of the at least one ground plane;
a chip, wherein a projection of the entire antenna extends in a two dimensional (2D) view towards the chip in a thickness direction entirely encompassing the chip in the 2D view; and
a connection circuit, wherein the chip and the connection circuit are deployed on a second side of the at least one ground plane and are deployed inside the package substrate, wherein the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and wherein the antenna is coupled to the chip using the connection circuit, and wherein an outer edge of the antenna is physically coupled to the chip using a first metal through hole in the thickness direction of the package substrate.

2. The integrated circuit package apparatus of claim 1 , wherein an anti-pad is deployed around the first metal through hole on each of the at least one ground plane, wherein the anti-pad encircles the first metal through hole, wherein the anti-pad is configured to form a gap between the at least one ground plane and the first metal through hole, and wherein the at least one ground plane is insulated from the first metal through hole.

3. The integrated circuit package apparatus of claim 2 , wherein the at least one ground plane comprises a plurality of ground planes, and wherein two adjacent ground planes in the plurality of ground planes are coupled using a second metal through hole in the thickness direction of the package substrate.

4. The integrated circuit package apparatus of claim 1 , wherein a ground clad copper is deployed on the external surface of the first side of the package substrate, and wherein a space exists between the ground clad copper and the antenna.

5. The integrated circuit package apparatus of claim 1 , wherein projection areas of the antenna, the chip, and the connection circuit in the thickness direction of the package substrate are located inside the at least one ground plane.

6. The integrated circuit package apparatus of claim 1 , wherein the at least one ground plane comprises a plurality of ground planes.

7. The integrated circuit package apparatus of claim 1 , wherein the integrated circuit package apparatus does not include a plastic package body.

8. An apparatus, comprising:
an antenna;
a package substrate comprising at least one ground plane, wherein the package substrate comprises a plurality of conductive layers and a plurality of insulation layers that are alternately bonded together, wherein at least one conductive layer of the plurality of conductive layers is grounded to form the at least one ground plane, wherein the antenna is deployed on an external surface of a first side of the package substrate, and wherein the antenna is located on one side of the at least one ground plane;
a chip, wherein a projection of the entire antenna extends in a two dimensional (2D) view towards the chip in a thickness direction entirely encompassing the chip in the 2D view; and
a connection circuit, wherein the chip and the connection circuit are deployed on a second side of the at least one ground plane and are deployed inside the package substrate, wherein the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and wherein the antenna is coupled to the chip using the connection circuit, and wherein an outer edge of the antenna is physically coupled to the chip using a first metal through hole.

9. The apparatus of claim 8 , wherein an anti-pad is deployed around the first metal through hole on each of the at least one ground plane, wherein the anti-pad encircles the first metal through hole, wherein the anti-pad is configured to form a gap between the at least one ground plane and the first metal through hole, and wherein the at least one ground plane is insulated from the first metal through hole.

10. The apparatus of claim 9 , wherein the at least one ground plane comprises a plurality of ground planes, and wherein two adjacent ground planes in the plurality of ground planes are coupled using a second metal through hole in the thickness direction of the package substrate.

11. The apparatus of claim 8 , wherein a ground clad copper is deployed on the external surface of the first side of the package substrate, and wherein a space exists between the ground clad copper and the antenna.

12. The apparatus of claim 8 , wherein projection areas of the antenna, the chip, and the connection circuit in the thickness direction of the package substrate are located inside the at least one ground plane.

13. The apparatus of claim 8 , wherein the apparatus does not include a plastic package body.

14. The apparatus of claim 8 , wherein an anti-pad encircles the first metal through hole.

15. An apparatus, comprising:
an antenna;
a package substrate comprising at least one ground plane, wherein the package substrate comprises a plurality of conductive layers and a plurality of insulation layers that are alternately bonded together, wherein at least one conductive layer of the plurality of conductive layers is grounded to form the at least one ground plane, wherein the antenna is deployed on an external surface of a first side of the package substrate, and wherein the antenna is located on one side of the at least one ground plane;
a non-antenna circuit, comprising:
a chip, wherein a projection of the entire antenna extends in a two dimensional (2D) view towards the chip in a thickness direction entirely encompassing the chip in the 2D view; and
a connection circuit, wherein the non-antenna circuit is deployed on a second side of the at least one ground plane and is deployed inside the package substrate, wherein the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and wherein the antenna is coupled to the chip using the connection circuit, and wherein an outer edge of the antenna is physically coupled to the chip using a first metal through hole in the thickness direction.

16. The apparatus of claim 15 , wherein an anti-pad is deployed around the first metal through hole on each of the at least one ground plane, wherein the anti-pad encircles the first metal through hole, wherein the anti-pad is configured to form a gap between the at least one ground plane and the first metal through hole, and wherein the at least one ground plane is insulated from the first metal through hole.

17. The apparatus of claim 16 , wherein the at least one ground plane comprises a plurality of ground planes, and wherein two adjacent ground planes in the plurality of ground planes are coupled using a second metal through hole in the thickness direction of the package substrate.

18. The apparatus of claim 15 , wherein a ground clad copper is deployed on the external surface of the first side of the package substrate, and wherein a space exists between the ground clad copper and the antenna.

19. The apparatus of claim 15 , wherein projection areas of the antenna, the chip, and th

Assignees

• Huawei Tech Co Ltd

Inventors

• Chen Tewei
• Liu Guowen

Classifications

• H10W44/248

  for antennas · CPC title

• H10W44/209

  Vertical interconnections, e.g. vias · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title