Integrated circuit package apparatus deployed with antenna and method for manufacturing integrated circuit package apparatus
US-11049823-B2 · Jun 29, 2021 · US
This page is not indexed by search engines while we improve data quality.
Chen Tewei patents
Chen Tewei is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Tewei |
| Total patents | 5 |
| First publication | Dec 29, 2016 |
| Latest publication | Jun 29, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor apparatus with high-stability bonding layer and production method thereof
US-2020365547-A1 · Nov 19, 2020 · US
Integrated Circuit Package Apparatus Deployed with Antenna and Method for Manufacturing Integrated Circuit Package Apparatus
US-2019081013-A1 · Mar 14, 2019 · US
Conical inductor, printed circuit board, and optical module
US-9681549-B2 · Jun 13, 2017 · US
Conical inductor, printed circuit board, and optical module
US-2016381803-A1 · Dec 29, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Huawei Tech Co Ltd | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/30 | 3 |
| H10W42/00 | 3 |
| H05K2201/1003 | 2 |
| H05K1/181 | 2 |
| H01F27/292 | 2 |