Rigid flexible printed circuit board and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9674968-B2
Application number	US-201514695712-A
Country	US
Kind code	B2
Filing date	Apr 24, 2015
Priority date	Apr 30, 2014
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

There are provided a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board according to an exemplary embodiment of the present disclosure includes: a flexible board including a flexible region, a first rigid region formed at one side of the flexible region, and a second rigid region formed at the other side of the flexible region; a first rigid board formed on the flexible board and formed in the first rigid region and the second rigid region; and a second rigid board formed below the flexible board and formed in the first rigid region.

First claim

What is claimed is:

1. A rigid flexible printed circuit board comprising:
a flexible board including a flexible region, a first rigid region formed at one side of the flexible region, and a second rigid region formed at the other side of the flexible region;
a first rigid board formed on the flexible board and formed in the first rigid region and the second rigid region; and
a second rigid board formed below the flexible board and formed in the first rigid region
wherein the first rigid region is formed to be thicker than the second rigid region,
wherein the first rigid region has a pad formed and exposed on at least one of an upper surface and a lower surface thereof for mounting a second component, and
wherein the second rigid region has a pad formed and exposed on at least one of an upper surface and a lower surface thereof for mounting a first component, the first component being thicker than the second component.

2. The rigid flexible printed circuit board of claim 1 , wherein the flexible board includes an insulating layer and a circuit pattern.

3. The rigid flexible printed circuit board of claim 1 , wherein the first rigid board and the second rigid board include an insulating layer and a circuit pattern.

4. The rigid flexible printed circuit board of claim 1 , wherein the flexible board in the flexible region is bent so that an upper surface of the first component is positioned at the same height as or a height lower than an upper surface of the first rigid board formed in the first rigid region.

5. The rigid flexible printed circuit board of claim 1 , wherein the flexible board is bent so that an upper surface of the first component is positioned at the same height as or a height lower than an upper surface of the second component.

6. The rigid flexible printed circuit board of claim 1 , further comprising a protective layer formed on the outermost layer of at least one of the first rigid board and the second rigid board.

7. The rigid flexible printed circuit board of claim 6 , wherein the protective layer is a solder resist.

8. A method of manufacturing a rigid flexible printed circuit board, the method comprising:
forming a flexible board including a flexible region, a first rigid region formed at one side of the flexible region, and a second rigid region formed at the other side of the flexible region;
forming a first rigid board on the flexible board and forming a second rigid board below the flexible board; and
removing the first rigid board and the second rigid board from the flexible region so as to allow the flexible board to be exposed, and removing the second rigid board from the second rigid region so as to allow the first rigid region to be thicker than the second rigid region,
wherein the first rigid region has a pad formed and exposed on at least one of an upper surface and a lower surface thereof for mounting a second component, and
wherein the second rigid region has a pad formed and exposed on at least one of an upper surface and a lower surface thereof for mounting a first component, the first component being thicker than the second component.

9. The method of claim 8 , wherein in the forming of the flexible board, the flexible board is formed to include an insulating layer and a circuit pattern.

10. The method of claim 8 , wherein in the forming of the first rigid board and the second rigid board, the first rigid board and the second rigid board are formed to include an insulating layer and a circuit pattern.

11. The method of claim 8 , wherein in the removing of the first rigid board in the flexible region and the second rigid board in the second rigid region and the flexible region, the first rigid board and the second rigid board are simultaneously removed.

12. The method of claim 8 , wherein in the removing of the first rigid board in the flexible region and the second rigid boards in the second rigid region and the flexible region, the removal is performed by a laser machining method.

13. The method of claim 8 , further comprising, after the removing of the first rigid board in the flexible region and the second rigid boards in the second rigid region and the flexible region, bending the flexible board in the flexible region so that an upper surface of the first component is positioned at the same height as or a height lower than an upper surface of the first rigid board formed in the first rigid region.

14. The method of claim 8 , further comprising, after the removing of the first rigid board in the flexible region and the second rigid boards in the second rigid region and the flexible region, bending the flexible board in the flexible region so that an upper surface of the first component is positioned at the same height as or a height lower than an upper surface of the second component.

15. The method of claim 8 , further comprising, after the removing of the first rigid board in the flexible region and the second rigid boards in the second rigid region and the flexible region, forming an outer layer protective layer on the outermost layer of at least one of the first rigid board and the second rigid board.

16. The method of claim 15 , wherein in the forming of the outer layer protective layer, the outer layer protective layer is formed of a solder resist.

17. The method of claim 15 , further comprising, before the forming of the outer layer protective layer, supporting the flexible boards in the flexible region and the second rigid region by using a supporting part.

Assignees

• Samsung Electro Mech

Inventors

• Kim Ha Il
• An Dong Gi
• Park Su Hyun
• Kim Young Man
• Kim Jong Hyung
• Yu Kyung Chul

Classifications

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title

• H05K3/4691 Primary

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• Y10T29/49126

  Assembling bases · CPC title