Method for fabricating pattern of cured product and methods for manufacturing optical component, circuit board and quartz mold replica as well as coating material for imprint pretreatment and cured product thereof

Patent metadata

Field	Value
Publication number	US-11037785-B2
Application number	US-201916555429-A
Country	US
Kind code	B2
Filing date	Aug 29, 2019
Priority date	Mar 8, 2017
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

The method for fabricating pattern of a cured product includes a first step (arranging step) of arranging a layer formed of a liquid film of a curable composition (α1) containing at least a component (A1) serving as a polymerizable compound on a substrate and a second step (dispensing step) of dispensing liquid droplets of a curable composition (α2) containing at least a component (A2) serving as a polymerizable compound discretely onto a layer formed of a composition (α1′) of components of the curable composition (α1) except a component (D1) serving as a solvent, in which: the mixing of the composition (α1′) and the curable composition (α2) is exothermic.

First claim

What is claimed is:

1. A method for fabricating pattern of a cured product, comprising:
arranging a layer formed of a liquid film of a curable composition (α1) containing at least a component (A1) serving as a polymerizable compound on a substrate;
dispensing liquid droplets of a curable composition (α2) containing at least a component (A2) serving as a polymerizable compound discretely onto a layer formed of a liquid film of a composition (α1′) of components of the curable composition (α1) except a component (D1) serving as a solvent;
bringing a mixture layer obtained by mixing the composition (α1′) and the curable composition (α2) into contact with a mold;
irradiating the mixture layer with light from a side of the mold to cure the layer; and
releasing the mold from the mixture layer after the curing,
wherein mixing of the composition (α1′) and the curable composition (α2) is exothermic.

2. The method according to claim 1 , wherein a surface tension of the composition (α1′) is larger than a surface tension of the curable composition (α2).

3. The method according to claim 1 , wherein the substrate has an adhesion layer formed on a surface where the layer formed of the liquid film of the curable composition (α1) is arranged.

4. The method according to claim 1 , wherein:
the mold comprises a mold having a groove/land pattern formed on a surface thereof;
a groove portion of the groove/land pattern has a width of 4 nm to less than 30 nm; and
the groove portion of the groove/land pattern has an aspect ratio from 1 to 10.

5. The method according to claim 1 , further comprising performing an alignment of the substrate and the mold between the dispensing and the bringing of the mixture layer into contact with the mold.

6. The method according to claim 1 , wherein the dispensing to the releasing are repeated in different areas on the substrate a plurality of times.

7. The method according to claim 1 , wherein the bringing of the mixture layer into contact with the mold is performed under an atmosphere containing a condensable gas.

8. A method for manufacturing an optical component, comprising the method of claim 1 .

9. A method for manufacturing a circuit board, comprising the method of claim 1 .

10. A method for manufacturing a quartz mold replica, comprising the method of claim 1 .

11. The method for manufacturing according to claim 9 , wherein the circuit board is a semiconductor device.

12. A pattern forming method, comprising:
dispensing a droplet of a resist discretely onto a liquid film of an imprint pretreatment coating on a substrate such that the droplet of the resist spreads on the liquid film of the imprint pretreatment coating to yield a spread resist, wherein the imprint pretreatment coating comprises a curable composition and the resist comprises a polymerizable compound;
contacting the spread resist with a mold; and
polymerizing the spread resist and the imprint pretreatment coating to yield a cured layer on the substrate;
wherein mixing of the imprint pretreatment coating and the resist is exothermic.

13. A method for manufacturing a semiconductor device, the method comprising:
providing a liquid film of an imprint pretreatment coating on a substrate, wherein the imprint pretreatment coating comprises a polymerizable compound;
dispensing a droplet of a resist onto the liquid film of the imprint pretreatment coating such that the droplet of the resist spreads on the liquid film of the imprint pretreatment coating to yield a spread resist, wherein the resist comprises a polymerizable compound;
contacting the spread resist with a mold;
polymerizing the spread resist and the imprint pretreatment coating to yield a cured layer on the substrate;
releasing the mold from the cured layer; and
etching the substrate via the cured layer;
wherein mixing of the imprint pretreatment coating and the resist is exothermic.

14. The method according to claim 13 , wherein:
the providing of the liquid film of the imprint pretreatment coating comprises coating the substrate using an inkjet method, dip coating, air knife coating, curtain coating, wire bar coating, gravure coating, extrusion coating, spin coating, or a slit scan method, and
dispensing the droplet of the resist onto the liquid film of the imprint pretreatment coating using an ink jet method.

15. The method according to claim 1 , wherein the dispensing is such that the liquid droplets are spread on the liquid film.

Assignees

• Canon Kk

Inventors

• Kato Jun
• Ito Toshiki

Classifications

• H10P76/204 Primary

  of organic photoresist masks · CPC title

• C08F10/14

  Monomers containing five or more carbon atoms · CPC title

• C08F10/04

  Monomers containing three or four carbon atoms · CPC title

• G03F7/004

  Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

• G03F7/0046

  with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title