Underlay film composition for imprints and method of forming pattern and pattern formation method using the same

Patent metadata

Field	Value
Publication number	US-9507263-B2
Application number	US-201414245491-A
Country	US
Kind code	B2
Filing date	Apr 4, 2014
Priority date	Oct 7, 2011
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

Provided is the pattern formability and line edge roughness of the resultant substrate.
An underlay film composition for imprints comprising a compound (A) and a solvent (B), the compound (A) having at least either one of a group (Ka) capable of covalently bonding and/or interacting with a substrate, and, a group (Kb) capable of covalently bonding and/or interacting with a curable composition for imprints, an Ohnishi parameter (Z) calculated from (equation 1) of 3.8 or larger, and a molecular weight of 400 or larger:

the Ohnishi parameter=(total number of atoms)/(number of carbon atoms−number of oxygen atoms).  (Equation 1)

First claim

What is claimed is:

1. An underlay film composition for imprints comprising a compound (A) and a solvent (B), the compound (A) having at least either one of a group (Ka) capable of covalently bonding and/or interacting with a substrate, and, a group (Kb) capable of covalently bonding and/or interacting with a curable composition for imprints, an Ohnishi parameter (Z) calculated from (equation 1) of 3.8 or larger, and a molecular weight of 400 or larger:
the Ohnishi parameter=(total number of atoms)/(number of carbon atoms−number of oxygen atoms).  (Equation 1)

2. The underlay film composition for imprints of claim 1 , wherein the ratio of a sum (Za) of products of the Ohnishi parameters of the individual components and the mass fractions thereof, with respect to the whole components excluding the solvent (B), is 3.8 or larger.

3. The underlay film composition for imprints of claim 1 , wherein the underlay film composition for imprints contains a compound (Aa) having a group (Ka) capable of covalently bonding and/or interacting with the substrate, and a compound (Ab) having a group (Kb) capable of covalently bonding and/or interacting with the curable composition for imprints; or contains a compound (Aab) having a group (Ka) capable of covalently bonding and/or interacting with the substrate, and having a group (Kb) capable of covalently bonding and/or interacting with the curable composition for imprints.

4. The underlay film composition for imprints of claim 1 , wherein the compound (A) is a polymer having a molecular weight of 3000 or larger.

5. The underlay film composition for imprints of claim 1 , wherein the compound (A) is an addition polymerization-type polymer having a molecular weight of 3000 or larger.

6. The underlay film composition for imprints of claim 1 , wherein the group (Kb) capable of covalently bonding and/or interacting with the curable composition for imprints, bound to the compound (A), is a (meth)acryloyl group.

7. The underlay film composition for imprints of claim 1 , wherein the group (Ka) capable of covalently bonding and/or interacting with the substrate, bound to the compound (A), is selected from carboxyl group, hydroxy group and ether group.

8. The underlay film composition for imprints of claim 1 , wherein the compound (A) has substantially no aromatic group.

9. The underlay film composition for imprints of claim 1 , wherein the underlay film composition for imprints is substantially composed of the compound (A) and the solvent (B) only.

10. The underlay film composition for imprints of claim 1 , wherein the curable composition for imprints contains a polymerizable compound (C), and the Ohnishi parameter (Y) of the polymerizable compound (C) and the Ohnishi parameter (Z) of the compound (A) satisfy (Y)≦(Z).

11. The underlay film composition for imprints of claim 1 , wherein the curable composition for imprints contains a polymerizable compound (C), and the Ohnishi parameter (Y) of the polymerizable compound, and a sum (Za) of products of the Ohnishi parameters of the individual components and the mass fraction thereof, with respect to the whole components excluding the solvent of the underlay film composition for imprints, satisfy (Y)≦(Za).

Assignees

• Fujifilm Corp

Inventors

• Kodama Kunihiko
• Tarutani Shinji
• Enomoto Yuichiro
• Oomatsu Tadashi
• Ito Takayuki
• Kitagawa Hirotaka
• Hattori Akiko

Classifications

• Y10T428/31504

  Composite [nonstructural laminate] · CPC title

• G03F7/094 Primary

  Multilayer resist systems, e.g. planarising layers · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• H10P76/204 Primary

  of organic photoresist masks · CPC title