Acidic aqueous composition for electrolytic copper plating

Patent metadata

Field	Value
Publication number	US-11035051-B2
Application number	US-201716323582-A
Country	US
Kind code	B2
Filing date	Aug 10, 2017
Priority date	Aug 15, 2016
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising
(i) copper (II) ions, (ii) one or more than one compound of Formula (Ia)

(iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia),

with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.

First claim

The invention claimed is:

1. An acidic aqueous composition for electrolytic copper plating, the composition comprising:
(i) copper (II) ions,
(ii) one or more than one compound of Formula (Ia):

wherein
R 4 and R 5 are independently selected from the group consisting of hydrogen, methyl, ethyl, linear C3 to C16 alkyl, branched C3 to C16 alkyl and a moiety of Formula (IIa):

R 1 , R 2 , R 3 and R 6 are independently selected from the group consisting of hydrogen, methyl and ethyl,
B 1 , B 2 , B 3 , D 1 , D 2 , and D 3 are independently selected from the group consisting of O and NH,
A 1 , A 2 and A 3 independently denote a moiety selected from the group consisting of:
hydrogen, methyl, ethyl, linear C3 to C16 alkyl, branched C3 to C16 alkyl;

wherein R 7 and R 8 are independently selected from the group consisting of hydrogen, methyl, ethyl, linear C3 to C10 alkyl and branched C3 to C10 alkyl;

with the proviso that
at least one of A 1 , A 2 and A 3 is a moiety selected from the group consisting of:

and
the corresponding B 1 , B 2 , and B 3 of the at least one of A 1 , A 2 and A 3 is O if the corresponding x, y, and z is 1, a, b and c are independently 0, 1, 2 or 3, s, x, y, and z are independently 0 or 1, n independently is 1, 2 or 3, o+p+q+t=5 to 300,
and
(iii) one or more further compounds, which are different from the compound of Formula (Ia), selected from the group consisting of one or more than one species of inorganic ions, one or more than one accelerator-brightener compound, one or more than one carrier-suppressor compound, one or more than one leveller compound, and one or more than one wetting agent, and
wherein the pH value of the composition is 3 or less.

2. The acidic aqueous composition of claim 1 , wherein B 1 , B 2 , B 3 , D 1 , D 2 , and D 3 denote O.

3. The acidic aqueous composition of claim 1 , wherein
at least one of A 1 , A 2 and A 3 is

4. The acidic aqueous composition of claim 1 , wherein A 1 , A 2 and A 3 independently denote a moiety selected from the group consisting of:
hydrogen, methyl, ethyl, linear C3 to C16 alkyl, branched C3 to C16 alkyl;

wherein R 7 and R 8 are independently selected from the group consisting of hydrogen, methyl, ethyl, linear C3 to C10 alkyl and branched C3 to C10 alkyl;

5. The acidic aqueous composition of claim 1 , wherein A 1 , A 2 and A 3 independently denote a moiety selected from the group consisting of:
hydrogen, methyl, ethyl, linear C3 to C14 alkyl, branched C3 to C14 alkyl;

wherein R 7 and R 8 are independently selected from the group consisting of hydrogen, methyl, ethyl, linear C3 to C10 alkyl and branched C3 to C10 alkyl;

6. The acidic aqueous composition of claim 1 , wherein A 1 , A 2 , and A 3 moieties containing a ring structure are unsubstituted.

7. The acidic aqueous composition of claim 1 , wherein o+p+q+t=6 to 100.

8. The acidic aqueous composition of claim 1 , wherein the weight average molecular weight (Mw) of the total amount of the one or more than one compound of Formula (Ia) is in the range of from 300 g/mol to 10000 g/mol.

9. The acidic aqueous composition of claim 1 , wherein the one or more than one compounds according to Formula (Ia) is selected from the group consisting of:

10. The acidic aqueous composition of claim 1 , wherein
at least two of A 1 , A 2 and A 3 is a moiety selected from the group consisting of:

11. The acidic aqueous composition of claim 1 , wherein o+p+q+t=8 to 30.

12. The acidic aqueous composition of claim 1 , wherein at least two of A 1 , A 2 and A 3 is

13. Method of electrolytic copper plating, comprising the steps of:
(a) providing or manufacturing a substrate suitable for electrolytic copper plating, and
(b) contacting the substrate obtained in step (a), or obtained in an additional step after step (a) but before step (b), with the acidic aqueous composition of claim 1 and applying an electrical current such that copper is electrolytically plated onto the substrate.

Assignees

• Atotech Deutschland Gmbh

Inventors

• Si Kun
• Schmidt Ralf
• Bolton Onas
• Gaida Josef
• Von Horsten Frank
• Rohde Dirk
• Jha Himendra
• Palm Jens
• Mann Olivier
• Llavona-Serrano Angela

Classifications

• C07D215/24

  attached in position 8 · CPC title

• C07D215/20

  Oxygen atoms · CPC title

• C07C215/24

  and acyclic · CPC title

• C07C215/20

  the carbon skeleton being saturated and containing rings · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title