Method of filling through-holes

Patent metadata

Field	Value
Publication number	US-9598787-B2
Application number	US-201313829143-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 14, 2013
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.

First claim

What is claimed is:

1. A method consisting of:
a) providing a substrate with a plurality of through-holes and a layer of copper flash on a surface of the substrate and walls of the plurality of through-holes;
b) treating the substrate by applying an aqueous acid solution to at least the plurality of through-holes, the aqueous acid solution consisting of one or more inorganic acids, one or more reaction products of one or more aromatic heterocyclic nitrogen compounds and one or more epoxy-containing compounds, the one or more reaction products are in amounts of 1 ppm to 50 ppm, and water;
c) providing an acid copper electroplating bath comprising one or more sources of copper ions, one or more acids, one or more brighteners and one or more levelers;
d) immersing the treated substrate in the acid copper electroplating bath comprising one or more sources of copper ions, one or more acids, one or more brighteners and one or more levelers; and
e) electroplating to at least fill the through-holes of the treated substrate with copper using the acid copper electroplating bath comprising one or more sources of copper ions, one or more acids, one or more brighteners and one or more levelers.

2. The method of claim 1 , wherein the one or more aromatic heterocyclic nitrogen compounds is an imidazole having formula:

wherein R 1 , R 2 and R 3 are independently chosen from H, substituted or unsubstituted (C 1 -C 12 )alkyl, substituted or unsubstituted (C 2 -C 12 )alkenyl, and substituted or unsubstituted aryl and provided that R 1 and R 2 are not both H.

3. The method of claim 2 , wherein R 1 , R 2 and R 3 are independently chosen from H, substituted or unsubstituted (C 1 -C 8 )alkyl, substituted or unsubstituted (C 2 -C 7 )alkenyl and substituted or unsubstituted aryl.

4. The method of claim 1 , wherein the one or more epoxy-containing compounds has formula:

wherein Y 1 and Y 2 are independently chosen from hydrogen and (C 1 -C 4 )alkyl, R 4 and R 5 are independently chosen from hydrogen, CH 3 and OH, p=1-6 and q=1-20.

5. The method of claim 4 , wherein the one or more epoxy-containing compounds are chosen from 1,4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether, di(ethylene glycol) diglycidyl ether, poly(ethylene glycol) diglycidyl ether compounds, glycerol diglycidyl ether, neopentyl glycol diglycidyl ether, propylene glycol diglycidyl ether, di(propylene glycol) diglycidyl ether, and poly(propylene glycol) diglycidyl ether compounds.

6. The method of claim 1 , wherein the reaction product is in a range of 1 ppm to 40 ppm.

7. The method of claim 1 , wherein the one or more brighteners of the acid copper electroplating bath are chosen from 3-mercapto-propylsulfonic acid and its sodium salt, 2-mercapto-ethanesulfonic acid and its sodium salt, and bissulfopropyl disulfide and its sodium salt, 3-(benzthiazoyl-2-thio)-propylsulfonic acid sodium salt, 3-mercaptopropane-1-sulfonic acid sodium salt, ethylenedithiodipropylsulfonic acid sodium salt, bis-(p-sulfophenyl)-disulfide disodium salt, bis-(ω-sulfobutyl)-disulfide disodium salt, bis-(ω-sulfohydroxypropyl)-disulfide disodium salt, bis-(ω-sulfopropyl)-disulfide disodium salt, bis-(ω-sulfopropyl)-sulfide disodium salt, methyl-(ω-sulfopropyl)-disulfide sodium salt, methyl-(ω-sulfopropyl)-trisulfide disodium salt, O-ethyl-dithiocarbonic acid-S-(ω-sulfopropyl)-ester, potassium salt thioglycoli acid, thiophosphoric acid-O-ethyl-bis-(ω-sulfpropyl)-ester disodium salt, thiophosphoric, acid-tris(ω-sulfopropyl)-ester trisodium salt, N,N-dimethyldithiocarbamic acid (3-sulfopropyl) ester sodium salt, (O-ethyldithiocarbonato)-S-(3-sulfopropyl)-ester potassium salt, 3-[(amino-iminomethyl)-thio]-1-propanesulfonic acid and 3-(2-benzthiazolylthio)-1-propanesulfonic acid sodium salt.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Jayaraju Nagarajan
• Najjar Elie H
• Barstad Leon R

Classifications

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• C25D3/38

  of copper · CPC title

• C25D5/34 Primary

  Pretreatment of metallic surfaces to be electroplated · CPC title

• C25D5/022

  using masking means · CPC title

• C25D5/10

  Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title