Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices

Patent metadata

Field	Value
Publication number	US-9799854-B2
Application number	US-201314106408-A
Country	US
Kind code	B2
Filing date	Dec 13, 2013
Priority date	Apr 9, 2008
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

The present invention relates to a multilayer barrier film capable of encapsulating a moisture and/or oxygen sensitive electronic or optoelectronic device, the barrier film including at least one nanostructured layer including reactive nanoparticles capable of interacting with moisture and/or oxygen, the reactive nanoparticles being distributed within a polymeric binder, and at least one ultraviolet light neutralizing layer comprising a material capable of absorbing ultraviolet light, thereby limiting the transmission of ultraviolet light through the barrier film.

First claim

What is claimed is:

1. A method of fabricating an encapsulated electronic device, comprising:
providing a vacuum enclosure,
arranging within the vacuum enclosure a base substrate having arranged thereon an electronic device to be encapsulated, and
forming a multilayer barrier film on the electronic device, the multilayer barrier film capable of encapsulating a moisture and/or oxygen sensitive electronic or optoelectronic device, and comprising: at least one nanostructured layer comprising reactive nanoparticles capable of interacting with moisture and/or oxygen, and inert nanoparticles which do not interact with moisture and/or oxygen and which are adapted to obstruct the permeation of moisture and/or oxygen, said reactive nanoparticles and inert nanoparticles being distributed within a polymeric binder, and at least one ultraviolet light neutralizing layer comprising a material capable of absorbing ultraviolet light, thereby limiting the transmission of ultraviolet light through the multilayer barrier film on the electronic device, thereby encapsulating the electronic device, wherein forming the multilayer barrier film on the electronic device comprises:
forming a first layer comprising a material capable of absorbing ultraviolet light on the electronic device, the first layer constituting the ultraviolet light neutralizing layer,
mixing reactive nanoparticles capable of interacting with moisture and/or oxygen and inert nanoparticles which do not interact with moisture and/or oxygen and which are adapted to obstruct the permeation of moisture and/or oxygen with a polymerizable compound having at least one polymerizable group to form a nanoparticulate mixture,
applying the nanoparticulate mixture on the first layer formed on the electronic device, and
exposing the nanoparticulate mixture to ultraviolet light to cure the nanoparticulate mixture during which the first layer functions to limit the transmission of the ultraviolet light onto the electronic device, thereby forming a second layer constituting the nanostructured layer on the first layer.

2. The method of claim 1 , further comprising the step of forming a secondary encapsulation over the electronic device encapsulated by the multilayer barrier film,
wherein the multilayer film encapsulating the electronic device is contacted with a curable adhesive in an amount sufficient to surround the electronic device encapsulated by the multilayer barrier film,
attaching a cover substrate on the adhesive prior to compressing the adhesive against the electronic device encapsulated by the multilayer barrier film,
mechanically compressing the cover substrate against the adhesive at an elevated temperature, and
curing the adhesive.

Assignees

• Agency Science Tech & Res

Inventors

• Ramadas Senthil Kumar
• Chua Soo Jin
• Ke Lin Karen

Classifications

• Y10T428/31935

  Ester, halide or nitrile of addition polymer · CPC title

• H01L51/5256

  Electricity · mapped topic

• Y10T428/31511

  Of epoxy ether · CPC title

• H05B33/04 Primary

  Sealing arrangements {, e.g. against humidity} · CPC title

• H01L51/5284

  Electricity · mapped topic