Smart cards, payment objects and methods

US9836684B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9836684-B2
Application numberUS-201615072356-A
CountryUS
Kind codeB2
Filing dateMar 17, 2016
Priority dateAug 10, 2014
Publication dateDec 5, 2017
Grant dateDec 5, 2017

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M 1 , M 2 , M 3 ) each having a slit (S 1 , S 2 , S 3 ) offset or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S 2 ) overlapping the module antenna. Diamond like coating filling the slit. Key fobs similarly fabricated. Plastic-Metal-Plastic smart cards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.

First claim

Opening claim text (preview).

What is claimed is: 1. A solid metal smart card comprising: a metal card body (MCB) having an opening (MO) for receiving a transponder chip module (TCM); a slit (S 1 ) extending from an edge of the card body to the opening; wherein the card body is thinned in an area including the slit so that a back side of the metal card body is recessed; and a metal backing insert (MBI) disposed in the recess, spanning the slit and reinforcing the card body at the slit area. 2. The smart card of claim 1 , further comprising: a module cover (MC) inserted into the module opening in the back of the card body. 3. The smart card of claim 1 , wherein: the thinned area extends to the area of the transponder chip module (TCM), including surrounding the opening; the metal backing insert (MBI) comprises a module opening and a slit (S 2 ) extending from an edge of the MBI to the module opening; and the metal backing insert (MBI) is oriented in the card so that the slit (S 2 ) does not extend to an edge of the card body, but rather is located in a central area of the card body. 4. The smart card of claim 1 , wherein: the thinned area extends to the area of the transponder chip module (TCM), including surrounding the opening; and the metal backing insert (MBI) does not have a module opening, and has a slit (S 2 ) extending from an edge of the metal backing insert (MBI) to a position at the interior of the metal backing insert (MBI) so that the slit is under a portion of and overlaps a module antenna (MA) of the transponder chip module (TCM).

Assignees

Inventors

Classifications

  • the antenna being of the capacitive type · CPC title

  • at least one of the integrated circuit chips being mounted as a module · CPC title

  • the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

  • the antenna being of the near field type, inductive coil · CPC title

  • by boring or cutting · CPC title

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Frequently asked questions

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What does patent US9836684B2 cover?
Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M 1 , M 2 , M 3 ) each having a slit (S 1 , S 2 , S 3 ) offset or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inse…
Who is the assignee on this patent?
Finn David, Lotya Mustafa, Molloy Darren, and 1 more
What technology area does this patent fall under?
Primary CPC classification G06K19/07722. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).