Biometric sensor module for a smart card and method for manufacturing such a module
US-12131987-B2 · Oct 29, 2024 · US
Plastic cards with high density particles
US9016591B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9016591-B2 |
| Application number | US-201313962925-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 8, 2013 |
| Priority date | Aug 8, 2013 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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Abstract
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High density metal or mineral particles, sized to be less than 10 microns, are compounded into a base plastic layer to form a compounded composite layer used to form the core layer of the card, any layer of the card or the entire card. The amount of high density particles compounded into the plastic layer is controlled so the card: (a) is at least twice as heavy as any standard PVC card; (b) can be manufactured using standard current plastic card equipment and tooling. (c) is not brittle; and (d) is electrically non-conductive whereby it is not subject to electrostatic discharge properties. The card can include RFID functionality integrated into the card body. The compounded composite layer does not interfere with the integrity of the data communication between an RFID chip packaged in an antenna module and coupled with an embedded booster antenna, and a contactless reader or terminal.
First claim
Opening claim text (preview).
What is claimed is: 1. A card having a layer which includes a base layer of thermo plastic material having a first density, D 1 , into which is compounded particles of a high density material having a second density, D 2 , where D 2 is at least four times the density of D 1 ; said high density particles of density D 2 being sized to be equal to or less than 10 microns in size; and wherein the amount of said high density particles compounded within the thermoplastic material is…
Assignees
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Classifications
- G06K19/02Primary
Physics · mapped topic
Physics · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9016591B2 cover?
- High density metal or mineral particles, sized to be less than 10 microns, are compounded into a base plastic layer to form a compounded composite layer used to form the core layer of the card, any layer of the card or the entire card. The amount of high density particles compounded into the plastic layer is controlled so the card: (a) is at least twice as heavy as any standard PVC card; (b) ca…
- Who is the assignee on this patent?
- Herslow John, Paulson Bradley A, Finn David, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification G06K19/02. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).