Integrated circuit device, oscillator, electronic apparatus, and vehicle

Patent metadata

Field	Value
Publication number	US-11025194-B2
Application number	US-202016835365-A
Country	US
Kind code	B2
Filing date	Mar 31, 2020
Priority date	Apr 1, 2019
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

An integrated circuit device includes an oscillation circuit that generates an oscillation signal by causing a resonator to oscillate, a temperature compensation circuit that performs temperature compensation of an oscillation frequency of the oscillation circuit, an output circuit that outputs a clock signal based on the oscillation signal, a first regulator that generates a first regulated power supply voltage based on a power supply voltage and supplies the first regulated power supply voltage to the temperature compensation circuit, and a second regulator that generates a second regulated power supply voltage based on the power supply voltage and supplies the second regulated power supply voltage to the output circuit.

First claim

What is claimed is:

1. An integrated circuit device comprising:
an oscillation circuit that generates an oscillation signal by causing a resonator to oscillate;
a temperature compensation circuit that performs temperature compensation of an oscillation frequency of the oscillation circuit;
an output circuit that outputs a clock signal based on the oscillation signal;
a first regulator that generates a first regulated power supply voltage based on a power supply voltage and supplies the first regulated power supply voltage to the temperature compensation circuit; and
a second regulator that generates a second regulated power supply voltage based on the power supply voltage and supplies the second regulated power supply voltage to the output circuit.

2. The integrated circuit device according to claim 1 , further comprising:
a storage portion that stores voltage setting information, wherein
the first regulator generates the first regulated power supply voltage which is a fixed voltage, and
the second regulator generates the second regulated power supply voltage whose voltage is variably set based on the voltage setting information.

3. The integrated circuit device according to claim 1 , further comprising:
a power supply pad to which the power supply voltage is supplied, wherein
a distance between the power supply pad and the second regulator is shorter than a distance between the power supply pad and the first regulator.

4. The integrated circuit device according to claim 3 , further comprising:
a first power supply line that couples the power supply pad and the first regulator; and
a second power supply line that couples the power supply pad and the second regulator, wherein
a wiring width of the first power supply line is narrower than a wiring width of the second power supply line.

5. The integrated circuit device according to claim 1 , further comprising:
a ground pad to which a ground voltage is supplied, wherein
a distance between the ground pad and the first regulator is shorter than a distance between the ground pad and the second regulator.

6. The integrated circuit device according to claim 1 , wherein
the oscillation circuit is disposed along a first side of the integrated circuit device among the first side, a second side that intersects the first side, a third side that is an opposite side of the first side, and a fourth side that is an opposite side of the second side,
the output circuit is disposed along the second side, and
the second regulator is disposed at a corner portion in which the first side and the second side intersect each other.

7. The integrated circuit device according to claim 6 , wherein
when a direction from the first side toward the third side is a first direction, and a direction from the second side toward the fourth side is a second direction, the temperature compensation circuit and the first regulator are disposed in the second direction of the output circuit.

8. The integrated circuit device according to claim 1 , wherein
when a direction from a first side of the integrated circuit device toward a third side that is an opposite side of the first side is a first direction, and a direction from a second side that intersects the first side toward a fourth side that is an opposite side of the second side is a second direction,
the second regulator and the output circuit are disposed along the first direction, and
the temperature compensation circuit and the first regulator are disposed along the first direction in the second direction of the output circuit.

9. The integrated circuit device according to claim 8 , further comprising:
a power supply pad to which the power supply voltage is supplied, wherein
the power supply pad is disposed between the second regulator and the output circuit.

10. The integrated circuit device according to claim 8 , wherein
the second regulator supplies the second regulated power supply voltage to the oscillation circuit, and
the oscillation circuit is disposed in the second direction of the second regulator.

11. The integrated circuit device according to claim 8 , further comprising:
a control circuit that controls the temperature compensation circuit, wherein
the control circuit is disposed in the second direction of the temperature compensation circuit.

12. The integrated circuit device according to claim 8 , further comprising:
a first pad electrically coupled to one end of the resonator;
a second pad electrically coupled to the other end of the resonator; and
a clock pad from which the clock signal is output, wherein
the first pad and the second pad are disposed along the first side, and
the clock pad is disposed along the second side.

13. The integrated circuit device according to claim 8 , further comprising:
a temperature sensor that outputs a temperature detection voltage to the temperature compensation circuit, wherein
the temperature sensor is disposed in the second direction of the oscillation circuit.

14. The integrated circuit device according to claim 1 , wherein
the temperature compensation circuit is a circuit that performs analog temperature compensation based on polynomial approximation.

15. The integrated circuit device according to claim 1 , wherein
the output circuit outputs the clock signal in at least one signal format of LVDS, PECL, HCSL, and differential CMOS.

16. An oscillator comprising:
the integrated circuit device according to claim 1 ; and
the resonator.

17. An electronic apparatus comprising:
the integrated circuit device according to claim 1 ; and
a processing device that operates in response to the clock signal.

18. A vehicle comprising:
the integrated circuit device according to claim 1 ; and
a processing device that operates in response to the clock signal.

Assignees

• Seiko Epson Corp

Inventors

• Sawada Mitsuaki

Classifications

• H10W72/551

  Materials of bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10W20/43

  Layouts of interconnections · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title