Array substrate, method for manufacturing the same, and display device

Patent metadata

Field	Value
Publication number	US-11024825-B2
Application number	US-201916516461-A
Country	US
Kind code	B2
Filing date	Jul 19, 2019
Priority date	Jan 2, 2019
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

The present disclosure provides an array substrate, a method for manufacturing the same, and a display device. The array substrate includes a substrate, a first dielectric layer disposed on the substrate, the first dielectric layer having recesses, a first conductive layer covering the first dielectric layer, and auxiliary conductive portions disposed at in the recesses and contacting the first conductive layer.

First claim

What is claimed is:

1. An array substrate comprising:
a substrate;
a first dielectric layer disposed on the substrate, the first dielectric layer having recesses;
a first conductive layer covering the first dielectric layer; and
auxiliary conductive portions disposed in the recesses and contacting the first conductive layer, wherein the first dielectric layer comprises a pixel defining layer having openings for defining pixels and inter-pixel portions disposed between the openings, and wherein the recesses are disposed in the inter-pixel portions of the pixel defining layer.

2. The array substrate according to claim 1 , wherein the auxiliary conductive portions are disposed between the first dielectric layer and the first conductive layer.

3. A display device comprising the array substrate according to claim 1 .

4. The array substrate according to claim 1 , wherein the recesses are configured to have at least one of the following configurations:
1) the recesses comprise first recesses extending in a row direction;
2) the recesses comprise second recesses extending in a column direction; and
3) the recesses comprise the first recesses extending in the row direction and the second recesses extending in the column direction.

5. A display device comprising the array substrate according to claim 4 .

6. The array substrate according to claim 1 , wherein the auxiliary conductive portions are disposed over the first conductive layer.

7. A display device comprising the array substrate according to claim 6 .

8. The array substrate according to claim 1 , further comprising:
a second conductive layer disposed on the substrate, a projection of at least a portion of the second conductive layer on the substrate overlapping with a projection of the openings on the substrate; and
a light emitting layer disposed between the first conductive layer and the second conductive layer.

9. A display device comprising the array substrate according to claim 8 .

10. The array substrate according to claim 8 , wherein the first conductive layer is transparent and wherein the second conductive layer is reflective.

11. A display device comprising the array substrate according to claim 10 .

12. A method for manufacturing an array substrate, the method comprising:
providing a substrate;
forming a first dielectric layer on the substrate;
forming recesses in the first dielectric layer; and
forming a first conductive layer and auxiliary conductive portions, wherein the first conductive layer covers the first dielectric layer and the auxiliary conductive portions are disposed in the recesses and contact the first conductive layer, wherein the first dielectric layer comprises a pixel defining layer, the pixel defining layer formed to have openings for defining pixels and inter-pixel portions disposed between the openings, and wherein forming the recesses comprises removing a portion of the inter-pixel portions of the pixel defining layer to form the recesses.

13. The method according to claim 12 , wherein the auxiliary conductive portions are formed by inkjet printing.

14. The method according to claim 12 , wherein forming the recesses comprises at least one of the following:
1) removing the portion of the inter-pixel portions in a row direction to form first recesses;
2) removing the portion of the inter-pixel portions in a column direction to form second recesses; and
3) removing the portion of the inter-pixel portions in the row direction to form the first recesses and removing the portion of the inter-pixel portions in the column direction to form the second recesses.

15. The method according to claim 12 , further comprising:
forming a second conductive layer within the openings and on the substrate prior to forming the first conductive layer; and
forming a light emitting layer on the second conductive layer and the inter pixel portions.

16. The method according to claim 12 , wherein forming the first conductive layer and the auxiliary conductive portions comprises forming the first conductive layer on the first dielectric layer, and forming the auxiliary conductive portions on the first conductive layer in the recesses.

17. The method according to claim 12 , wherein forming the first conductive layer and the auxiliary conductive portions comprises forming the auxiliary conductive portions in the recesses, and forming the first conductive layer to cover the first dielectric layer and the auxiliary conductive portions.

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Wu Pohsien
• Hu Hungchieh
• Song Yujhun
• Chen Chenyu
• Feng Yuhsiung

Classifications

• H10K50/824

  combined with auxiliary electrodes · CPC title

• H10K59/80522 Primary

  combined with auxiliary electrodes · CPC title

• H01L51/0022

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic

• H01L27/3283

  Electricity · mapped topic