Chip-scale LIDAR with a single 2D MEMS scanner

Patent metadata

Field	Value
Publication number	US-11002832-B2
Application number	US-201816018831-A
Country	US
Kind code	B2
Filing date	Jun 26, 2018
Priority date	Jul 12, 2017
Publication date	May 11, 2021
Grant date	May 11, 2021

Abstract

A LIDAR system, LIDAR chip and method of manufacturing a LIDAR chip. The LIDAR system includes a photonic chip configured to transmit a transmitted light beam and to receive a reflected light beam, a scanner for directing the transmitted light beam towards a direction in space and receiving the reflected light beam from the selected direction, and a fiber-based optical coupler. The photonic chip and the scanner are placed on a semiconductor integrated platform (SIP). The fiber-based optical coupler is placed on top of the photonic chip to optically couple to the photonic chip for directing the a transmitted light beam from the photonic chip to the scanner and for directing a reflected light beam from the scanner to the photonic chip.

First claim

What is claimed is:

1. A LIDAR system, comprising:
a photonic chip configured to transmit a light beam and to receive a reflected light beam;
a scanner for directing the transmitted light beam towards a direction in space and receiving the reflected light beam from the selected direction; and
a fiber-based optical coupler for directing the transmitted light from the photonic chip to the scanner and for directing the reflected light from the scanner to the photonic chip, wherein the fiber-based optical coupler further comprises a fiber-based collimator for receiving the reflected light from the scanner.

2. The LIDAR system of claim 1 , wherein the fiber-based optical coupler further comprises a fiber-based circulator and the reflected light from the fiber-based collimator passes through the fiber-based circulator.

3. The LIDAR system of claim 2 , further comprising a first optical fiber for optical communication of the transmitted light beam from the photonic chip to the fiber-based circulator and a second optical fiber for optical communication of the reflected light beam from the fiber-based circulator to the photonic chip.

4. The LIDAR system of claim 3 , wherein the photonic chip further comprises a transmitter beam edge or grating coupler aligned with the first optical fiber from transmitting the transmitted light beam to the fiber-based circulator and a receiver beam edge or grating coupler aligned with the second optical fiber for transmitting the reflected light beam to the photonic chip.

5. The LIDAR system of claim 3 , wherein the light source is a distributed Bragg grating laser diode.

6. The LIDAR system of claim 1 , wherein the photonic chip and the scanner are disposed on a semiconductor integration platform and the fiber-based optical coupler is disposed on top of the photonic chip.

7. The LIDAR system of claim 1 , further comprising a processor configured to operate the photonic chip to generate the transmitted light and to receive data related to the reflected light in order to determine a parameter of an object that produces the reflected light via interaction with the transmitted light.

8. The LIDAR system of claim 1 , wherein the scanner is a two-dimensional microelectromechanical (MEMS) scanner.

9. A method of manufacturing a LIDAR chip, comprising:
placing a photonic chip and a scanner on a semiconductor integrated platform (SIP); and
placing a fiber-based optical coupler on top of the photonic chip to optically couple to the photonic chip for directing a transmitted light beam from the photonic chip to the scanner and for directing a reflected light beam from the scanner to the photonic chip, wherein the fiber-based optical coupler includes a fiber-based collimator for receiving the reflected light from the scanner.

10. The method of claim 9 , wherein the fiber-based optical coupler further comprises a fiber-based circulator and the reflected light from the fiber-based collimator fiber-based collimator passes through the fiber-based circulator.

11. The method of claim 10 , further comprising placing the fiber-based optical coupler on top of the photonic chip to optically couple the fiber-based circulator to the photonic chip via a first optical fiber and a second optical fiber.

12. The method of claim 11 , further comprising depositing the fiber-based coupler on the photonic chip so that a transmitter beam edge or grating coupler of the photonic chip is aligned with the first optical fiber and a receiver beam edge or grating coupler of the photonic chip is aligned with the second optical fiber.

13. The method of claim 9 , further comprising coupling the photonic chip to a processor via coupling the SIP to a printed circuit board including the processor.

14. The method of claim 9 , wherein the printed circuit board further comprises an analog-to-digital converter.

15. A LIDAR chip, comprising:
a semiconductor integrated platform (SIP);
a photonic chip coupled to a top surface of the SIP and configured to transmit a transmitted light beam and to receive a reflected light beam;
a scanner coupled to the top surface of the SIP and configured to direct the transmitted light beam towards a selected direction in space and receive the reflected light beam from the selected direction; and
a fiber-based optical coupler deposited on top of the photonic chip for directing the transmitted light from the photonic chip to the scanner and for directing the reflected light from the scanner to the photonic chip, wherein the fiber-based optical coupler further comprises a fiber-based collimator for receiving the reflected light from the scanner.

16. The LIDAR chip of claim 15 , wherein the fiber-based optical coupler further comprises a fiber-based circulator and the reflected light from the fiber-based collimator passes through the fiber-based circulator.

17. The LIDAR chip of claim 16 , further comprising a first optical fiber for optical communication of the transmitted light beam from the photonic chip to the fiber-based circulator and a second optical fiber for optical communication of the reflected light beam from the fiber-based circulator to the photonic chip.

18. The LIDAR chip of claim 17 , wherein the photonic chip further comprises a transmitter beam edge or grating coupler aligned with the first optical fiber from transmitting the transmitted light beam to the circulator and a receive beam edge or grating coupler aligned with the second optical fiber for transmitting the reflected light beam to the photonic chip.

19. The LIDAR chip of claim 15 , wherein the SIP is coupled to a printed circuit board including a processor.

20. The LIDAR chip of claim 19 , wherein the processor is configured to provide a waveform to a light source associated with the photonic chip, receive data from a photodetector of the photonic chip and determine a parameter of an object from the data received from the photonic chip.

Assignees

• Gm Global Tech Operations Llc

Inventors

• Sayyah Keyvan
• Efimov Oleg
• Patterson Pamela R
• Sarkissian Raymond
• Schaffner James H
• Huang Biqin
• Hammon David

Classifications

• H10W46/607

  Located on parts of packages, e.g. on encapsulations or on package substrates · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• G02B6/1228

  Tapered waveguides, e.g. integrated spot-size transformers (for coupling with fibres G02B6/305) · CPC title

• H10F77/413

  directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42) · CPC title