Heat transfer devices and methods of transfering heat

Patent metadata

Field	Value
Publication number	US-10976119-B2
Application number	US-201816048625-A
Country	US
Kind code	B2
Filing date	Jul 30, 2018
Priority date	Jul 30, 2018
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

Heat transfer devices, electronic devices, and methods for heat transfer with an external body. Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an aperture and comprises a pin cooling structure extending from around the aperture. The pin cooling structure comprises a distal end configured to facilitate heat exchange between the pin cooling structure and an external/adjacent/separate body and one or more side walls. At least one of the one or more side walls, the distal end, and the aperture at least partially define a pin volume. The second disc defines an inlet that is configured to (i) receive a fluid, and (ii) allow the fluid to flow from the inlet and into the pin volume.

First claim

The invention claimed is:

1. A heat transfer device, comprising:
a first disc defining an aperture and comprising a pin cooling structure extending from around the aperture, the pin cooling structure comprising:
a distal end configured to facilitate heat exchange between the pin cooling structure and an external body; and
one or more side walls, wherein at least one of the one or more side walls, the distal end, and the aperture at least partially define an internal pin volume;

a second disc positioned adjacent to the first disc and defining an inlet, wherein the inlet is configured to:
receive a fluid; and
allow the fluid to flow from the inlet and into the internal pin volume; and

at least one spacer positioned between the first disc and the second disc;
wherein a fluid channel is defined between the first disc and the second disc, and wherein the fluid channel is in fluid communication with the internal pin volume;
wherein the first disc and the second disc are configured to deform responsive to a temperature change of the heat transfer device, and wherein a deformation of the first disc and the second disc responsive to the temperature change causes the pin cooling structure to be translated as a temperature of the heat transfer device changes; and
wherein the first disc and the second disc are configured such that deformation of the first disc and the second disc causes the heat transfer device to achieve a target deformation pattern when the heat transfer device reaches a target temperature.

2. The heat transfer device of claim 1 , wherein the first disc, the second disc, and the at least one spacer are formed of a single body.

3. The heat transfer device of claim 1 , wherein the second disc further comprises an injector extending from the inlet and into the internal pin volume, and wherein the injector defines a pin channel configured to allow the fluid to flow from the inlet and into the internal pin volume.

4. The heat transfer device of claim 1 , wherein the pin cooling structure further comprises a micro-bellows that is configured to expand in response to the fluid being injected into the internal pin volume of the pin cooling structure.

5. The heat transfer device of claim 4 , wherein the micro-bellows is configured to deform in response to the distal end of the pin cooling structure making contact with the external body.

6. The heat transfer device of claim 1 , further comprising a fluid reservoir configured to allow the fluid to flow into the inlet from the fluid reservoir, and wherein the heat transfer device is configured to allow the fluid to flow into the inlet from the fluid reservoir in response to a trigger event.

7. The heat transfer device of claim 6 , wherein the trigger event corresponds to at least one of:
the heat transfer device reaching a threshold temperature;
the fluid reaching a trigger pressure; or
an external stimulus triggering a barrier element to open.

8. The heat transfer device of claim 1 , wherein the first disc further defines a plurality of apertures and further comprises a plurality of corresponding pin cooling structures.

9. The heat transfer device of claim 8 , wherein the second disc further comprises a plurality of inlets, wherein each inlet of the plurality of inlets is configured to allow the fluid to flow from each inlet and into a corresponding internal pin volume defined by a corresponding pin cooling structure of the plurality of pin cooling structures.

10. The heat transfer device of claim 1 , wherein at least one of the first disc and the second disc are composed of functionally gradient materials, and wherein the functionally gradient materials are configured to cause the heat transfer device to achieve the target deformation pattern when the heat transfer device reaches the target temperature.

11. The heat transfer device of claim 1 , further comprising at least one exit interface that enables the fluid to flow from the fluid channel to an effusion region.

12. The heat transfer device of claim 1 , wherein the first disc comprises:
a surface layer including the pin cooling structure; and
a more rigid layer adjacent to the surface layer, more rigid than the surface layer, and disposed between the surface layer and the fluid channel, wherein the more rigid layer partially defines the fluid channel, and wherein the more rigid layer is composed of a material having at least one of a lower modulus of elasticity and a higher Coefficient of Thermal Expansion (CTE) than the surface layer.

13. A method for conducting a heat exchange with an external body using the heat transfer device of claim 1 , the method comprising:
flowing the fluid from the inlet into the internal pin volume;
transferring heat between the external body and the fluid within the internal pin volume via the pin cooling structure; and
flowing the fluid from the internal pin volume to the fluid channel.

14. The method of claim 13 , wherein transferring heat between the external body and the fluid within the internal pin volume comprises:
receiving heat from the external body by the pin cooling structure; and
transferring the heat to flow from the pin cooling structure to the fluid within the internal pin volume.

15. The method of claim 13 , further comprising exhausting the fluid and the heat from the heat transfer device.

16. The method of claim 13 , further comprising translating the distal end of the pin cooling structure away from the first disc based on the fluid flowing into the internal pin volume.

17. The method of claim 16 , wherein the pin cooling structure comprises a micro-bellows, and wherein the translating the distal end of the pin cooling structure toward the external body corresponds at least in part to the micro-bellows expanding.

18. The method of claim 16 , further comprising deforming at least one of the second disc of the heat transfer device and the first disc of the heat transfer device based on a change in temperature of the heat transfer device, and wherein the translating the distal end of the pin cooling structure is based at least in part on the deforming of one or more discs.

19. The heat transfer device of claim 1 , wherein the first disc and the second disc are configured such that the deformation of the first disc and the second disc responsive to the temperature change is characterized by one or more Zernike polynomials.

20. A combination of the heat transfer device of claim 1 and an electronic device, wherein the deformation of the first disc and the second disc causes the distal end of the pin cooling structure to make contact with the electronic device.

Assignees

• Boeing Co

Inventors

• Veto Christopher C
• Bunch Ernest E
• Kowell Robert Stephen

Classifications

• H10W40/772

  Bellows · CPC title

• H10W40/40

  involving heat exchange by flowing fluids · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• F28F2255/04

  comprising shape memory alloys or bimetallic elements · CPC title

• F28F5/00

  Elements specially adapted for movement · CPC title