Epoxy resin blend dispersion and a process for preparing the dispersion

US9346925B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9346925-B2
Application numberUS-201314408106-A
CountryUS
Kind codeB2
Filing dateJun 24, 2013
Priority dateJun 29, 2012
Publication dateMay 24, 2016
Grant dateMay 24, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention relates to an aqueous epoxy resin blend dispersion of a high mw epoxy resin and a liquid epoxy resin with a dispersant having an interfacial tension such that a drop of the mixture of the dispersant in a melt of the epoxy resin blend against water is less than 2 dynes/cm, preferably less than 1 dyne/cm, and a process for preparing this epoxy resin blend dispersion. Specifically, the process is a solvent free melt kneading or shearing dispersion process wherein the dispersion is processed at from 50 to 150° C., and the resulting dispersion is stable.

First claim

Opening claim text (preview).

What is claimed is: 1. An aqueous epoxy resin dispersion comprising, based on the total solids weight in the epoxy resin dispersion, i) from 20 wt. % to 60 wt. %, a high molecular weight (Mw) epoxy resin; ii) from 30 wt. % to 70 wt. %, a liquid epoxy resin; and iii) from 2 wt. % to 20 wt. %, a dispersant having an interfacial tension such that a drop of the mixture of the dispersant in a melt of the high Mw and liquid epoxy resin blend against water is less than 2 dynes/cm, wherein the epoxy resin dispersion is a homogeneous dispersion; the high Mw epoxy resin has an epoxide equivalent weight of from 800 to 10000 g/eq, and a weight average molecular weight of from 3000 to 40000; and the liquid epoxy resin has an epoxide equivalent weight of from 100 to 200 g/eq, and a weight average molecular weight of from 200 to 600. 2. The epoxy resin dispersion according to claim 1 wherein the dispersion has a particle size of from 0.1 to 2 μm. 3. The epoxy resin dispersion according to claim 1 wherein each of the high Mw epoxy resin and the liquid epoxy resin is a polyglycidyl ether of a polyol. 4. A coating composition comprising the epoxy resin dispersion according to claim 1 . 5. A cement composition comprising the epoxy resin dispersion according to claim 1 . 6. An aqueous dispersion process comprising: i) providing from 20 to 60 wt. %, based on total dispersion solids, of a high Mw epoxy resin with an epoxide equivalent weight of from 800 to 10000 g/eq, and a weight average molecular weight of from 3000 to 40000; ii) providing from 30 to 70 wt. %, based on total dispersion solids, of a liquid epoxy resin with an epoxide equivalent weight of from 100 to 200 g/eq, and a weight average molecular weight of from 200 to 600; iii) providing from 2.0% to 20%, based on total dispersion solids, of a dispersant that has an interfacial tension such that a drop of the mixture of the dispersant in a melt of the high Mw and liquid epoxy resin blend against water is less than 2 dynes/cm; iv) providing water to achieve a solid content of >75 wt %; and v) continuously emulsifying said epoxy resin composition in the water in the presence of said dispersant to produce a high internal phase emulsion under conditions sufficient to melt the high Mw epoxy blend resin. 7. The dispersion process according to claim 6 wherein each of the high Mw epoxy resin and the liquid epoxy resin is a Bisphenol-A diglycidyl ether or Bisphenol-F diglycidyl ether or polyglycol diglycidyl ether. 8. The dispersion process according to claim 6 wherein the dispersant is a sulfate of an ethoxylated phenol, an ethoxylated phenol, nonionic copolymer of ethylene oxide and propylene oxide dispersants having a molecular weight of from 7,000 to 20,000, a polyvinyl alcohol, or any mixture thereof. 9. The dispersion process according to claim 6 , further comprising providing additional water to dilute the high internal phase emulsion to lower viscosity, to 40-60 wt % solid in the dispersion.

Assignees

Inventors

Classifications

  • Premixtures of ingredients · CPC title

  • Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title

  • Water resistance, i.e. waterproof or water-repellent materials · CPC title

  • Polyepoxides · CPC title

  • Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9346925B2 cover?
The present invention relates to an aqueous epoxy resin blend dispersion of a high mw epoxy resin and a liquid epoxy resin with a dispersant having an interfacial tension such that a drop of the mixture of the dispersant in a melt of the epoxy resin blend against water is less than 2 dynes/cm, preferably less than 1 dyne/cm, and a process for preparing this epoxy resin blend dispersion. Specifi…
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification C08J3/05. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 24 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).