Film mask, method for manufacturing same, and method for forming pattern using film mask

Patent metadata

Field	Value
Publication number	US-10969677-B2
Application number	US-201715776042-A
Country	US
Kind code	B2
Filing date	Jan 31, 2017
Priority date	Jan 27, 2016
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

The present application relates to a film mask including: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and a release force enhancement layer provided on the darkened light-shielding pattern layer and having surface energy of 30 dynes/cm or less, a method for manufacturing the same, and a method for forming a pattern using the film mask.

First claim

The invention claimed is:

1. A film mask comprising:
a transparent, flexible, plastic substrate;
an attachment layer comprising an acrylic, epoxy-based or urethane-based material on the substrate;
a patterned metal layer provided on at least one portion of a surface of the attachment layer;
a darkened light-shielding pattern layer provided:
(a) on the metal layer; or
(b) on a portion of a surface of the attachment layer; or
(c) both (a) and (b),

and at least one portion of the surface of the attachment layer contains no metal layer and no darkened light-shielding pattern layer;
a surface protective layer provided on the darkened light-shielding pattern layer and on the portion of the surface of the transparent layer where no darkened light-shielding pattern layer is present; and
a release force enhancement layer provided on the surface protective layer and having surface energy of 30 dynes/cm or less,
wherein the darkened light-shielding pattern layer is composed of AlOxNy (0<x≤1.5, 0<y≤1, and x and y are a ratio of O atoms and N atoms to one Al atom, respectively), and
wherein the metal layer is composed of Al.

2. The film mask of claim 1 , wherein the darkened light-shielding pattern layer has a reflectance of about 30% or less in a UV region range.

3. A method for manufacturing the film mask according to claim 1 , the method comprising:
forming the darkened light-shielding pattern layer on a transparent substrate; and
forming the release force enhancement layer on the darkened light-shielding pattern layer.

4. A method for forming a pattern, comprising:
applying a photosensitive resin composition onto a substrate;
exposing the applied photosensitive resin composition to light through the film mask according to claim 1 ; and
developing the photosensitive resin composition.

Assignees

• Lg Chemical Ltd

Inventors

• Hwang Ji Young
• Seo Han Min
• Bae Nam Seok
• Lee Seung Heon
• Oh Dong Hyun
• Park Chan Hyoung
• Kim Ki-Hwan
• Lee Ilha

Classifications

• H10P76/40

  of masks comprising inorganic materials · CPC title

• G03F7/703

  Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates · CPC title

• G03F7/2014

  Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame · CPC title

• G03F7/7035

  Proximity or contact printers · CPC title

• G03F7/70791

  Large workpieces, e.g. glass substrates for flat panel displays or solar panels · CPC title