Semiconductor light-emitting element, and manufacturing method for same
US-10193021-B2 · Jan 29, 2019 · US
US10958006B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10958006-B2 |
| Application number | US-201816203791-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 29, 2018 |
| Priority date | Jun 2, 2016 |
| Publication date | Mar 23, 2021 |
| Grant date | Mar 23, 2021 |
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A contact element comprises an electrically conductive layer and a masking layer. A contact side of the contact element is at least partly covered by the masking layer and the electrically conductive layer. The electrically conductive layer and the masking layer form a contact surface having alternating regions of the masking layer and the electrically conductive layer.
Opening claim text (preview).
What is claimed is: 1. A contact element, comprising: an electrically conductive layer; and a masking layer selectively disposed on portions of a contact side of the contact element for defining masked regions and unmasked regions of the contact side, the electrically conductive layer selectively disposed in the unmasked regions for forming a contact surface having alternating regions of the masking layer and the electrically conductive layer. 2. The contact element of claim 1 , wherein the masking layer includes a lubricating filler medium. 3. The contact element of claim 1 , wherein the masking layer includes an electrically conductive filler medium. 4. The contact element of claim 1 , wherein the electrically conductive layer is disposed only in the unmasked regions of the contact element. 5. The contact element of claim 1 , wherein the contact side of the contact element comprises a generally planar surface on which the masking layer and electrically conductive layer are disposed. 6. The contact element of claim 1 , further comprising a substrate on which each of the electrically conductive layer and the masking layer are directly disposed. 7. The contact element of claim 6 , wherein a material of the substrate is copper or a copper alloy. 8. The contact element of claim 6 , wherein a material of the electrically conductive layer is different from a material of the substrate. 9. The contact element of claim 1 , further comprising: a substrate; and an intermediate layer disposed between the substrate and at least one of the masking layer and the electrically conductive layer. 10. The contact element of claim 9 , wherein the intermediate layer has a thickness between approximately 1 μm and approximately 3 μm. 11. The contact element of claim 9 , wherein a material of the intermediate layer contains one of nickel or a nickel alloy. 12. A method for producing a contact element, comprising: masking a substrate of the contact element with a masking layer; forming an unmasked region by partially removing the masking layer without removing a corresponding portion of the substrate covered by the masking layer; and after the step of forming the unmasked region, depositing an electrically conductive layer in at least part of the unmasked region. 13. The method of claim 12 , further comprising providing an intermediate layer between the substrate and at least one of the masking layer and the electrically conductive layer. 14. The method of claim 12 , wherein the masking layer includes at least one of an electrically conductive filler medium and a lubricating filler medium. 15. The method of claim 12 , wherein the forming step includes displacing parts of the masking layer with a displacement member. 16. The method of claim 12 , wherein the masking layer includes a photosensitive filler medium. 17. The method of claim 16 , wherein the forming step includes illuminating the masking layer and photochemically developing an illuminated portion or a non-illuminated portion of the masking layer for partial removal.
characterised by the form or material of the contacting members (H01R4/01 takes precedence) · CPC title
for manufacturing contact members, e.g. by punching and by bending · CPC title
characterised by the material, e.g. plating, or coating materials · CPC title
Conductive coating · CPC title
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