Method, computer program product and system for detecting manufacturing process defects

Patent metadata

Field	Value
Publication number	US-10957567-B2
Application number	US-201916683145-A
Country	US
Kind code	B2
Filing date	Nov 13, 2019
Priority date	May 17, 2017
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

A system, computer program product and a method for detecting manufacturing process defects, the method may include: obtaining multiple edge measurements of one or more structural elements after a completion of each one of multiple manufacturing phases; generating spatial spectrums, based on the multiple edge measurements, for each one of the multiple manufacturing phases; determining relationships between bands of the spatial spectrums; and identifying at least one of the manufacturing process defects based on the relationships between the bands of the spatial spectrums.

First claim

We claim:

1. A method for detecting manufacturing process defects, the method comprising:
obtaining multiple edge measurements of one or more structural elements after a completion of each one out of multiple manufacturing phases, the multiple edge measurements including at least one of critical dimension (CD) measurements, edge roughness measurements, or overlay measurements;
generating spatial spectrums, based on the multiple edge measurements, for each one of the multiple manufacturing phases;
segmenting each of the spatial spectrums to define multiple bands;
determining relationships between the spatial spectrums within each of the multiple bands using a spatial frequency-based comparison; and
identifying at least one of the manufacturing process defects based on the relationships between the spatial spectrums in at least one of the multiple bands.

2. The method according to claim 1 wherein the obtaining of the multiple edge measurements comprises irradiating, by a charged particle metrology tool, edges of the one or more structural elements.

3. The method according to claim 1 wherein the obtaining of the multiple edge measurements comprise obtaining tilted images of the one or more structural elements.

4. The method according to claim 1 wherein the obtaining of the multiple edge measurements comprising obtaining bottom edge measurements and top edge measurements of the structural elements.

5. The method according to claim 1 further comprising forcing a modification of one or more manufacturing process parameters when finding the at least one of the manufacturing process defects.

6. The method according to claim 1 further comprising receiving or generating one or more reference spatial spectrums, and determining relationships between the spatial spectrums and the one or more reference spatial spectrums within each of the multiple bands.

7. The method according to claim 1 wherein the one or more structural elements comprise a mandrel, a spacer, spacer elements and intermediate layer elements that are formed by applying a etch process on the spacer elements.

8. A non-transitory computer program product that stores instructions that when executed by a processor causes a defect detection system to perform steps comprising:
obtaining multiple edge measurements of one or more structural elements after a completion of each one of multiple manufacturing phases;
generating spatial spectrums, based on the multiple edge measurements, for each one of the multiple manufacturing phases;
segmenting each of the spatial spectrums to define multiple bands;
determining relationships between the spatial spectrums within each of the multiple bands using a spatial frequency-based comparison; and
identifying at least one manufacturing process defect based on the relationships between the spatial spectrums in at least one of the multiple bands.

9. The non-transitory computer program product according to claim 8 wherein the obtaining of the multiple edge measurements comprises:
irradiating, by a charged particle metrology tool, edges of the one or more structural elements, obtaining tilted images of the one or more structural elements, and/or
obtaining bottom edge measurements and top edge measurements of the structural elements.

10. The non-transitory computer program product according to claim 8 further comprising instructions for forcing a modification of one or more manufacturing process parameters when finding the at least one of the manufacturing process defects.

11. The non-transitory computer program product according to claim 8 further comprising instructions for receiving or generating one or more reference spatial spectrums, and determining relationships between the spatial spectrums and bands of the one or more reference spatial spectrums within each of the multiple bands.

12. The non-transitory computer program product according to claim 8 wherein the one or more structural elements comprise a mandrel, a spacer, spacer elements and intermediate layer elements that are formed by applying a etch process on the spacer elements.

13. A system that comprises a processor and a memory unit, wherein the memory unit is constructed and arranged to store multiple edge measurements of one or more structural elements after a completion of each one out of multiple manufacturing phases, the multiple edge measurements including at least one of critical dimension (CD) measurements, edge roughness measurements, or overlay measurements; wherein the processor is constructed and arranged to (a) generate spatial spectrums, based on the multiple edge measurements, for each one of the multiple manufacturing phases; (b) segmenting each of the spatial spectrums to define multiple bands; (c) determine relationships between the spatial spectrums within each of the multiple bands using a spatial frequency-based comparison; and (d) identify at least one manufacturing process defect based on the relationships between the spatial spectrums in at least one of the multiple bands.

Assignees

• Applied Materials Israel Ltd

Inventors

• Amzaleg Moshe
• Adan Ofer

Classifications

• H10P76/4088

  Processes for improving the resolution of the masks · CPC title

• H10P76/4085 Primary

  characterised by the processes involved to create the masks · CPC title

• H10P76/4083

  characterised by their behaviours during the lithography processes, e.g. soluble masks or redeposited masks · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0421

  for drying etching · CPC title