Composition for surface treatment and surface treatment method using the same

Patent metadata

Field	Value
Publication number	US-10954479-B2
Application number	US-201716320432-A
Country	US
Kind code	B2
Filing date	Jun 13, 2017
Priority date	Jul 26, 2016
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

The present invention relates to a composition for surface treatment including: a phosphonic acid compound containing two or more nitrogen atoms; and water, wherein the pH is 6 or less, and the composition for surface treatment is used for treating a surface of a polishing-completed object to be polished having a tungsten-containing layer. According to the present invention, there is provided a means capable of inhibiting dissolution of the tungsten-containing layer provided on a polishing-completed object to be polished when a surface treatment is performed.

First claim

The invention claimed is:

1. A surface treatment method comprising: surface-treating a polishing-completed object to be polished having a tungsten-containing layer using a composition for surface treatment, wherein the composition for surface treatment comprises:
a phosphonic acid compound containing two or more nitrogen atoms; and
water,
wherein the pH is 6 or less.

2. The surface treatment method according to claim 1 , wherein the phosphonic acid compound is a compound represented by Formula (1) below or a salt thereof:

in Formula (1),
Y 1 and Y 2 are each independently a linear or branched alkylene group having 1 or more and 5 or less carbon atoms,
n is an integer of 0 or more and 4 or less, and
R 1 to R 5 each independently represent a hydrogen atom, a substituted or unsubstituted linear or branched alkyl group having 1 or more and 5 or less carbon atoms,
wherein one or more of R 1 to R 5 is an alkyl group substituted with a phosphonic acid group.

3. The surface treatment method according to claim 2 , wherein in Formula (1), at least four of R 1 to R 5 are alkyl groups substituted with a phosphonic acid group.

4. The surface treatment method according to claim 1 , wherein the phosphonic acid compound includes at least one selected from the group consisting of
ethylenediamine tetraethylenephosphonic acid,
ethylenediamine tetramethylenephosphonic acid,
diethylenetriamine pentaethylenephosphonic acid,
diethylenetriamine pentamethylenephosphonic acid,
triethylenetetramine hexaethylenephosphonic acid,
triethylenetetramine hexamethylenephosphonic acid,
propanediamine tetraethylenephosphonic acid, and
propanediamine tetramethylenephosphonic acid, and ammonium salts, potassium salts, sodium salts, and lithium salts of these acids.

5. The surface treatment method according to claim 1 , wherein the pH of the surface treatment composition is 4 or less.

6. The surface treatment method according to claim 1 , wherein in the surface treatment composition, abrasive grains are not substantially contained.

7. The surface treatment method according to claim 1 , wherein the surface treatment composition further comprises:
a polymer compound having a sulfonic acid (salt) group.

8. The surface treatment method according to claim 7 , wherein the polymer compound having the sulfonic acid (salt) group includes at least one selected from the group consisting of sulfonic acid group-containing polyvinyl alcohol, sulfonic acid group-containing polystyrene, sulfonic acid group-containing polyvinyl acetate, sulfonic acid group-containing polyester, and a copolymer of (meth) acrylic group-containing monomer-sulfonic acid group-containing monomer, and sodium salts, potassium salts, calcium salts, magnesium salts, amine salts, and ammonium salts thereof.

9. The surface treatment method according to claim 7 , wherein a mass ratio of the phosphonic acid compound to the polymer compound having the sulfonic acid (salt) group exceeds 1.

10. The surface treatment method according to claim 1 , wherein the composition for surface treatment further comprises:
an acid.

11. The surface treatment method according to claim 1 , wherein the surface treatment is performed by rinse polishing or cleaning.

Assignees

• Fujimi Inc

Inventors

• Ishida Yasuto

Classifications

• H10P70/27

  during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title

• H10P95/062

  involving a dielectric removal step · CPC title

• H10P70/277 Primary

  the processing being a planarisation of conductive layers · CPC title

• H10P70/237

  the processing being a planarisation of insulating layers · CPC title

• C11D3/36

  containing phosphorus {(C11D3/162, C11D3/164, C11D3/166, C11D3/168 take precedence)} · CPC title