Cutting apparatus

Patent metadata

Field	Value
Publication number	US-10950451-B2
Application number	US-201916356068-A
Country	US
Kind code	B2
Filing date	Mar 18, 2019
Priority date	Mar 20, 2018
Publication date	Mar 16, 2021
Grant date	Mar 16, 2021

Abstract

A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a processing mode registration section in which commands to be output to components. The processing mode registration section registers therein a command in a cutting apparatus mode that causes the cutting unit to cut the workpiece and a command in an ultraviolet ray irradiation apparatus mode that causes the ultraviolet ray irradiation unit to irradiate the frame unit with ultraviolet rays.

First claim

What is claimed is:

1. A cutting apparatus, comprising:
a base;
a chuck table that holds a frame unit, the frame unit including an annular frame, an adhesive tape affixed to the annular frame and having adhesion reduced by being irradiated with ultraviolet rays, and a workpiece to which the adhesive tape is affixed;
a cutting unit on said base that cuts with a cutting blade the workpiece included in the frame unit held by the chuck table;
a cleaning unit on said base that cleans the frame unit including the workpiece cut by the cutting unit;
an ultraviolet ray irradiation unit on said base that irradiates the adhesive tape of the frame unit with ultraviolet rays;
a cassette placement unit in which a cassette is configured to house a plurality of the frame units;
a conveyance unit that conveys the frame unit to and from the cassette placed on the cassette placement unit, the chuck table, the cleaning unit, and the ultraviolet ray irradiation unit; and
a control unit that controls components including the cutting unit, the cleaning unit, the ultraviolet ray irradiation unit, and the conveyance unit,
wherein the control unit includes a processing mode registration section, which registers an output command to be output by the control unit to each of the components,
wherein the processing mode registration section registers therein:
a first command corresponding with a cutting apparatus mode, wherein the cutting apparatus mode causes:
the cutting unit to cut the workpiece included in the frame unit unloaded from the cassette and held by the chuck table,
the cleaning unit to clean the workpiece included in the frame unit,
the ultraviolet ray irradiation unit to irradiate the workpiece included in the frame unit, with ultraviolet rays,
and the conveyance unit to convey and load the frame unit including the cut workpiece onto the cassette, and

a second command, which is different from said first command, corresponding with an ultraviolet ray irradiation apparatus mode, wherein the ultraviolet ray irradiation apparatus mode causes the ultraviolet ray irradiation unit to irradiate the frame unit unloaded from the cassette with ultraviolet rays, without causing the cutting unit to cut the workpiece included in the frame unit, and causes the conveyance unit to convey and load onto the cassette, the frame unit that has been irradiated with the ultraviolet rays, and

the control unit acquires from the processing mode registration section, the output command, which includes the first command or the second command, the output command corresponding to the processing to be performed for the frame unit and outputs the output command to the corresponding component.

2. The cutting apparatus according to claim 1 , wherein the processing mode registration section further registers a third command corresponding with a cleaning apparatus mode that causes the cleaning unit to clean the frame unit unloaded from the cassette, without causing the cutting unit to cut the workpiece included in the frame unit, and that causes the conveyance unit to convey and load the cleaned frame unit onto the cassette; and
the control unit acquires from the processing mode registration section, the output command, which includes the first command, the second command or the third command, the output command corresponding to the processing to be performed for the frame unit and outputs the output command to the corresponding component.

3. The cutting apparatus according to claim 1 , wherein the cassette is configured to receive a plurality of the frame units.

4. The cutting apparatus according to claim 1 , wherein the ultraviolet ray irradiation unit is mounted in the cassette placement unit.

5. The cutting apparatus according to claim 4 , wherein the cassette placement unit includes support frames configured for supporting the frame unit and the ultraviolet ray irradiation unit includes a plurality of ultraviolet light sources disposed between the support frames.

6. The cutting apparatus according to claim 1 , wherein the control unit simultaneously acquires from the processing mode registration section, a first output command that includes the first command, and a second output command that includes the second command, the first and second output commands corresponding to the processing to be performed for at least two frame units and outputs the first and second output commands to the corresponding components.

Assignees

• Disco Corp

Inventors

• Arakida Hisashi
• Hiraga Hiroyuki

Classifications

• H10P70/10

  Cleaning before device manufacture, i.e. Begin-Of-Line process · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/76

  using mechanical means, e.g. clamps or pinches · CPC title

• H10P72/34

  the wafers being stored in a carrier, involving loading and unloading · CPC title