Transient liquid phase bonding of surface coatings metal-covered materials

Patent metadata

Field	Value
Publication number	US-10933489-B2
Application number	US-201414903844-A
Country	US
Kind code	B2
Filing date	Jul 9, 2014
Priority date	Jul 9, 2013
Publication date	Mar 2, 2021
Grant date	Mar 2, 2021

Abstract

A method for bonding components is disclosed. The method may comprise positioning an interlayer between a metallic component and a metal-plated non-metallic component at a bond region, heating the bond region to a bonding temperature to produce a liquid at the bond region, and maintaining the bond region at the bonding temperature until the liquid has solidified to form a bond between the metallic component and the metal-plated non-metallic component at the bond region. A method for providing a part having a customized coating is also disclosed. The method may comprise applying a metallic coating on a surface of a metallic substrate, and bonding the metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating.

First claim

What is claimed:

1. A method of bonding components, the method comprising:
positioning an interlayer between a metallic component and a metal-plated polymer component at a bond region, wherein the interlayer comprises an element selected from the group consisting of gallium, indium, selenium, tin, bismuth, iodine, polonium, cadmium, and combinations thereof;
heating the bond region to a bonding temperature to produce a liquid at the bond region; and
maintaining the bond region at the bonding temperature until the liquid produced at the bond region has solidified to form a bond between the metallic component and the metal-plated polymer component at the bond region.

2. The method of claim 1 , further comprising:
homogenizing the bond.

3. The method of claim 1 , wherein the metallic component is selected from the group consisting of metal-plated polymers and metal-plated composites.

4. The method of claim 1 , wherein one of the metallic component and the metal-plated polymer component is selected from the group consisting of ribs, bosses, flanges, channels, clamps, covers, ducts and brackets.

5. The method of claim 1 , wherein the interlayer comprises:
a first layer having a first thickness;
a second layer adjacent the first layer and having a second thickness greater than the first; and
a third layer adjacent the second layer on a side generally opposite the first layer.

6. The method of claim 5 , wherein the first layer comprises an element selected from the group consisting of gallium, indium, selenium, tin, bismuth, iodine, polonium, cadmium, and combinations thereof.

7. The method of claim 5 , wherein the second layer comprises an element selected from the group consisting of refractory metals, nickel, iron, cobalt, gold, magnesium, silver, copper, antimony, manganese, palladium, strontium, tellurium, ytterbium, aluminum, calcium, europium, gadolinium, germanium, platinum, rhodium, thulium, vanadium and combinations thereof.

8. The method of claim 5 , wherein the third layer comprises an element selected from the group consisting of gallium, indium, selenium, tin, bismuth, iodine, polonium, cadmium, and combinations thereof.

9. The method of claim 1 , wherein the metal-plated polymer component comprises:
a polymer component comprising a polymer selected from the group consisting of polyphenylene sulfides, polyamides, polyvinylchloride (PVC), polystyrene (PS), polyethylene (PE), polypropylene (PP), styrene-acrylonitrile (SAN), polycarbonate (PC), acrylonitrile styrene acrylate (ASA), acrylonitrile butadiene styrene (ABS), ethylene tetrafluoroethylene fluoropolymer (ETFE), high impact polystyrene (HIPS), polyamide (PA), polybutylene terephthalate (PBT), polyetherimide (PEI), perchloroethylene (PCE), polyether sulfone (PES), polyethylene terephthalate (PET), polysulfone (PSU), polyurethane (PUR), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), polyethermide (PEI), thermoplastic polyimide, condensation polyimide, addition polyimide, polyether ketone ketone (PEKK), polysulfone, polyphenylsuilfide, polyester, epoxy cured with aliphatic and/or aromatic amines and/or anhydrides, cyanate esters, phenolics, polyacrylates, polymethacrylates, silicones (thermoset), and combinations thereof; and
a metallic layer covering at least a portion of the polymer component such that the metallic layer is located at the bond region.

10. The method of claim 1 , wherein the metal-plated polymer component is a metal-plated composite comprising:
a polymer composite component; and
a metallic layer covering at least a portion of the composite component such that the metallic layer is located at the bond region.

Assignees

• United Technologies Corp
• Raytheon Tech Corp

Inventors

• Cook Iii Grant O

Classifications

• B23K35/3612

  with organic compounds as principal constituents · CPC title

• B23K20/233

  without ferrous layer · CPC title

• B23K2103/42

  Plastics other than composite materials · CPC title

• B23K2101/34

  Coated articles {; Surface treated articles} · CPC title

• B23K2103/18

  Dissimilar materials · CPC title