Semiconductor apparatus

Patent metadata

Field	Value
Publication number	US-10930736-B2
Application number	US-201816135014-A
Country	US
Kind code	B2
Filing date	Sep 19, 2018
Priority date	Feb 20, 2018
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

A semiconductor apparatus includes: an insulating substrate including an insulating layer having first and second main surfaces, a metal plate on the first main surface, and first to fourth conductors on the second main surface; a semiconductor device including a rear electrode electrically connected to the first conductor and a front electrode electrically connected to the second conductor; a temperature detection device including a first electrode electrically connected to the third conductor and a second electrode electrically connected to the fourth conductor; a first terminal electrically connected to the third conductor; a second terminal positioned so as to be wire-connectable to the fourth conductor; and a third terminal electrically connected to the second conductor, wherein the fourth conductor is positioned so as to be wire-connectable to the second conductor.

First claim

The invention claimed is:

1. A semiconductor apparatus comprising:
an insulating substrate including an insulating layer having a first main surface and a second main surface, a metal plate on the first main surface, and a first conductor, a second conductor, a third conductor and a fourth conductor on the second main surface;
a semiconductor device including a rear electrode electrically connected to the first conductor and a front electrode electrically connected to the second conductor;
a temperature detection device including a first electrode electrically connected to the third conductor, a second electrode electrically connected to the fourth conductor, and comprising a resistor having temperature dependency, and an active region of the resistor is positioned between the first electrode connected to the third conductor and the second electrode connected to the fourth conductor;
a first terminal electrically connected to the third conductor;
a second terminal positioned so as to be wire-connectable to the fourth conductor;
a third terminal electrically connected to the second conductor; and
case resin covering the semiconductor device and the temperature detection device,
wherein the fourth conductor is positioned so as to be wire-connectable to the second conductor, and
each of the first terminal, the second terminal and the third terminal includes a terminal part projecting from the case resin for electric connection with an outside of the semiconductor apparatus and a wire-bonding part for wiring inside the semiconductor apparatus.

2. The semiconductor apparatus according to claim 1 , wherein the fourth conductor is electrically connected to the second terminal.

3. The semiconductor apparatus according to claim 1 , wherein the fourth conductor is electrically connected to the second conductor.

4. The semiconductor apparatus according to claim 1 , wherein the second terminal and the third terminal are positioned so as to be wire-connectable together.

5. The semiconductor apparatus according to claim 1 , wherein the semiconductor device is made of a wide-band-gap semiconductor, which has a wider band gap than a band gap of silicon.

6. The semiconductor apparatus according to claim 1 , wherein the second electrode outputs a signal including information on a temperature inside the semiconductor apparatus when the second electrode is connected to a temperature measuring instrument.

Assignees

• Mitsubishi Electric Corp

Inventors

• Masuda Koichi

Classifications

• H10W76/12

  characterised by their shape · CPC title

• H10W44/501

  Inductive arrangements (H10W44/20 takes precedence) · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10W72/5475

  multiple bond wires connected to common bond pads at both ends of the wires · CPC title