Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US-2017037528-A1 · Feb 9, 2017 · US
Copper electroplating compositions and methods of electroplating copper on substrates
US10927468B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10927468-B2 |
| Application number | US-201916571540-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 16, 2019 |
| Priority date | Nov 8, 2017 |
| Publication date | Feb 23, 2021 |
| Grant date | Feb 23, 2021 |
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- Title
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Abstract
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Copper electroplating compositions which include an imidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
First claim
Opening claim text (preview).
What is claimed is: 1. A composition consisting of water, one or more sources of copper ions and corresponding anions of the one or more sources of copper ions, one or more electrolytes, one or more accelerators, one or more suppressors, and one or more imidazole compounds having a formula: wherein R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are independently chosen from hydrogen, linear or branched (C 1 -C 4 )alkyl, and phenyl, and one or more additives chosen from one or more sources of halide ions, buffers, antimicrobial agents, surfactants, and defoaming agents. 2. The composition of claim 1 , wherein the one or more imidazole compounds are in amounts of 0.25 ppm to 1000 ppm. 3. The composition of claim 1 , wherein R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are independently chosen from hydrogen and (C 1 -C 2 )alkyl. 4. The composition of claim 3 , wherein R 1 , R 2 , R 3 and R 4 are independently chosen from hydrogen; and methyl and R 5 and R 6 are hydrogen.
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Classifications
of organic photoresist masks · CPC title
Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Soldering or alloying · CPC title
by plating, e.g. electroless plating or electroplating · CPC title
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- What does patent US10927468B2 cover?
- Copper electroplating compositions which include an imidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
- Who is the assignee on this patent?
- Rohm & Haas Elect Mat
- What technology area does this patent fall under?
- Primary CPC classification C25D3/38. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Feb 23 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).