Method and apparatus for polishing a substrate, and method for processing a substrate

Patent metadata

Field	Value
Publication number	US-10926376-B2
Application number	US-201816003779-A
Country	US
Kind code	B2
Filing date	Jun 8, 2018
Priority date	Aug 17, 2017
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

First claim

What is claimed is:

1. A polishing method comprising:
rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and
polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate without rotating the polishing tool about its axis, while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate by a polishing head, the polishing tool being located at a lower side of the substrate, the polishing head having its central axis perpendicular to the back surface of the substrate.

2. The polishing method according to claim 1 , wherein said moving the polishing tool relative to the substrate comprises moving the polishing tool between a center and an outermost end of the back surface of the substrate while causing the polishing tool to perform a translational rotary motion which is a movement of the polishing tool in a circular orbit without rotation of the polishing tool about its axis.

3. The polishing method according to claim 1 , wherein said moving the polishing tool relative to the substrate comprises moving the polishing tool between a center and an outermost end of the back surface of the substrate while causing the polishing tool to reciprocate in directions parallel to the back surface of the substrate.

4. The polishing method according to claim 3 , wherein said causing the polishing tool to reciprocate comprises causing the polishing tool to oscillate in directions parallel to the back surface of the substrate.

5. The polishing method according to claim 1 , wherein the liquid is pure water or an alkaline liquid chemical.

6. The polishing method according to claim 1 , wherein the polishing tool is a polishing tape having abrasive grains on a surface thereof.

7. A substrate processing method comprising:
transporting a substrate from a loading and unloading section to a polishing unit;
polishing an entirety of a back surface of the substrate by the polishing unit;
cleaning the polished substrate by a cleaning unit;
drying the cleaned substrate by a drying unit; and
transporting the dried substrate to the loading and unloading section,
wherein transporting of the substrate to the polishing unit, polishing of the entirety of the back surface of the substrate, cleaning of the polished substrate, drying of the cleaned substrate, and transporting of the dried substrate to the loading and unloading section are performed with the back surface of the substrate facing downward, and
wherein polishing of the entirety of the back surface of the substrate by the polishing unit comprises:
rotating the substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with the back surface of the substrate facing downward; and
polishing the entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

8. A polishing apparatus comprising:
a substrate holder configured to hold a substrate and rotate the substrate;
a polishing head configured to bring a polishing tool into contact with a back surface of the substrate; and
a polishing-head actuator configured to move the polishing head relative to the substrate without rotating the polishing tool about its axis when the substrate is held by the substrate holder,
wherein the substrate holder comprises a plurality of rollers,
the rollers are rotatable about their respective own axes,
the rollers have substrate holding surfaces which can contact a periphery of the substrate,
the polishing head is disposed below the substrate holding surfaces, and faces upward, and
the polishing head has a central axis parallel to the axes of the rollers.

9. The polishing apparatus according to claim 8 , wherein the polishing-head actuator comprises a polishing-head driving mechanism configured to cause the polishing head to perform a circular motion or oscillate.

10. The polishing apparatus according to claim 9 , wherein the polishing-head actuator further comprises a polishing-head moving mechanism configured to cause the polishing head to perform a translational rotary motion which is a movement of the polishing head in a circular orbit without rotation of the polishing tool about its axis.

11. The polishing apparatus according to claim 10 , wherein:
the polishing-head moving mechanism includes a motor, an eccentric rotation body secured to a rotating shaft of the motor, a table coupled to the eccentric rotation body via a first bearing, and a plurality of cranks supporting the table; and
an axis of the eccentric rotation body is located away from an axis of the rotating shaft of the motor by a predetermined distance.

12. The polishing apparatus according to claim 11 , wherein each of the plurality of cranks includes a first shaft member and a second shaft member secured to each other, and an axis of the first shaft member is located away from an axis of the second shaft member by the predetermined distance.

13. The polishing apparatus according to claim 12 , wherein the polishing-head moving mechanism further includes a mount base to which the motor is secured, wherein the first shaft member is rotatably supported by a second bearing held by the table, and the second shaft member is rotatably supported by a third bearing secured to the mount base.

14. The polishing apparatus according to claim 9 , wherein the polishing-head driving mechanism includes a motor, a crank secured to a rotating shaft of the motor, a linkage coupled to the crank, and a linear motion guide supporting the linkage.

15. The polishing apparatus according to claim 14 , wherein the linkage includes a first link rotatably coupled to the crank, a second link supported by the linear motion guide, and a joint coupling the first link to the second link.

16. The polishing apparatus according to claim 15 , wherein the polishing-head driving mechanism further includes a mount base to which the motor is secured, wherein the linear motion guide is secured to the mount base.

17. The polishing apparatus according to claim 8 , wherein the polishing tool is a polishing tape having abrasive grains on a surface thereof.

Assignees

• Ebara Corp

Inventors

• Nakanishi Masayuki
• Ishii Yu
• Ito Kenya
• Uchiyama Keisuke
• Kashiwagi Makoto

Classifications

• H10P72/76

  using mechanical means, e.g. clamps or pinches · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B37/10

  for single side lapping · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title