Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-9566616-B2
Application number	US-201414315283-A
Country	US
Kind code	B2
Filing date	Jun 25, 2014
Priority date	Jun 28, 2013
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

First claim

What is claimed is:

1. A substrate processing apparatus for processing a substrate having a first surface and a second surface, the second surface being an opposite surface of the first surface, the substrate processing apparatus comprising:
a scrubber configured to place a scrubbing member in sliding contact with the first surface of the substrate to process the first surface;
a hydrostatic support structure configured to support the second surface of the substrate via fluid without contacting the substrate;
at least one distance sensor configured to measure a distance between the scrubber and the hydrostatic support structure; and
a processing controller configured to calculate a gap between the hydrostatic support structure and the second surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

2. The substrate processing apparatus according to claim 1 , wherein the processing controller is configured to subtract a present measured value of the distance from an initial measured value of the distance to determine an amount of decrease in a thickness of the substrate that has been processed by the scrubbing member.

3. The substrate processing apparatus according to claim 1 , wherein:
the at least one distance sensor comprises a plurality of distance sensors arrayed along a radial direction of the substrate; and
the processing controller is configured to
calculate gaps between the hydrostatic support structure and the second surface of the substrate from measured values of the distance obtained by the distance sensors,
determine whether the calculated gaps fall in the predetermined range or not, and
subtract present measured values of the distance from corresponding initial measured values of the distance, respectively, to obtain a distribution of amounts of decrease in a thickness of the substrate that has been processed by the scrubbing member.

4. The substrate processing apparatus according to claim 1 , wherein:
the at least one distance sensor comprises a distance sensor movable along a radial direction of the substrate; and
the processing controller is configured to
calculate gaps between the hydrostatic support structure and the second surface of the substrate from measured values of the distance obtained at measuring points by the distance sensor,
determine whether the calculated gaps fall in the predetermined range or not, and
subtract present measured values of the distance from corresponding initial measured values of the distance, respectively, to obtain a distribution of amounts of decrease in a thickness of the substrate that has been processed by the scrubbing member.

5. A substrate processing apparatus for processing a substrate having a first surface and a second surface, the second surface being an opposite surface of the first surface, the substrate processing apparatus comprising:
a scrubber configured to place a scrubbing member in sliding contact with the first surface of the substrate to process the first surface;
a hydrostatic support structure configured to support the second surface of the substrate via fluid without contacting the substrate;
at least one distance sensor configured to measure a distance between the scrubber and the hydrostatic support structure; and
a processing controller configured to subtract a present measured value of the distance from an initial measured value of the distance to determine an amount of decrease in a thickness of the substrate that has been processed by the scrubbing member.

6. The substrate processing apparatus according to claim 5 , wherein the processing controller is configured to calculate a gap between the hydrostatic support structure and the second surface of the substrate from a measured value of the distance and determine whether the calculated gap falls within a predetermined range or not.

7. The substrate processing apparatus according to claim 5 , wherein:
the at least one distance sensor comprises a plurality of distance sensors arrayed along a radial direction of the substrate; and
the processing controller is configured to subtract present measured values of the distance from corresponding initial measured values of the distance, respectively, which are obtained at measuring points by the distance sensors to obtain a distribution of amounts of decrease in the thickness of the substrate that has been processed by the scrubbing member.

8. The substrate processing apparatus according to claim 5 , wherein:
the at least one distance sensor comprises a distance sensor movable along a radial direction of the substrate; and
the processing controller is configured to subtract present measured values of the distance from corresponding initial measured values of the distance, respectively, which are obtained by the distance sensor to obtain a distribution of amounts of decrease in the thickness of the substrate that has been processed by the scrubbing member.

9. A substrate processing apparatus for processing a substrate having a first surface and a second surface, the second surface being an opposite surface of the first surface, the substrate processing apparatus comprising:
a scrubber configured to place a scrubbing member in sliding contact with the first surface of the substrate to process the first surface;
a hydrostatic support structure having a substrate support surface configured to support the second surface of the substrate via fluid without contacting the substrate, the hydrostatic support structure having fluid discharge ports which are open in the substrate support surface;
distance sensors each configured to measure a distance between the substrate and the hydrostatic support structure; and
a processing controller configured to determine whether measured values of the distance obtained by the distance sensors fall within a predetermined range or not.

10. The substrate processing apparatus according to claim 9 , wherein the distance sensors comprise at least three distance sensors.

11. The substrate processing apparatus according to claim 10 , wherein the at least three distance sensors are arranged at equal angular intervals around a predetermined central point.

12. The substrate processing apparatus according to claim 9 , wherein the processing controller is configured to detect a point of time when the scrubbing member is brought into contact with the first surface of the substrate based on a change in the measured values of the distance.

13. The substrate processing apparatus according to claim 9 , further comprising:
flow-rate regulating valves configured to regulate flow rates of the fluid to be supplied to the fluid discharge ports,
wherein the processing controller is configured to control operations of the flow-rate regulating valves based on the measured values of the distance obtained by the distance sensors.

Assignees

• Ebara Corp

Inventors

• Togawa Tetsuji
• Ito Kenya
• Ishii Yu
• Uchiyama Keisuke

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/76

  using mechanical means, e.g. clamps or pinches · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title