Polishing method and polishing apparatus
US-2015140907-A1 · May 21, 2015 · US
US9773686B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9773686-B2 |
| Application number | US-201414501733-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 30, 2014 |
| Priority date | Oct 3, 2013 |
| Publication date | Sep 26, 2017 |
| Grant date | Sep 26, 2017 |
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Official abstract text for this publication.
A substrate cleaning apparatus for reducing a limitation of a layout of a chemical liquid nozzle and a rinsing liquid nozzle, while enabling a load cell to be installed at an optimal location and achieving a larger adjustment range, is disclosed. The substrate cleaning apparatus includes a roll assembly including at least a roll cleaning member to be brought into contact with a substrate and a roll arm that rotatably supports the roll cleaning member; a support arm for supporting the roll assembly; an adjustment screw extending through the support arm and screwed into the roll assembly; and a screw support that fixes a relative position of the adjustment screw in a vertical direction with respect to the support arm and rotatably supports the adjustment screw.
Opening claim text (preview).
What is claimed is: 1. A substrate cleaning apparatus, comprising: a roll arm for rotatably supporting a roll cleaning member to be brought into contact with a substrate; a support arm supporting the roll arm; an adjustment screw vertically extending through the support arm and supporting the roll arm, the adjustment screw being rotatable to adjust a height of an entirety of the roll arm relative to the support arm; a screw support that fixes a relative position of the adjustment screw in a vertical direction with respect to the support arm and rotatably supports the adjustment screw; an actuator configured to move the roll arm, the adjustment screw, and the support arm together in the vertical direction; and a backup guide that restricts a rotation of the roll arm relative to the support arm when the adjustment screw rotates. 2. The substrate cleaning apparatus according to claim 1 , further comprising: a tilting mechanism that allows the roll arm to tilt; the adjustment screw is screwed into the tilting mechanism. 3. The substrate cleaning apparatus according to claim 1 , further comprising: a biasing device biasing the roll arm toward the support arm. 4. The substrate cleaning apparatus according to claim 1 , further comprising: a fixing device for fixing a rotational position of the adjustment screw. 5. The substrate cleaning apparatus according to claim 1 , further comprising: a waterproof cover that covers a portion of the adjustment screw protruding from the support arm. 6. A substrate processing apparatus, comprising: a polishing unit configured to polish a substrate; and a substrate cleaning apparatus configured to clean the polished substrate, the substrate cleaning apparatus comprising: a roll arm for rotatably supporting a roll cleaning member to be brought into contact with the substrate; a support arm supporting the roll arm; an adjustment screw vertically extending through the support arm and supporting the roll arm, the adjustment screw being rotatable to adjust a height of an entirety of the roll arm relative to the support arm; a screw support that fixes a relative position of the adjustment screw in a vertical direction with respect to the support arm and rotatably supports the adjustment screw; an actuator configured to move the roll arm, the adjustment screw, and the support arm together in the vertical direction; and a backup guide that restricts a rotation of the roll arm relative to the support arm when the adjustment screw rotates. 7. The substrate cleaning apparatus according to claim 1 , wherein the screw support is fixed to the support arm. 8. The substrate cleaning apparatus according to claim 1 , wherein the roll arm is supported by a free end of the support arm through the adjustment screw. 9. The substrate cleaning apparatus according to claim 1 , wherein the roll arm is located below the support arm. 10. The substrate cleaning apparatus according to claim 1 , wherein the backup guide is located between the support arm and the roll arm. 11. The substrate cleaning apparatus according to claim 3 , wherein the biasing device comprises a spring.
characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title
using mainly spraying means, e.g. nozzles · CPC title
using mainly scrubbing means, e.g. brushes · CPC title
for general liquid treatment, e.g. etching followed by cleaning · CPC title
Cleaning of wafers, substrates or parts of devices · CPC title
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