Packaging a sealed cavity in an electronic device

Patent metadata

Field	Value
Publication number	US-10913654-B2
Application number	US-202016813967-A
Country	US
Kind code	B2
Filing date	Mar 10, 2020
Priority date	Sep 6, 2017
Publication date	Feb 9, 2021
Grant date	Feb 9, 2021

Abstract

An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

First claim

What is claimed is:

1. An electronic device, comprising:
a package substrate;
a circuit assembly mounted on the package substrate, the circuit assembly including a first cavity formed in a device substrate;
a sealing plate attached to the device substrate, enclosing the first cavity and configured to maintain a first pressure within the first cavity; and
a housing attached to the package substrate forming a second cavity about the circuit assembly, and configured to maintain a second pressure within the second cavity.

2. The electronic device of claim 1 , wherein the first cavity includes a channel formed in the device substrate.

3. The electronic device of claim 1 , further comprising a pressure sensor coupled to the sealing plate and configured to measure pressure within the first cavity as a function of displacement of the sealing plate.

4. The electronic device of claim 1 , wherein the sealing plate includes a dielectric membrane.

5. The electronic device of claim 1 , including:
an acoustic sensor coupled to the sealing plate and configured to measure vibration of the sealing plate; and
control circuitry coupled to the acoustic sensor, the control circuitry configured to determine pressure within the first cavity as a function of the mechanical harmonic signature of the sealing plate.

6. The electronic device of claim 1 , including a pressure sensor coupled to the housing and configured to measure pressure within the second cavity as a function of displacement of the housing.

7. The electronic device of claim 1 , including:
an acoustic sensor coupled to the housing and configured to measure vibration of the housing; and
control circuitry coupled to the acoustic sensor, the control circuitry configured to determine pressure within the second cavity as a function of the mechanical harmonic signature of the housing.

8. The electronic device of claim 1 , wherein the first cavity is a waveguide of a millimeter-wave chip scale atomic clock.

Assignees

• Texas Instruments Inc

Inventors

• Fruehling Adam Joseph
• Herbsommer Juan Alejandro
• Jacobs Simon Joshua
• Cook Benjamin Stassen
• Hallas James F
• Long Randy

Classifications

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

• H10W76/60

  Seals · CPC title

• H10W76/136

  having other interconnections perpendicular to the conductive base · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• G04F5/14 Primary

  using atomic clocks · CPC title