Methods, systems, and assemblies for cooling an electronic component

Patent metadata

Field	Value
Publication number	US-10912227-B2
Application number	US-201916598253-A
Country	US
Kind code	B2
Filing date	Oct 10, 2019
Priority date	Jan 12, 2017
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

First claim

What is claimed is:

1. A system for cooling an electronic component, said system comprising:
a cooling fluid source;
a heat sink assembly positioned in thermal contact with said electronic component, the heat sink assembly comprising:
a first substrate including first and second surfaces, said first surface being in thermal contact with said electronic component;
a primary channel formed in said second surface of said first substrate, said primary channel being configured to direct cooling fluid for cooling said electronic component;
an array of primary cooling fluid fins positioned within said primary channel, said array of primary cooling fluid fins including upstream solid fins and downstream open fins, wherein each downstream open fin includes an upstream opening and downstream sidewalls;
a second substrate including first and second surfaces with said first surface of said second substrate positioned in thermal contact with said second surface of said first substrate, said second substrate including cooling fluid conduits having upstream and downstream ends and each being formed through said second substrate from said upstream end at said first surface of said second substrate to said downstream end at said second surface of second substrate;
a secondary channel formed within said second surface of said second substrate, said secondary channel being configured to direct partially heated cooling fluid away from said electronic component;
an array of secondary cooling fluid fins positioned within said secondary channel, each being positioned downstream of said downstream end of one of said fluid conduits;
an enclosing layer for sealing said secondary channel;
a cooling fluid inlet formed in said primary channel; and
a cooling fluid outlet formed in at least one of said enclosing layer and said secondary channel;

conduits for joining said cooling fluid inlet and outlet in fluid communication with said cooling fluid source; and
a pump positioned between said cooling fluid source and said cooling fluid inlet of said heat sink assembly, said pump being configured to draw said cooling fluid from said cooling fluid source and pump it into said heat sink assembly via said cooling fluid inlet and through said heat sink assembly to said cooling fluid outlet.

2. The system according to claim 1 , further comprising a control module including temperature sensors for determining temperatures of said cooling fluid in said cooling fluid source and said conduits and a temperature of a surface of said electronic component adjacent said heat sink assembly.

3. The system according to claim 1 , further comprising a second cooling fluid source in fluid communication with said cooling fluid source.

4. The system according to claim 1 , wherein said heat sink assembly includes said first and second substrates being joined with one another via direct fusion.

5. The system according to claim 1 , wherein said array of secondary cooling fluid fins each include a shroud portion defined around a portion of said downstream end of one of said cooling fluid conduits, said shroud portion being configured to prevent a stagnation zone of partially heated cooling fluid from forming adjacent said downstream end of said one of said cooling fluid conduits.

6. The system according to claim 1 , further comprising a second pump for pumping said cooling fluid from said cooling fluid source, through said heat sink assembly via said cooling fluid inlet and outlet, and back to said cooling fluid source.

7. The system according to claim 1 , wherein said cooling fluid is a hydrofluoroether.

8. A method of cooling an electronic component, said method comprising:
positioning a heat sink assembly including a bi-directional cooling fluid flow path in thermal communication with said electronic component, the heat sink assembly further including an array of primary cooling fluid fins positioned within a first flow path, said array of primary cooling fluid fins including upstream solid fins and downstream open fins, wherein each downstream open fin includes an upstream opening and downstream sidewalls;
providing a supply of a cooling fluid having a first temperature;
directing said cooling fluid having a first temperature through said heat sink assembly in a first direction that is substantially parallel to a plane defined by a surface of said electronic component in thermal communication with said heat sink assembly so that said cooling fluid having a first temperature is in thermal communication with a portion of said heat sink assembly in thermal communication with said electronic component;
directing said cooling fluid having a second temperature that is greater than said first temperature in a second direction that is substantially perpendicular to said plane defined by said surface of said electronic component in thermal communication with said heat sink assembly;
directing said cooling fluid having a second temperature in a third direction that is substantially parallel to said first direction; and
continuously repeating prior steps while said electronic component is energized.

9. The method according to claim 8 , further comprising:
producing recycled cooling fluid by mixing said cooling fluid having a second temperature with cooling fluid having a lower temperature until said cooling fluid having a second temperature is at said first temperature.

10. The method according to claim 9 , wherein said cooling fluid having a lower temperature is said cooling fluid having a first temperature from said supply.

11. The method according to claim 8 , further comprising providing one or more pumps for directing both said cooling fluid having a first temperature and said cooling fluid having a second temperature through said heat sink assembly.

Assignees

• Rensselaer Polytech Inst

Inventors

• Woodcock Corey Christopher
• Plawsky Joel L
• Peles Yoav
• Yu Xiangfei

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20436 Primary

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title