Methods, systems, and assemblies for cooling an electronic component
US-10912227-B2 · Feb 2, 2021 · US
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Patent family 62783688
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62783688 |
| Family type | — |
| Earliest priority | Jan 12, 2017 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US10912227B2 — Methods, systems, and assemblies for cooling an electronic component |
Representative publication
Best representative member for this family based on priority and filing country.
US10912227B2 — Methods, systems, and assemblies for cooling an electronic component (published Feb 2, 2021)
Member publications
Related publications in this family.
Methods, systems, and assemblies for cooling an electronic component
US-2020053913-A1 · Feb 13, 2020 · US
Methods, systems, and assemblies for cooling an electronic component
US-10492334-B2 · Nov 26, 2019 · US
Methods, systems, and assemblies for cooling an electronic component
US-2018199469-A1 · Jul 12, 2018 · US