Residual material removing device, method and, system

Patent metadata

Field	Value
Publication number	US-10906833-B2
Application number	US-201716312596-A
Country	US
Kind code	B2
Filing date	Nov 7, 2017
Priority date	Dec 30, 2016
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

The present application provides a residual material removing device, method and system, in which the residual material removing device includes: a loading platform configured to support a material to be cut; a fixing plate abutting against an upper surface of the material to be cut is configured to fix the material to be cut, and one end of the fixing plate is in contact with a residual material in the material to be cut; a first pressing portion in contact with one end of the fixing plate is configured to apply pressing force to one end of the fixing plate to separate the residual material from the material to be cut under the action of the pressing force.

First claim

What is claimed is:

1. A residual material removing device, comprising:
a loading platform configured to support a material to be cut;
a fixing plate, in tight contact with an upper surface of the material to be cut, and configured to fix the material to be cut, wherein one end of the fixing plate is in contact with the residual material in the material to be cut;
a first pressing portion, in contact with one end of the fixing plate, and configured to apply pressing force to the one end of the fixing plate to separate the residual material from the material to be cut under the action of the pressing force; and
a second pressing portion, connected to an upper surface of the fixing plate and configured to control the fixing plate to move up and down to fix the material to be cut by the fixing plate pressing downward.

2. The residual material removing device of claim 1 , wherein the first pressing portion comprises a pressing end and a fixing end, and the pressing end and the fixing end are connected via an elastic buffer material.

3. The residual material removing device of claim 2 , wherein the elastic buffer material is any one of a non-rubber, a non-silica gel material, a rubber and a silica gel with a hardness lower than glass.

4. The residual material removing device of claim 1 , wherein the residual material removing device further comprises a first drive motor, the first drive motor connected to the first pressing portion and configured to drive the first pressing portion to contact with one end of the fixing plate.

5. The residual material removing device of claim 4 , wherein the first drive motor is a servo motor.

6. The residual material removing device of claim 4 , wherein the residual material removing device further comprises a control portion connected to the first drive motor and configured to control an operating state of the first drive motor.

7. The residual material removing device of claim 1 , wherein the residual material removing device further comprises a second drive motor connected to the second pressing portion and configured to drive the second pressing portion to move up and down.

8. The residual material removing device of claim 7 , wherein the material removing device further comprises a control portion connected to the first drive motor and the second drive motor and configured to control the first drive motor and the second drive motor to move.

9. The residual material removing device of claim 1 , wherein the second pressing portion is a mechanical link or a mechanical arm.

10. The residual material removing device of claim 1 , wherein the residual material removing device further comprises: a conveying portion, disposed at an end of the loading platform away from the first pressing portion and configured to convey the material to be cut to a position of the loading platform right beneath the fixing plate.

11. The residual material removing device of claim 10 , wherein the conveying portion is any one of a mechanical arm, a conveyor, a roller mechanism, and a drive gear.

12. The residual material removing device of claim 1 , wherein the material to be cut is a glass substrate of a liquid crystal display panel.

13. The residual material removing device of claim 1 , wherein the loading platform is a trapezoidal platform or a square platform, or is constituted by a plurality of discrete structures arranged side by side.

14. The residual material removing device of claim 1 , wherein an upper surface of the loading platform is in surface contact, distributed line contact or distributed point contact with a lower surface of the material to be cut.

15. The residual material removing device of claim 1 , wherein the material to be cut is any one of a liquid crystal panel, a glass, a ceramic, a metal material, and a wood.

16. A residual material removing method as implemented via a residual material removing device, the residual material removing device comprises a loading platform, a fixing plate, a first pressing portion, a second pressing portion, and a conveying portion, and the method comprises:
controlling the conveying portion to convey the material to be cut to a position of the loading platform right beneath the fixing plate;
controlling the fixing plate to tightly contact with an upper surface of the material to be cut to fix the material to be cut, and to contact one end of the fixing plate with the residual material in the material to be cut;
controlling the first pressing portion to apply pressing force to one end of the fixing plate to separate the residual material from the material to be cut under the action of the pressing force; and
controlling the second pressing portion to be connected to an upper surface of the fixing plate and control the fixing plate to move up and down to fix the material to be cut by the fixing plate pressing downward.

17. The residual material removing method of claim 16 , the residual material removing method further comprises:
regulating a magnitude of the pressing force applied to one end of the fixing plate by the first pressing portion according to the hardness and the thickness of the material to be cut.

18. A residual material removing system as implemented via a residual material removing device, the residual material removing device comprises a loading platform, a fixing plate, a first pressing portion, a second pressing portion, and a conveying portion, and the residual material removing systems comprises:
a processor, a communication interface, a memory and a bus;
wherein communication of the processor, the communication interface and the memory with one another is achieved via the bus;
the communication interface is configured to communicate with an external device;
the processor is configured to execute a program;
the memory is configured to store the program;
the processor comprises:
a conveying portion controller configured to control the conveying portion to convey the material to be cut to a position of the loading platform right beneath the fixing plate;
a fixing plate controller configured to control the fixing plate to tightly contact with an upper surface of the material to be cut to fix the material to be cut, and to contact one end of the fixing plate with the residual material in the material to be cut;
a first pressing portion controller configured to control the first pressing portion to apply pressing force to one end of the fixing plate to separate the residual material from the material to be cut under the action of the pressing force; and
a second pressing portion controller configured to control the second pressing portion to be connected to an upper surface of the fixing plate to control the fixing plate to move up and down to fix the material to be cut by the fixing plate pressing downward.

19. The residual material removing system of claim 18 , wherein the program specifically comprises:
a pressing force regulator configured to regulate the pressing force applied to one end of the fixing plate by the first pressing portion according to the hardness and the thickness of the material to be cut.

Assignees

• Hkc Corp Ltd
• Chongqing Hkc Optoelectronics Tech Co Ltd

Inventors

• Huang Chunchin

Classifications

• B28D7/005

  Devices for the automatic drive or the program control of the machines · CPC title

• B26F3/002 Primary

  Precutting and tensioning or breaking · CPC title

• B23D31/002

  Breaking machines, i.e. pre-cutting and subsequent breaking · CPC title

• B28D1/00 Primary

  Working stone or stone-like materials, e.g. brick, concrete {or glass}, not provided for elsewhere; Machines, devices, tools therefor (fine working of gems, jewels, crystals B28D5/00; working by grinding or polishing B24; devices or means for dressing or conditioning abrasive surfaces B24B53/00) · CPC title

• G02F1/133302

  Rigid substrates, e.g. inorganic substrates · CPC title