Connector system with air flow and flanges

US10895703B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10895703-B2
Application numberUS-202016773990-A
CountryUS
Kind codeB2
Filing dateJan 28, 2020
Priority dateDec 23, 2014
Publication dateJan 19, 2021
Grant dateJan 19, 2021

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A receptacle includes a cooling channel that is positioned between a top port and a bottom port. A transfer member is positioned in the cooling channel and is configured to direct heat from an inserted plug module into the cooling channel Air flowing through the cooling channel acts to remove thermal energy from the receptacle. A connector system may include a plug module that can be inserted into such a receptacle and the plug module can include grooves to help allow for direct cooling of the plug module, even when inserted into the receptacle.

First claim

Opening claim text (preview).

We claim: 1. A receptacle, comprising: a wafer set defining a first mating interface and a second mating interface, the wafer set supporting a plurality of terminals, the terminals having tails for mounting to a circuit board and contacts configured to engage a mating connector, the contacts extending to a first mating interface and a second mating interface; a cage having a front face and a rear face, the cage defining a top port and a bottom port, the top port aligned with the first mating interface and the bottom port aligned with the second mating interface, the cage further including a cooling channel positioned between the top and bottom port, the cooling channel having a wall adjacent the top port, the cage having at least one of a rear grill on the rear face or a side grill and having a front grill on the front face; a cooling member having a thermal coupling plate and a transfer member, the thermal coupling plate provided proximate the bottom port, the thermal coupling plate thermally coupled to the transfer member positioned in the cooling channel, wherein the front grill is in communication with the at least one rear grill or side grill via the cooling channel and the thermal coupling plate is configured to conduct thermal energy from an inserted plug module to the transfer member, wherein the transfer member is a plurality of fins; and a biasing element positioned between the cooling channel wall adjacent the top port and the cooling member, the biasing element configured to urge the cooling member toward the bottom port. 2. The receptacle of claim 1 , further comprising a housing supporting the wafer set and a communication channel provided on a side of the housing, the communication channel allowing the rear grill to be in communication with the cooling channel. 3. The receptacle of claim 1 , wherein the thermal coupling plate is configured to press against a top surface of a mating plug connector. 4. The receptacle of claim 1 , wherein the thermal coupling plate includes a plurality of spring fingers configured to mate with a top surface of a mating plug connector. 5. The receptacle of claim 1 , wherein the biasing element is configured to urge the cooling member against a top surface of a mating plug connector. 6. The receptacle of claim 1 , wherein the biasing element comprises a plurality of spring fingers. 7. The receptacle of claim 1 , the thermal coupling plate and the transfer member being integrated as a single component. 8. A plug module, comprising: a body having a main portion and a mating portion, the mating portion having a first flange extending toward a distal end and a second flange extending toward the distal end; a plurality of contacts positioned near the distal end of the mating portion and supported by a substrate having a top surface and a bottom surface, the contacts being arranged so as to be at least partially shielded by the first flange, the first flange being positioned above the top surface of the substrate and the second flange being positioned below the bottom surface of the substrate with a surface facing the bottom surface of the substrate, the first flange having a surface facing the top surface of the substrate that has a greater surface area than the surface of the second flange facing the bottom surface of the substrate; a latch provided on the mating portion; and an actuator supported by the main portion, the actuator configured to actuate the latch. 9. The plug module of claim 8 , wherein the substrate is a circuit board. 10. The plug module of claim 8 , wherein the main portion is larger than the mating portion. 11. The plug module of claim 8 , wherein at least one optical fiber is connected to the body.

Assignees

Inventors

Classifications

  • G02B6/3897Primary

    Connectors fixed to housings, casing, frames or circuit boards (G02B6/44528 takes precedence) · CPC title

  • Linking of individual connector plugs to an overconnector, e.g. using clamps, clips, common housings comprising several individual connector plugs · CPC title

  • the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

  • related to pluggable or demountable opto-electronic or electronic elements · CPC title

  • comprising air venting holes · CPC title

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Frequently asked questions

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What does patent US10895703B2 cover?
A receptacle includes a cooling channel that is positioned between a top port and a bottom port. A transfer member is positioned in the cooling channel and is configured to direct heat from an inserted plug module into the cooling channel Air flowing through the cooling channel acts to remove thermal energy from the receptacle. A connector system may include a plug module that can be inserted i…
Who is the assignee on this patent?
Molex Llc
What technology area does this patent fall under?
Primary CPC classification G02B6/3897. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 19 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).