Connector with integrated heat sink

US9960525B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9960525-B2
Application numberUS-201715785065-A
CountryUS
Kind codeB2
Filing dateOct 16, 2017
Priority dateNov 8, 2011
Publication dateMay 1, 2018
Grant dateMay 1, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A receptacle connector defines a port. The port is provided with spring fingers that are configured to engage a mating module. The spring fingers are thermally coupled to a heat transfer plate that can be configured to provide part of a cage that defines the port. Fins can be mounted on or integrated into the heat transfer plate. In operation, thermal energy from an inserted module is transferred from the module to spring fingers and then to the heat transfer plate and then to a thermal dissipation system.

First claim

Opening claim text (preview).

We claim: 1. A connector, comprising: a cage that defines a port, the cage configured to be supported by a circuit board; a heat transfer plate with a main wall and a side wall, the side wall extending along a top or a bottom of the port; and a spring finger plate that supports a plurality of spring fingers mounted on the side wall, the spring fingers configured to engage a module inserted into the port in a first direction, the spring fingers configured to translate in a second direction, in operation, when the module is inserted into the port, wherein each spring finger of the plurality of spring fingers is configured to individually contact the module inserted into the port. 2. The connector of claim 1 , further comprising a housing positioned in the cage, the housing including a card slot positioned in the port. 3. The connector of claim 1 , wherein the port is a first port and the cage further defines a second port, the first and second ports being vertically stacked relative to the supporting circuit board, wherein the main wall extends vertically along a first side of each of the first and second ports and the side wall is a first side wall that extends along a second side of the first port, the heat transfer plate further including a second side wall that extends along a third side of the second port. 4. The connector of claim 3 , wherein the spring finger plate is a first spring finger plate and a second spring finger plate is provided on the second side wall. 5. The connector of claim 4 , wherein the first and second side walls are each positioned on the same side of the respective ports. 6. The connector of claim 4 , wherein the main wall extends vertically along both the first and the second port. 7. The connector of claim 1 , wherein the side wall is a first side wall and the spring finger plate is a first spring finger plate, the heat transfer plate further including a second side wall and the second side wall supporting a second spring finger plate. 8. The connector of claim 7 , wherein the first and second spring finger plates each support spring fingers that are configured to deflect in opposing directions when a module is inserted into the port. 9. The connector of claim 1 , wherein the spring fingers are formed in rows. 10. The connector of claim 1 , wherein the plurality of spring fingers each include a tail and the side wall includes a plurality of displacement regions that are configured to receive the tails. 11. The connector of claim 1 , wherein the spring finger plate is soldered to the side wall. 12. The connector of claim 1 , wherein the spring finger plate is attached to the side wall with a thermally conductive adhesive. 13. The connector of claim 1 , wherein the side wall is a first side wall and the heat transfer plate includes a second side wall and the first and second side walls and the main wall form a U-shaped structure. 14. A connector, comprising: a cage that defines a first port and a second port, the first and second ports being vertically stacked; a heat transfer plate that includes a main wall that extends vertically along the first and second ports and that further includes an upper side wall positioned in the first port and a lower side wall positioned in the second port; a first spring plate thermally coupled to the upper side wall, the first spring plate having a plurality of spring fingers; and a second spring plate thermally coupled to the lower side wall, the second spring plate having a plurality of spring fingers. 15. The connector of claim 14 , further comprising a housing positioned in the cage, the housing including a first card slot aligned with the first port and a second card slot aligned with the second port. 16. The connector of claim 14 , wherein the first spring finger plate includes a vertical wall and a retaining leg.

Assignees

Inventors

Classifications

  • Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

  • G02B6/4201Primary

    Packages, e.g. shape, construction, internal or external details · CPC title

  • Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title

  • H01R13/533Primary

    Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure (H01R13/52 takes precedence) · CPC title

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Frequently asked questions

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What does patent US9960525B2 cover?
A receptacle connector defines a port. The port is provided with spring fingers that are configured to engage a mating module. The spring fingers are thermally coupled to a heat transfer plate that can be configured to provide part of a cage that defines the port. Fins can be mounted on or integrated into the heat transfer plate. In operation, thermal energy from an inserted module is transferr…
Who is the assignee on this patent?
Molex Llc
What technology area does this patent fall under?
Primary CPC classification G02B6/4201. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).