Resistor with upper surface heat dissipation
US-10438729-B2 · Oct 8, 2019 · US
Method for manufacturing resistor
US10892074B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10892074-B2 |
| Application number | US-201816771334-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 11, 2018 |
| Priority date | Dec 12, 2017 |
| Publication date | Jan 12, 2021 |
| Grant date | Jan 12, 2021 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for manufacturing a resistor, the method comprising: a step of applying an unhardened and solidified thermally conductive layer onto a surface of a resistive body, the unhardened and solidified thermally conductive layer being a thermally conductive resin film; a step of bringing the thermally conductive resin film into a semi-hardened state; and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive resin film while the bent electrode plates are in contact with the thermally conductive resin film, and performing adhesion between the resistive body and the electrode plates via the thermally conductive resin film. 2. The method for manufacturing a resistor according to claim 1 , wherein the thermally conductive layer is further hardened while pressure is applied to the bent electrode plates.
Assignees
Inventors
Classifications
by resistor foil bonding, e.g. cladding · CPC title
Thick film resistors · CPC title
- H01C1/148Primary
the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title
the resistive element being embedded in insulation with outer enclosing sheath · CPC title
Resistors not provided for elsewhere · CPC title
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Frequently asked questions
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- What does patent US10892074B2 cover?
- An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringin…
- Who is the assignee on this patent?
- Koa Corp
- What technology area does this patent fall under?
- Primary CPC classification H01C1/148. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 12 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).