Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same

Patent metadata

Field	Value
Publication number	US-2016222256-A1
Application number	US-201415021854-A
Country	US
Kind code	A1
Filing date	Sep 24, 2014
Priority date	Sep 25, 2013
Publication date	Aug 4, 2016
Grant date	—

Abstract

The present invention provides a thermally conductive adhesive sheet that can be laminated on an electronic device to efficiently dissipate heat and to selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a base material comprising a high thermally conductive portion and a low thermally conductive portion; and an adhesive layer, wherein the adhesive layer is laminated on one face of the base material, and the other face of the base material is composed of a face of the low thermally conductive portion opposite to a face in contact with the adhesive layer and a face of the high thermally conductive portion opposite to a face in contact with the adhesive layer, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the base material, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

First claim

1 . A thermally conductive adhesive sheet comprising:
a base material comprising a high thermally conductive portion and a low thermally conductive portion, and an adhesive layer, wherein the adhesive layer is laminated on one face of the base material; and the other face of the base material is composed of a face of the low thermally conductive portion opposite to a face in contact with the adhesive layer and a face of the high thermally conductive portion opposite to a face in contact with the adhesive layer, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the base material.

2 . The thermally conductive adhesive sheet according to claim 1 , wherein the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the base material.

3 . The thermally conductive adhesive sheet according to claim 1 , wherein the high thermally conductive portion and the low thermally conductive portion are each formed of a resin composition.

4 . The thermally conductive adhesive sheet according to claim 3 , wherein the resin composition constituting the high thermally conductive portion comprises a thermally conductive filler and/or an electrically conductive carbon compound.

5 . The thermally conductive adhesive sheet according to claim 4 , wherein the thermally conductive filler comprises at least one selected from the group consisting of a metal oxide, a metal nitride, and a metal.

6 . The thermally conductive adhesive sheet according to claim 4 , wherein the thermally conductive filler comprises a metal oxide and a metal nitride.

7 . The thermally conductive adhesive sheet according to claim 4 , wherein the electrically conductive carbon compound comprises at least one selected from the group consisting of carbon black, carbon nanotubes, graphene, and carbon nanofibers.

8 . The thermally conductive adhesive sheet according to claim 1 , wherein a thermal conductivity of the high thermally conductive portion of the base material is 1.0 (W/m·K) or more, and a thermal conductivity of the low thermally conductive portion is less than 0.5 (W/m·K).

9 . The thermally conductive adhesive sheet according to claim 1 , wherein a ratio of a thickness of the adhesive layer to the thickness of the base material (the adhesive layer/the base material) is 0.005 to 1.0.

10 . The thermally conductive adhesive sheet according to claim 1 , wherein the adhesive layer comprises a silicone-based adhesive.

11 . An electronic device on which the thermally conductive adhesive sheet according to claim 1 is laminated.

12 . A method for producing the thermally conductive adhesive sheet according to claim 1 , comprising steps of forming a base material, on a releasable supporting base material, of a high thermally conductive portion formed of a resin composition and a low thermally conductive portion formed of a resin composition; and laminating an adhesive layer on the base material.

Assignees

• Lintec Corp

Inventors

• Kato Kunihisa
• Morita Wataru
• Mutou Tsuyoshi

Classifications

• C08K3/22

  of metals · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C09J2483/00

  Presence of polysiloxane · CPC title

• C09J9/02 Primary

  Electrically-conducting adhesives · CPC title

• C08K2003/385

  Binary compounds of nitrogen with boron · CPC title