Soldering material

Patent metadata

Field	Value
Publication number	US-10888957-B2
Application number	US-201615740484-A
Country	US
Kind code	B2
Filing date	Jun 23, 2016
Priority date	Jun 29, 2015
Publication date	Jan 12, 2021
Grant date	Jan 12, 2021

Abstract

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150° C. with a temperature of 25° C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

First claim

The invention claimed is:

1. A soldering material comprising:
a spherical or cylindrical core that provides a space between a joining object and an object to be joined; and
a covering layer coating the core and comprising Sn or a solder alloy primarily including Sn, wherein the Sn content of the covering layer is equal to or greater than 90 mass %,
the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150° C. set in a room with a temperature of 25° C. and 40% humidity,
the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space,
wherein the core is coated with a layer comprising one or more elements selected from the group consisting of Ni and Co, and is then coated with the covering layer.

2. The soldering material according to claim 1 , wherein the lightness of the soldering material in the L*a*b* color space subsequent to the heating storage test is greater than or equal to 70.2.

3. The soldering material according to claim 1 , wherein the core is a spherical material comprising at least one element selected from the group consisting of Cu, Ni, Ag, Bi, Pb, Al, Sn, Fe, Zn, In, Ge, Sb, Co, Mn, Au, Si, Pt, Cr, La, Mo, Nb, Pd, Ti, Zr, and Mg, or a resin material.

4. The soldering material according to claim 1 , wherein the core is a cylindrical material comprising at least one element selected from the group consisting of Cu, Ni, Ag, Bi, Pb, Al, Sn, Fe, Zn, In, Ge, Sb, Co, Mn, Au, Si, Pt, Cr, La, Mo, Nb, Pd, Ti, Zr, and Mg, or a resin material.

5. A soldering material comprising:
a spherical core that provides a space between a joining object and an object to be joined, wherein the core comprises at least one element selected from the group consisting of Cu, Ni, Ag, Bi, Pb, Al, Sn, Fe, Zn, In, Ge, Sb, Co, Mn, Au, Si, Pt, Cr, La, Mo, Nb, Pd, Ti, Zr, and Mg, or a resin material; and
a covering layer coating the core and comprising Sn or a solder alloy primarily including Sn, wherein the Sn content of the covering layer is equal to or greater than 90 mass %,
the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150° C. set in a room with a temperature of 25° C. and 40% humidity,
the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

6. The soldering material according to claim 5 , wherein the core is coated with a layer comprising one or more elements selected from the group consisting of Ni and Co, and is then coated with the covering layer.

7. The soldering material according to claim 5 , wherein the lightness of the soldering material in the L*a*b* color space subsequent to the heating storage test is greater than or equal to 70.2.

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• Nishino Tomoaki
• Roppongi Takahiro
• Sato Isamu
• Kawamata Yuji

Classifications

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/255

  of outermost layers of multilayered bumps, e.g. material of a coating · CPC title