Arrangement for subsea cooling of semiconductor modules

Patent metadata

Field	Value
Publication number	US-10879150-B2
Application number	US-201715409089-A
Country	US
Kind code	B2
Filing date	Jan 18, 2017
Priority date	Feb 23, 2016
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

An arrangement for subsea cooling of a semiconductor module. The arrangement includes a tank. The tank is filled with a dielectric fluid. The arrangement includes at least one semiconductor module. The at least one semiconductor module is placed in the tank. Each at least one semiconductor module includes semiconductor submodules and is attached to a heat sink. The semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection. The heat sink includes a first part having a first thermal resistance from the semiconductor module to the dielectric fluid. The heat sink includes a second part having a second thermal resistance from the semiconductor module to the dielectric fluid. The second thermal resistance is higher than the first thermal resistance. The heat sink is oriented such that, when the arrangement is installed, the first part is configured to lie vertically higher than the second part.

First claim

The invention claimed is:

1. An arrangement for subsea cooling of a semiconductor module, the arrangement comprising:
a tank, the tank being filled with a dielectric fluid; and
at least one semiconductor module placed in the tank, each of the at least one semiconductor module comprising semiconductor submodules and being attached to a heat sink,
wherein the semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection,
wherein the heat sink comprises a first part having a first thermal resistance from the semiconductor module to the dielectric fluid, and a second part having a second thermal resistance from the semiconductor module to the dielectric fluid,
wherein the second thermal resistance is higher than the first thermal resistance, and
wherein the first part is configured to lie vertically higher than the second part.

2. The arrangement according to claim 1 , wherein the second part comprises a tapered portion.

3. The arrangement according to claim 1 , wherein the second part comprises a recess.

4. The arrangement according to claim 1 , wherein the second part has lower thermal conductivity than the first part.

5. The arrangement according to claim 1 , wherein the heat sink comprises fins, and wherein the fins of the second part are shorter than the fins of the first part.

6. The arrangement according to claim 5 , wherein the fins taper along a direction from the first part to the second part.

7. The arrangement according to claim 5 , wherein the fins are stepwise shorter along a direction from the first part to the second part.

8. The arrangement according to claim 5 , wherein the second part has lower number of fins per area unit than the first part.

9. The arrangement according to claim 1 , wherein the arrangement comprises a plurality of semiconductor modules, all of which are attached to said heat sink.

10. The arrangement according to claim 1 , wherein the semiconductor submodules comprise semiconductor elements, and wherein each semiconductor element comprises diodes and insulated-gate bipolar transistors, IGBTs.

11. The arrangement according to claim 10 , wherein the diodes are configured to positioned vertically higher than the IGBTs in the semiconductor submodules.

12. A method for providing an arrangement for subsea cooling of a semiconductor module, the method comprising:
providing a tank, and filling the tank with a dielectric fluid; and
placing at least one semiconductor module in the tank, each of the at least one semiconductor module comprising semiconductor submodules and being attached to a heat sink,
wherein the semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection,
wherein the heat sink comprises a first part having a first thermal resistance from the semiconductor module to the dielectric fluid, and a second part having a second thermal resistance from the semiconductor module to the dielectric fluid,
wherein the second thermal resistance is higher than the first thermal resistance, and
wherein the first part is configured to lie vertically higher than the second part.

13. The method according to claim 12 , further comprising:
removing material from the second part so as to provide the second part higher thermal resistance than the first part.

14. The method according to claim 12 , further comprising:
installing the tank of the arrangement at a seabed.

15. An arrangement for subsea cooling of a semiconductor module, the arrangement comprising:
a tank filled with a dielectric fluid;
a semiconductor module placed in the tank, the semiconductor module comprising semiconductor submodules; and
at least one heat sink attached to the semiconductor submodules;

wherein the semiconductor submodules generate heat;
wherein the heat sink comprises a first part located vertically higher than a second part;
wherein the second part has a higher thermal resistance than the first part.

Assignees

• Abb Schweiz Ag

Inventors

• Lendenmann Heinz
• Gradinger Thomas
• Wagner Thomas
• Koivuluoma Timo
• Laneryd Tor

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/05

  Providing fillings in containers, e.g. gas filling · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title