Chuck table and processing apparatus including the same

Patent metadata

Field	Value
Publication number	US-10870220-B2
Application number	US-201916295706-A
Country	US
Kind code	B2
Filing date	Mar 7, 2019
Priority date	Mar 8, 2018
Publication date	Dec 22, 2020
Grant date	Dec 22, 2020

Abstract

A chuck table having a holding portion for holding a workpiece and a frame for supporting the holding portion. The holding portion includes a substrate having a plurality of fine holes arranged like a matrix at given intervals and a plurality of acoustic emission sensors arranged like a matrix on the substrate and spaced from each other so that each fine hole of the substrate is located between any adjacent ones of the acoustic emission sensors. The plurality of fine holes are connected through the frame to a vacuum source, thereby holding the workpiece on the acoustic emission sensors under suction. An elastic wave generated from the workpiece in processing the workpiece is collected at a plurality of positions by the plurality of acoustic emission sensors.

First claim

What is claimed is:

1. A chuck table having a holding portion holding a workpiece and a frame supporting the holding portion, the holding portion including:
a substrate having a plurality of fine holes that extend vertically through the substrate and are arranged like a matrix at given intervals; and
a plurality of acoustic emission sensors arranged like a matrix on the substrate and spaced from each other so that each fine hole of the substrate is located between any adjacent ones of the acoustic emission sensors;
the plurality of fine holes being connected through the frame to a vacuum source, thereby holding the workpiece on the acoustic emission sensors under suction;
wherein elastic waves are generated from processing the workpiece and collected at a plurality of positions by the plurality of acoustic emission sensors.

2. The chuck table of claim 1 , further comprising a plurality of clamps provided around a periphery of the holding portion at given intervals.

3. The chuck table of claim 1 , wherein the substrate is disc-shaped.

4. The chuck table of claim 1 , wherein the elastic waves are generated by cutting of the workpiece and spraying of cutting water toward a cutting blade.

5. A chuck table having a holding portion holding a workpiece and a frame supporting the holding portion, the holding portion including:
a substrate having a plurality of fine holes that extend vertically through the substrate; and
a plurality of acoustic emission sensors arranged on an upper surface of the substrate and spaced from each other so that each fine hole of the substrate is located between any adjacent ones of the acoustic emission sensors;
the plurality of fine holes being connected through the frame to a vacuum source, thereby holding the workpiece on the acoustic emission sensors under suction;
wherein elastic waves are generated from processing the workpiece and collected at a plurality of positions by the plurality of acoustic emission sensors.

Assignees

• Disco Corp

Inventors

• Sekiya Kazuma

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P74/20

  characterised by the properties tested or measured, e.g. structural or electrical properties · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title