Semiconductor devices and methods for forming a semiconductor device

Patent metadata

Field	Value
Publication number	US-10867893-B2
Application number	US-201715685880-A
Country	US
Kind code	B2
Filing date	Aug 24, 2017
Priority date	Aug 25, 2016
Publication date	Dec 15, 2020
Grant date	Dec 15, 2020

Abstract

A semiconductor device includes an electrically conductive contact pad structure. Moreover, the semiconductor device includes a bond structure. The bond structure is in contact with the electrically conductive contact pad structure at least at an enclosed interface region. Additionally, the semiconductor device includes a degradation prevention structure laterally surrounding the enclosed interface region. The degradation prevention structure is vertically located between a portion of the bond structure and a portion of the electrically conductive contact pad structure.

First claim

What is claimed is:

1. A semiconductor device comprising:
an electrically conductive contact pad structure;
a bond structure over the electrically conductive contact pad structure and in contact with the electrically conductive contact pad structure at an enclosed interface region; and
a degradation prevention structure laterally surrounding the enclosed interface region, wherein the degradation prevention structure is vertically located between a portion of the bond structure and a portion of the electrically conductive contact pad structure,
wherein the bond structure comprises a bond wire, a solder ball or a solder pillar disposed over the contact pad structure, wherein the semiconductor device comprises a planar upper surface, wherein the contact pad structure and the degradation prevention structure are disposed at and below the planar upper surface of the semiconductor device, and wherein the bond structure is disposed at and above the planar upper surface of the semiconductor device.

2. The semiconductor device according to claim 1 , wherein the electrically conductive contact pad structure comprises a first predominant electrically conductive material, wherein the bond structure comprises a second predominant electrically conductive material different from the first predominant electrically conductive material, wherein at least one of the electrically conductive contact pad structure and the bond structure comprises an intermetallic phase region at the enclosed interface region.

3. The semiconductor device according to claim 1 , wherein a minimal width of the degradation prevention structure is larger than 1 μm.

4. The semiconductor device according to claim 1 , wherein the bond structure is in contact with the electrically conductive contact pad structure additionally at a peripheral interface region.

5. The semiconductor device according to claim 4 , wherein the peripheral interface region laterally surrounds the degradation prevention structure.

6. The semiconductor device according to claim 1 , wherein a maximal lateral extension of the enclosed interface region is smaller than 90% of a maximal lateral extension of an overall interface region between the electrically conductive contact pad structure and the bond structure.

7. The semiconductor device according to claim 1 , wherein a plurality of enclosed interface regions is located between the electrically conductive contact pad structure and the bond structure, wherein each enclosed interface region is laterally surrounded by the degradation prevention structure.

8. The semiconductor device according to claim 1 , wherein a total lateral area of the enclosed interface region or of all enclosed interface regions is larger than 60% of a lateral area of an overall interface region between the electrically conductive contact pad structure and the bond structure.

9. The semiconductor device according to claim 1 , wherein a minimal vertical distance between the degradation prevention structure and a backside surface of the electrically conductive contact pad structure is larger than 100 nm.

10. The semiconductor device according to claim 1 , further comprising a semiconductor package structure, wherein the semiconductor package structure comprises mold material, wherein the enclosed interface region is separated from the mold material by the degradation prevention structure.

11. The semiconductor device according to claim 10 , wherein the mold material of the semiconductor package structure is in contact with a portion of the electrically conductive contact pad structure outside the enclosed interface region and is in contact with the bond structure.

12. The semiconductor device according to claim 1 , wherein the degradation prevention structure comprises a solid dielectric material structure formed on a surface of the electrically conductive contact pad structure.

13. The semiconductor device according to claim 1 , wherein the degradation prevention structure comprises a trench extending into the electrically conductive contact pad structure.

14. The semiconductor device according to claim 13 , wherein the trench is filled with a solid dielectric material, or wherein a cavity is located in the trench.

15. The semiconductor device according to claim 1 , wherein a vertical extension of the degradation prevention structure is larger than 500 nm.

16. The semiconductor device according to claim 1 , wherein the degradation prevention structure comprises an electrically conductive layer, wherein the electrically conductive layer comprises an electrically conductive material different from a material of the electrically conductive contact pad structure and different from a material of the bond structure.

17. The semiconductor device according to claim 16 , wherein a thickness of the electrically conductive layer is smaller than 1 μm.

18. The semiconductor device according to claim 16 , wherein the electrically conductive layer extends laterally from the enclosed interface region to an edge of the electrically conductive contact pad structure.

19. A semiconductor device comprising:
an electrically conductive contact pad structure comprising a first predominant electrically conductive material;
a bond structure comprising a second predominant electrically conductive material different from the first predominant electrically conductive material, wherein at least one of the electrically conductive contact pad structure and the bond structure comprises an intermetallic phase region at an interface region between the electrically conductive contact pad structure and the bond structure; and
a degradation prevention structure located laterally adjacent to the intermetallic phase region, wherein the degradation prevention structure is vertically located between a portion of the bond structure and a portion of the electrically conductive contact pad structure,
wherein the bond structure is over the electrically conductive contact pad structure and comprises a bond wire, a solder ball or a solder pillar disposed over the contact pad structure, wherein the semiconductor device comprises a planar upper surface, wherein the contact pad structure and the degradation prevention structure are disposed at and below the planar upper surface of the semiconductor device, and wherein the bond structure is disposed at and above the planar upper surface of the semiconductor device.

20. A semiconductor device comprising:
a contact pad structure having an upper surface;
a bond structure having a lower surface;
a deposited material structure between the upper surface of the contact pad structure and the lower surface of the bond structure; and
a plurality of degradation prevention structures extending vertically through the deposited material structure;
wherein at least one of the plurality of degradation prevention structures comprises a cavity.

21. The semiconductor device according to claim 20 , wherein the deposited material structure comprises a metal.

22. The semiconductor device according to claim 20 , further comprising a molding material surrounding at least a portion of the bond structure, at least a portion of the deposited material structure, and at least a portion of the contact pad structure.

23. A semiconductor device comprising:
a contact pad structure having an upper surface;
a bond structure having a lower surface;
an interface region between the upper surface of the contact pad structure and the lower surface

Assignees

• Infineon Technologies Ag

Inventors

• Ananiev Sergey
• Bauer Robert
• Koerner Heinrich
• Tan Yik Yee
• Walter Juergen

Classifications

• H10W72/07555

  changes in materials · CPC title

• H10W72/5528

  Intermetallic compounds · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title