Electronic component and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10861625-B2
Application number	US-201916299721-A
Country	US
Kind code	B2
Filing date	Mar 12, 2019
Priority date	Sep 17, 2018
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

First claim

What is claimed is:

1. An electronic component comprising:
a substrate;
a conductor pattern portion disposed on the substrate and extending in a first direction;
a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern portion in the first direction, respectively, and disposed on the conductor pattern portion; and
at least one dummy electrode pattern spaced apart from the first electrode pattern, the conductor pattern portion, and the second electrode pattern, the at least one dummy electrode pattern disposed on the substrate,
wherein a width, in a second direction different from the first direction, of the first electrode pattern is substantially the same as a width, in the second direction, of a first portion of the conductor pattern portion in contact with the first electrode pattern, and
a width, in the second direction, of the second electrode pattern is substantially the same as a width, in the second direction, of a second portion of the conductor pattern portion in contact with the second electrode pattern.

2. The electronic component of claim 1 , wherein the at least one dummy electrode pattern includes:
a first dummy electrode pattern and a second dummy electrode pattern disposed at opposite sides of the first electrode pattern in the second direction and formed on the substrate; and
a third dummy electrode pattern and a fourth dummy electrode pattern disposed at opposite sides of the second electrode pattern in the second direction and formed on the substrate, and
each of the first to fourth dummy electrode patterns is spaced apart from the first electrode pattern, the conductor pattern portion, and the second electrode pattern.

3. The electronic component of claim 2 , wherein each of the first to fourth dummy electrode patterns has two side surfaces flushed with side surfaces of the substrate.

4. The electronic component of claim 2 , wherein the first to fourth dummy electrode patterns are disposed on corners of the substrate, respectively.

5. The electronic component of claim 1 , further comprising a coating film disposed between the substrate and the conductor pattern portion.

6. The electronic component of claim 5 , further comprising particles disposed on the substrate and covered by the coating film.

7. The electronic component of claim 1 , further comprising a first protective film disposed on the conductor pattern portion and having a width which is substantially the same as a width of a portion of the conductor pattern portion between the first and second portions of the conductor pattern portion.

8. The electronic component of claim 7 , wherein the conductor pattern portion includes at least one pattern groove, and
the first protective film includes a pattern groove which is the same as the at least one pattern groove formed in the conductor pattern portion.

9. The electronic component of claim 8 , further comprising a secondary protective film on the first protective film and the at least one pattern groove.

10. A manufacturing method of an electronic component, the manufacturing method comprising:
forming at least one first paste portion extending in a first direction on a substrate;
forming a conductor film on the substrate on which the at least one first paste portion is formed;
converting the conductor film to at least one primary conductor pattern extending in the first direction on the substrate, by removing the at least one first paste portion and portions of the conductor film disposed on the at least one first paste portion;
forming a plurality of primary electrode patterns having at least a portion overlapping the at least one primary conductor pattern;
forming a secondary conductor pattern by removing a portion of each of the plurality of primary conductor patterns; and
forming a first electrode pattern, a second electrode pattern, and at least one dummy electrode pattern disposed at opposite ends of the secondary conductor pattern in the first direction by removing a portion of the plurality of primary electrode patterns.

11. The manufacturing method of claim 10 , wherein the forming of the plurality of primary electrode patterns includes:
forming at least one second paste portion extending in a second direction different from the first direction on the substrate;
forming an electrode film on the substrate on which the at least one primary conductor pattern and the at least one second paste portion are formed; and
converting the electrode film to the plurality of primary electrode patterns, by removing the at least one second paste portion and portions of the electrode film disposed on the at least one second paste portion.

12. The manufacturing method of claim 10 , wherein the at least one first paste portion is formed by a printing method, and
the conductor film is formed by a film sputtering method.

13. The manufacturing method of claim 10 , further comprising, after the forming of the at least one first paste portion and before the forming of the conductor film, forming a coating film on the substrate on which the at least one first paste portion is formed.

14. The manufacturing method of claim 10 ,
wherein the removing the portion of the plurality of primary electrode patterns is performed by a laser process.

15. The manufacturing method of claim 10 , further comprising:
forming third paste portions on the first electrode pattern and the second electrode pattern, respectively;
forming a protective film covering the third paste portions and the secondary conductor pattern having at least one pattern groove; and
removing the third paste portions and portions of the protective film covering the third paste portions, such that the secondary conductor pattern having the at least one pattern groove is covered by the remaining portion of the protective film.

16. The manufacturing method of claim 10 , further comprising:
prior to forming the first electrode pattern, the second electrode pattern, and the at least one dummy electrode pattern, forming a first protective film on a portion between the plurality of primary electrode patterns on the at least one first conductor pattern.

17. The manufacturing method of claim 16 , further comprising forming a conductor pattern portion by forming at least one pattern groove in the secondary conductor pattern.

18. The manufacturing method of claim 17 , further comprising forming a secondary protective film on the primary protective film and a surface of the at least one pattern groove.

19. An electronic component comprising:
a substrate;
a conductor pattern portion disposed on the substrate and extending in a first direction;
a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern portion in the first direction, respectively, and disposed on the conductor pattern portion;
first and second dummy electrode patterns disposed on opposite sides of the first electrode pattern in a second direction different from the first direction; and
third and fourth dummy electrode patterns disposed on opposite sides of the second electrode pattern in the second direction,
wherein the first to fourth dummy electrode patterns and the first and second electrode patterns are made of a same material, and
the first to fourth dummy electrode patterns are disposed on a level lower than that of the first and second electrode patterns with respect to a surface of the substrate on which the conductor pattern portion is disposed.

20

Assignees

• Samsung Electro Mech

Inventors

• Lee Jong Pil
• Tanaka Ichiro
• Yoo Doo Ho
• Choi Hyun Jun
• Kim Hyung Gon
• Roh Hyung Seok
• Kim Jung Il

Classifications

• H01C17/288

  by thin film techniques · CPC title

• H01C7/006 Primary

  Thin film resistors · CPC title

• H01C1/142

  the terminals or tapping points being coated on the resistive element · CPC title

• H01C17/12

  by sputtering · CPC title

• H01C1/012 Primary

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title