Automated test system having orthogonal robots

Patent metadata

Field	Value
Publication number	US-10845410-B2
Application number	US-201715688048-A
Country	US
Kind code	B2
Filing date	Aug 28, 2017
Priority date	Aug 28, 2017
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

An example test system includes a test carrier to hold devices for test; a device shuttle to transport the devices; and a robot to move the devices between the test carrier and the device shuttle. The device shuttle is configured to move, towards a stage of the test system containing the robot, a first device among the devices that has not been tested. The device shuttle is configured to move in a first dimension. The robot is configured to move the first device from the device shuttle to the test carrier. The robot is configured to move in a second dimension that is different from the first dimension.

First claim

What is claimed is:

1. A test system comprising:
a test carrier to hold devices for test in test sockets;
a device shuttle to transport the devices; and
a robot to move the devices between the test carrier and the device shuttle;
wherein the device shuttle is configured to move, towards a stage of the test system containing the robot, a first device among the devices that has not been tested, the device shuttle being configured to move in a first dimension;
wherein the robot is configured to move the first device from the device shuttle into a test socket in the test carrier, the robot being configured to move in a second dimension that is different from the first dimension;
a first camera above the test socket and a second camera below the test socket, the first camera for capturing a first image of the first device by looking down towards the test socket and the second camera for capturing a second image of the first device by looking up towards the test socket; and
one or more processing devices to use the first image and the second image to control the robot to move the first device into the test socket;
wherein the test system comprises multiple stages, the multiple stages comprising robots, the robot being in the stage among the multiple stages;
wherein the first camera and the second camera are in the stage with the robot; and
wherein the one or more processing devices are configured to use the first image and the second image to control the robot in the stage to operate at a greater precision than robots that are parts of other ones of the multiple stages.

2. The test system of claim 1 , wherein the device shuttle is configured to move, away from the stage of the test system containing the robot, a second device among the devices that has been tested; and
wherein the robot is configured to move the second device from the test carrier to the device shuttle.

3. The test system of claim 1 , wherein the robot comprises a component that is movable in a third dimension that is substantially orthogonal to the first dimension and to the second dimension.

4. The test system of claim 1 , wherein the first dimension is substantially orthogonal to the second dimension; and
wherein movement of the shuttle in the first dimension is independent of movement of the robot in the second dimension.

5. The test system of claim 1 , further comprising:
a test rack comprising a test slot to receive the test carrier, the test carrier comprising a configurable interface to connect to first device in the test carrier.

6. The test system of claim 1 , further comprising:
a test rack comprising a test slot to receive the test carrier;
a carrier shuttle configured to transport the test carrier; and
a test arm configured receive the test carrier from the carrier shuttle and to insert the test carrier into the test slot in the test rack, the test arm being configured to move in a third dimension that is orthogonal to the first dimension and the second dimension;
wherein the carrier shuttle is configured to transport the test carrier between a location of the robot and a location of the test arm, the test carrier being movable in the first dimension.

7. The test system of claim 1 , further comprising:
a test rack comprising a test slot to receive the test carrier;
a carrier shuttle configured to transport the test carrier; and
a test arm configured receive the test carrier from the carrier shuttle and to insert the test carrier into the test slot in the test rack, the test arm being configured to move in a third dimension that is orthogonal to the first dimension and the second dimension;
wherein the first dimension and the second dimension are in a first plane, and the third dimension is in a second plane that is orthogonal to the first plane, the devices being movable in the first plane and the devices being testable in the second plane.

8. The test system of claim 7 , wherein the test carrier is a first test carrier;
wherein the system comprises a second test carrier to hold devices for test;
wherein the test arm is configured to remove the second test carrier from the test slot and to place the second test carrier onto the carrier shuttle; and
wherein the carrier shuttle is configured to transport the second test carrier from a location of the test arm to a location of the robot.

9. The test system of claim 8 , wherein the test arm is configured to hold both the first test carrier and the second test carrier simultaneously, the first test carrier being held in a first receptacle on a first side of the test arm and the second test carrier being held in a second receptacle on a second side of the test arm.

10. The test system of claim 9 , further comprising:
an arm configured to pull the second test carrier from the test slot and to push the first test carrier into the test slot;
wherein the test arm is configured to rotate to receive the second test carrier from the test slot, the arm being configured to pull the second test carrier into the second receptacle;
wherein, following receipt of the second test carrier, the test arm is configured to rotate to position the first test carrier for insertion into the test slot; and
wherein, following rotation, the arm is configured to push the first test carrier into the test slot.

11. The test system of claim 10 , wherein the test slot remains occupied during testing except for a time between removal of the second test carrier and insertion of the first test carrier.

12. The test system of claim 10 , wherein the test slot includes internal guides to direct the first test carrier towards electrical contacts inside the test slot.

13. The system of claim 6 , wherein the test arm is configured to receive the test carrier from the carrier shuttle, and to rotate the test carrier to a position to insert the test carrier into the test slot.

14. The system of claim 13 , wherein the test arm is configured to rotate the test carrier about 180° prior to inserting the test carrier into the test slot.

15. The test system of claim 13 , wherein the test arm is configured to flip from a first position to receive the test carrier to a second position adjacent to the test rack, the flip comprising the test arm moving in the third dimension; and
wherein rotation occurs when the test arm is in the second position.

16. The test system of claim 6 , wherein the test carrier is a first test carrier and wherein the test arm comprises a first receptacle on a first side of the test arm and a second receptacle on a second side of the test arm;
wherein the test arm is configured to hold both the first test carrier and a second test carrier at least part of a time, the first test carrier being held in the first receptacle and the second test carrier being held in the second receptacle; and
wherein the test arm is configured to flip from a first position to receive the first test carrier to a second position adjacent to the test rack, the flip comprising the test arm moving in the third dimension.

17. The test system of claim 6 , wherein the test arm is configured to move relative to the test rack to reach the test slot;
wherein the first dimension is substantially horizontal relative to ground; and
wherein the test arm is configured to move vertically relative to ground to reach the test slot.

18. The test system of claim 1 , wherein the device shuttle is configured to transport the devices from a tray location to the robot, the tray location comprising trays containing devices that have been tested and devices that have

Assignees

• Teradyne Inc

Inventors

• Bowyer David Paul
• Pei Jianfa
• Toscano John P
• Campbell Philip
• Smith Marc Lesueur

Classifications

• G01R31/2893 Primary

  Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00) · CPC title

• G01R31/2868 Primary

  Complete testing stations; systems; procedures; software aspects · CPC title

• G01R31/2867

  Handlers or transport devices, e.g. loaders, carriers, trays · CPC title

• G01R1/0433

  Sockets for IC's or transistors · CPC title

• B25J11/00

  Manipulators not otherwise provided for · CPC title