Substrate processing apparatus, substrate processing method and storage medium

Patent metadata

Field	Value
Publication number	US-10840079-B2
Application number	US-201715824274-A
Country	US
Kind code	B2
Filing date	Nov 28, 2017
Priority date	Nov 29, 2016
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.

First claim

What is claimed is:

1. A substrate processing apparatus, comprising:
a first holding part configured to horizontally hold a region not overlapping with a central portion of a back surface of a substrate;
a second holding part configured to horizontally hold the central portion of the back surface of the substrate and to rotate the substrate about a vertical axis;
a sliding member configured to rotate about a vertical axis so that the sliding member slides on the back surface of the substrate to perform processing;
a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis so as to have a revolution radius smaller than a diameter of the sliding member; and
a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on the central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on a peripheral portion of the back surface of the substrate under rotation.

2. The apparatus of claim 1 , further comprising a height regulating part configured to regulate a height of the peripheral portion of the substrate by performing suction of the peripheral portion of the substrate or supply of a fluid to the peripheral portion when the substrate is held by the second holding part.

3. The apparatus of claim 2 , wherein the height regulating part is configured to perform suction with respect to left and right regions of the sliding member when the sliding member is viewed from a center of the substrate under rotation or to perform supply of the fluid with respect to the left and right regions.

4. The apparatus of claim 2 , wherein when the substrate is held by the second holding part, the revolution trajectory of the sliding member is located at a first position near the central portion of the substrate and a second position near the peripheral portion of the substrate, and
a suction pressure in the height regulating part or a flow rate of the fluid supplied to the substrate is larger when the revolution trajectory is located at the second position than when the revolution trajectory is located at the first position.

5. The apparatus of claim 2 , further comprising a control part configured to acquire information on a warp of the substrate as an acquired information and to output a control signal so that a suction pressure in the height regulating part or a flow rate of the fluid supplied to the substrate is adjusted based on the acquired information.

6. The apparatus of claim 1 , wherein when the substrate is held by the first holding part, the revolution of the sliding member is performed so that the revolution axis overlaps with a center of the substrate.

7. The apparatus of claim 1 , wherein when the substrate is held by the second holding part, a value obtained by dividing a larger one of a rotation speed of the substrate and a revolution speed of the sliding member by a smaller one thereof is a value other than an integer.

8. The apparatus of claim 1 , wherein the sliding member is configured by a polishing member for polishing and roughening the back surface of the substrate.

9. The apparatus of claim 8 , further comprising:
a cleaning member configured to rotate about a vertical axis so as to rub and clean a region roughened by the polishing member; and
a cleaning part revolving mechanism configured to revolve the cleaning member under rotation about a vertical revolution axis,
wherein the cleaning member is configured to rub the central portion of the substrate when the substrate is held by the first holding part, and the cleaning member is configured to rub the peripheral portion of the substrate when the substrate is held by the second holding part.

10. The apparatus of claim 1 , further comprising: a pressing mechanism configured to press the substrate from a front surface side of the substrate toward a back surface side thereof so as to suppress deformation of the substrate when the sliding member slides on the substrate.

11. The apparatus of claim 10 , wherein the pressing mechanism includes a pressing member having a pressing surface configured to press the substrate by facing the sliding member across the substrate, and an elevating mechanism configured to raise and lower the pressing member.

12. The apparatus of claim 11 , wherein a cleaning solution discharge hole configured to supply a cleaning solution for cleaning the substrate is provided on the pressing surface, and the pressing surface is configured to press a front surface of the substrate supplied with the cleaning solution.

13. The apparatus of claim 12 , wherein the pressing mechanism includes a horizontal movement mechanism configured to, when the revolution trajectory of the sliding member moves between a central portion side of the substrate and a peripheral portion side of the substrate, move the pressing member between the central portion side of the substrate and the peripheral portion side of the substrate to maintain a state in which the sliding member and the pressing member face each other across the substrate.

14. The apparatus of claim 13 , wherein the pressing surface is made of a porous material having elasticity.

15. The apparatus of claim 14 , wherein the cleaning solution discharge hole provided on the pressing surface is a pore of the porous material, and
the horizontal movement mechanism is configured to move the pressing member pressing the substrate, so that a part of the pressing surface is located outside the substrate so as to clean a side surface of the substrate.

16. The apparatus of claim 11 , wherein the pressing surface is circular, and the diameter of the pressing surface is 10 mm to 100 mm.

17. A substrate processing method, comprising:
horizontally holding, by a first holding part, a region not overlapping with a central portion of a back surface of a substrate;
horizontally holding, by a second holding part, the central portion of the back surface of the substrate and rotating the substrate about a vertical axis;
rotating a sliding member, which is configured to perform processing by sliding on the back surface of the substrate, about a vertical axis;
revolving, by a revolution mechanism, the sliding member under rotation around a vertical revolution axis so as to have a revolution radius smaller than a diameter of the sliding member;
horizontally moving, by a relative movement mechanism, a relative position between the substrate and a revolution trajectory of the sliding member;
revolving the sliding member under rotation so as to slide on the central portion of the back surface of the substrate when the substrate is held by the first holding part; and
revolving the sliding member so as to slide on a peripheral portion of the back surface of the substrate when the substrate is held by the second holding part.

Assignees

• Tokyo Electron Ltd

Inventors

• Takiguchi Yasushi
• Yamamoto Taro
• Okamoto Yoshiki
• Hosaka Hayato
• Kodama Teruhiko
• Kubo Akihiro
• Ozasa Ryuto
• Ariuchi Yuji
• Kimura Shinsuke

Classifications

• H10P90/123

  by grinding or lapping · CPC title

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title