Microelectronic substrate electro processing system

Patent metadata

Field	Value
Publication number	US-10837119-B2
Application number	US-201816013686-A
Country	US
Kind code	B2
Filing date	Jun 20, 2018
Priority date	Apr 29, 2013
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

First claim

The invention claimed is:

1. A chuck assembly comprising:
a chuck plate having an up-facing surface and a bottom surface;
a slot plate having a vertical section attached to the up-facing surface of the chuck plate, and the slot plate having a horizontal section parallel to the up-facing surface, the slot plate having an L-shaped cross section, the slot plate forming a slot between the up-facing surface and the horizontal section of the slot plate, the slot facing a lead-in recess in the chuck plate;
a contact ring on the bottom surface of the chuck plate, with the contact ring having a plurality of contact fingers adapted to contact a workpiece between the contact ring and the chuck plate; and
at least one chuck contact on the chuck plate making electrical contact with the plurality of contact fingers of the contact ring.

2. The chuck assembly of claim 1 further including an annular seal on the contact ring.

3. The chuck assembly of claim 1 further including one or more chuck magnets on or in the chuck plate, and one or more contact ring magnets on or in the contact ring.

4. The chuck assembly of claim 1 further including one or more alignment pins extending up from the up-facing surface of the chuck plate, for aligning the chuck plate with a rotor of an electroplating system.

5. The chuck assembly of claim 1 further including a plurality of electrical chuck contacts extending from the up-facing surface of the chuck plate to the contact ring.

6. The chuck assembly of claim 1 further including one or more ring conductors electrically connecting the at least one chuck contact to the contact ring.

7. A chuck assembly for use in an electroplating system having a rotor, comprising:
a chuck plate having an up-facing surface and a bottom surface;
a contact ring on the bottom surface of the chuck plate, with the contact ring having a plurality of contact fingers adapted to contact a workpiece between the contact ring and the chuck plate;
a slot plate having a vertical section on the up-facing surface of the chuck plate, and the slot plate having a horizontal section parallel to the up-facing surface, the slot plate forming a slot between the up-facing surface and the horizontal section of the slow plate, the slot facing a lead-in recess in the chuck plate, the slot configured to receive a component of the rotor of the electroplating system;
the horizontal section of the slot plate extending across a center of the chuck plate; and
at least one chuck contact on the chuck plate making electrical contact with the plurality of contact fingers of the contact ring.

8. The chuck assembly of claim 7 further including an annular seal on the contact ring.

9. The chuck assembly of claim 8 further including one or more chuck magnets on or in the chuck plate, and one or more contact ring magnets on or in the contact ring.

10. The chuck assembly of claim 8 further including one or more alignment pins extending up from the up-facing surface of the chuck plate, for aligning the chuck plate with the rotor of the electroplating system.

11. The chuck assembly of claim 7 further including a plurality of electrical chuck contacts extending from the up-facing surface of the chuck plate to the contact ring.

12. The chuck assembly of claim 7 further including one or more ring conductors electrically connecting the at least one chuck contact to the contact ring.

13. A chuck assembly comprising:
a chuck plate having an up-facing surface and a bottom surface;
a slot plate having a vertical section attached to the up-facing surface of the chuck plate, and the slot plate having a horizontal section parallel to the up-facing surface, the slot plate forming a slot between the up-facing surface and the horizontal section of the slot plate, the slot facing a lead-in recess in the chuck plate, the slot configured to receive a component of a rotor of a substrate electro-processing system;
a contact ring on the bottom surface of the chuck plate, with the contact ring having a plurality of contact fingers adapted to contact a workpiece between the contact ring and the chuck plate; and
at least one chuck contact on the chuck plate making electrical contact with the plurality of contact fingers of the contact ring.

Assignees

• Applied Materials Inc

Inventors

• Moore Robert B
• Silvetti David
• Wirth Paul
• Harris Randy
• Woodruff Daniel J
• Wilson Gregory J

Classifications

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/7606

  characterised by edge clamping, e.g. clamping ring · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• C25D7/12

  Semiconductors · CPC title