Rigid micro-modules with ILED and light conductor

Patent metadata

Field	Value
Publication number	US-10836200-B2
Application number	US-201816186441-A
Country	US
Kind code	B2
Filing date	Nov 9, 2018
Priority date	Nov 13, 2017
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.

First claim

What is claimed is:

1. A light-emitting module structure, comprising:
a support substrate;
a micro-module disposed on or in the support substrate and extending over only a portion of the support substrate, the micro-module comprising:
a rigid module substrate separate from the support substrate, an inorganic light-emitting diode, a power source, and a control circuit,
wherein the inorganic light-emitting diode, the power source, and the control circuit are each disposed on or in the module substrate, and wherein the control circuit, the power source, and the inorganic light-emitting diode are electrically connected such that the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light, the inorganic light-emitting diode comprising a substrate separate from the module substrate and the support substrate; and

a light conductor disposed on or in the support substrate and in alignment with the micro-module such that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor to a location on the support substrate remote from the micro-module.

2. The light-emitting module structure of claim 1 , wherein the module substrate is a semiconductor substrate and the control circuit is formed at least partially in the module substrate.

3. The light-emitting module structure of claim 1 , wherein at least one of (i) the control circuit is a micro-transfer printed integrated circuit comprising a circuit substrate separate from the module substrate and the support substrate and at least a portion of a fractured or separated tether, (ii) the inorganic light-emitting diode is a micro-transfer printed inorganic light-emitting diode (iLED) comprising an iLED substrate separate from the module substrate and the support substrate and at least a portion of a fractured or separated tether, and (iii) the power source is a micro-transfer printed power source comprising a power source substrate separate from the module and support substrates and at least a portion of a fractured or separated tether.

4. The light-emitting module structure of claim 1 , wherein the power source comprises a solar cell, a piezo-electric structure, or an antenna.

5. The light-emitting module structure of claim 1 , wherein the power source comprises a stack of piezo-electric elements, wherein the piezo-electric elements of the stack are electrically connected in serial.

6. The light-emitting module structure of claim 1 , wherein the micro-module comprises an electrical interconnection circuit that electrically interconnects the power source, the control circuit, and the inorganic light-emitting diode.

7. The light-emitting module structure of claim 1 , wherein the light conductor comprises a reflector and a transparent layer, wherein the transparent layer is disposed adjacent to the reflector in a direction orthogonal to the support substrate.

8. The light-emitting module structure of claim 1 , wherein the light conductor comprises two reflectors and the transparent layer is disposed between two reflectors.

9. The light-emitting module structure of claim 1 , wherein the light conductor comprises a reflector and (i) the reflector is disposed on the support substrate between the support substrate and the micro-module, (ii) the reflector is disposed on the support substrate so that the support substrate is between the reflector and the micro-module, or (iii) the micro-module is disposed between the support substrate and the reflector.

10. The light-emitting module structure of claim 1 , wherein the light conductor comprises one or more light pipes that each receive light from the inorganic light-emitting diode.

11. The light-emitting module structure of claim 1 , wherein the light conductor comprises at least one of one or more diffusers, one or more light leaks, and one or more optical gaps disposed beyond the micro-module at a location on the support substrate remote from the micro-module.

12. The light-emitting module structure of claim 1 , wherein the light conductor extends over only a portion of the support substrate providing optical gaps at the extremity of the light conductor.

13. The light-emitting module structure of claim 1 , wherein the inorganic light-emitting diode is disposed such that the inorganic light-emitting diode emits light through the module substrate.

14. The light-emitting module structure of claim 1 , wherein the inorganic light-emitting diode primarily emits light in a direction away from the module substrate.

15. The light-emitting module structure of claim 1 , wherein the inorganic light-emitting diode is disposed between the module substrate and the support substrate.

16. The light-emitting module structure of claim 1 , wherein the module substrate is disposed between the inorganic light-emitting diode and the support substrate.

17. The light-emitting module structure of claim 1 , wherein the support substrate is flexible.

18. The light-emitting module structure of claim 1 , wherein the support substrate is a security strip.

19. The light-emitting module structure of claim 1 , wherein the inorganic light-emitting diode, the power source, and the control circuit are each disposed on or in a same side of the module substrate.

20. The light-emitting module structure of claim 18 , comprising a security or value document, wherein the security strip is disposed on or in the security or value document.

Assignees

• X Display Company Tech Ltd

Inventors

• Willner Mark
• Cok Ronald S
• Rotzoll Robert R
• Bower Christopher Andrew

Classifications

• H10W90/00

  Package configurations · CPC title

• H02N2/0085

  Leads; Wiring arrangements · CPC title

• H02N2/181

  Circuits; Control arrangements or methods · CPC title

• G02B6/4274

  Electrical aspects (G02B6/4263 and G02B6/4265 take precedence) · CPC title

• B42D25/45

  Associating two or more layers · CPC title